GB202407754D0 - dual magnification camera assembly for a bond test system - Google Patents
dual magnification camera assembly for a bond test systemInfo
- Publication number
- GB202407754D0 GB202407754D0 GBGB2407754.7A GB202407754A GB202407754D0 GB 202407754 D0 GB202407754 D0 GB 202407754D0 GB 202407754 A GB202407754 A GB 202407754A GB 202407754 D0 GB202407754 D0 GB 202407754D0
- Authority
- GB
- United Kingdom
- Prior art keywords
- test system
- camera assembly
- magnification camera
- bond test
- dual magnification
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/84—Systems specially adapted for particular applications
- G01N21/88—Investigating the presence of flaws or contamination
- G01N21/8806—Specially adapted optical and illumination features
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/84—Systems specially adapted for particular applications
- G01N21/88—Investigating the presence of flaws or contamination
- G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
- G01N21/956—Inspecting patterns on the surface of objects
- G01N21/95684—Patterns showing highly reflecting parts, e.g. metallic elements
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N3/00—Investigating strength properties of solid materials by application of mechanical stress
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N3/00—Investigating strength properties of solid materials by application of mechanical stress
- G01N3/08—Investigating strength properties of solid materials by application of mechanical stress by applying steady tensile or compressive forces
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/84—Systems specially adapted for particular applications
- G01N21/88—Investigating the presence of flaws or contamination
- G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
- G01N21/956—Inspecting patterns on the surface of objects
- G01N2021/95638—Inspecting patterns on the surface of objects for PCB's
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/84—Systems specially adapted for particular applications
- G01N21/88—Investigating the presence of flaws or contamination
- G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
- G01N21/956—Inspecting patterns on the surface of objects
- G01N2021/95638—Inspecting patterns on the surface of objects for PCB's
- G01N2021/95646—Soldering
-
- H10P74/203—
Landscapes
- Physics & Mathematics (AREA)
- Health & Medical Sciences (AREA)
- Life Sciences & Earth Sciences (AREA)
- Chemical & Material Sciences (AREA)
- Analytical Chemistry (AREA)
- Biochemistry (AREA)
- General Health & Medical Sciences (AREA)
- General Physics & Mathematics (AREA)
- Immunology (AREA)
- Pathology (AREA)
- Investigating Materials By The Use Of Optical Means Adapted For Particular Applications (AREA)
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| GBGB2407754.7A GB202407754D0 (en) | 2024-05-31 | 2024-05-31 | dual magnification camera assembly for a bond test system |
| PCT/IB2025/055599 WO2025248497A1 (en) | 2024-05-31 | 2025-05-30 | Dual magnification camera assembly for a bond test system |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| GBGB2407754.7A GB202407754D0 (en) | 2024-05-31 | 2024-05-31 | dual magnification camera assembly for a bond test system |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| GB202407754D0 true GB202407754D0 (en) | 2024-07-17 |
Family
ID=91621335
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| GBGB2407754.7A Pending GB202407754D0 (en) | 2024-05-31 | 2024-05-31 | dual magnification camera assembly for a bond test system |
Country Status (2)
| Country | Link |
|---|---|
| GB (1) | GB202407754D0 (en) |
| WO (1) | WO2025248497A1 (en) |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6078387A (en) | 1997-11-20 | 2000-06-20 | Dage Precision Industries, Ltd. | Test apparatus |
| US6310971B1 (en) | 1995-07-03 | 2001-10-30 | Canon Kabushiki Kaisha | Information processing method and apparatus, and storage medium storing medium storing program for practicing this method |
Family Cites Families (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5535006A (en) * | 1992-07-16 | 1996-07-09 | Lockheed Idaho Technologies Company | Method and system for evaluating integrity of adherence of a conductor bond to a mating surface of a substrate |
| US5424838A (en) * | 1993-03-01 | 1995-06-13 | Siu; Bernard | Microelectronics inspection system |
| JP2880355B2 (en) * | 1992-08-20 | 1999-04-05 | キヤノン株式会社 | Wire bonding inspection equipment |
| US20040103726A1 (en) * | 2002-12-02 | 2004-06-03 | Malcolm Cox | Bond test systems with offset shear tool |
| CN102439708B (en) * | 2009-02-06 | 2016-03-02 | 新加坡科技研究局 | Method of inspecting bonding structure of substrate and bonding structure inspection apparatus |
| NL2033393B1 (en) * | 2022-10-25 | 2024-05-14 | Xyztec B V | Bond tester and method for operating a bond tester |
-
2024
- 2024-05-31 GB GBGB2407754.7A patent/GB202407754D0/en active Pending
-
2025
- 2025-05-30 WO PCT/IB2025/055599 patent/WO2025248497A1/en active Pending
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6310971B1 (en) | 1995-07-03 | 2001-10-30 | Canon Kabushiki Kaisha | Information processing method and apparatus, and storage medium storing medium storing program for practicing this method |
| US6078387A (en) | 1997-11-20 | 2000-06-20 | Dage Precision Industries, Ltd. | Test apparatus |
Also Published As
| Publication number | Publication date |
|---|---|
| WO2025248497A1 (en) | 2025-12-04 |
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