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GB202311016D0 - Active-passive immersion cooling system - Google Patents

Active-passive immersion cooling system

Info

Publication number
GB202311016D0
GB202311016D0 GBGB2311016.6A GB202311016A GB202311016D0 GB 202311016 D0 GB202311016 D0 GB 202311016D0 GB 202311016 A GB202311016 A GB 202311016A GB 202311016 D0 GB202311016 D0 GB 202311016D0
Authority
GB
United Kingdom
Prior art keywords
active
cooling system
immersion cooling
passive immersion
passive
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
GBGB2311016.6A
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Submer Technologies SL
Original Assignee
Submer Technologies SL
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Submer Technologies SL filed Critical Submer Technologies SL
Publication of GB202311016D0 publication Critical patent/GB202311016D0/en
Ceased legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20709—Modifications to facilitate cooling, ventilating, or heating for server racks or cabinets; for data centers, e.g. 19-inch computer racks
    • H05K7/20763—Liquid cooling without phase change
    • H05K7/20772—Liquid cooling without phase change within server blades for removing heat from heat source
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20218—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant without phase change in electronic enclosures
    • H05K7/20236—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant without phase change in electronic enclosures by immersion
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20218—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant without phase change in electronic enclosures
    • H05K7/20272—Accessories for moving fluid, for expanding fluid, for connecting fluid conduits, for distributing fluid, for removing gas or for preventing leakage, e.g. pumps, tanks or manifolds
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20709—Modifications to facilitate cooling, ventilating, or heating for server racks or cabinets; for data centers, e.g. 19-inch computer racks
    • H05K7/20763—Liquid cooling without phase change
    • H05K7/20781—Liquid cooling without phase change within cabinets for removing heat from server blades

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Computer Hardware Design (AREA)
  • General Engineering & Computer Science (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
GBGB2311016.6A 2023-06-28 2023-07-19 Active-passive immersion cooling system Ceased GB202311016D0 (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US202363510834P 2023-06-28 2023-06-28

Publications (1)

Publication Number Publication Date
GB202311016D0 true GB202311016D0 (en) 2023-08-30

Family

ID=87758491

Family Applications (1)

Application Number Title Priority Date Filing Date
GBGB2311016.6A Ceased GB202311016D0 (en) 2023-06-28 2023-07-19 Active-passive immersion cooling system

Country Status (2)

Country Link
GB (1) GB202311016D0 (en)
WO (1) WO2025003248A1 (en)

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3236137B2 (en) * 1993-07-30 2001-12-10 富士通株式会社 Semiconductor element cooling device
CN102573398A (en) * 2010-12-28 2012-07-11 鸿富锦精密工业（深圳）有限公司 Radiating device and air guiding cover thereof
CN107911995B (en) * 2017-11-17 2019-08-30 英业达科技有限公司 The passive type fluid drive apparatus of immersion cooling system
TWI750733B (en) * 2020-07-14 2021-12-21 建準電機工業股份有限公司 Immersion cooling device and electronic device including the same
JP7689857B2 (en) * 2021-04-01 2025-06-09 三菱重工業株式会社 Cooling System
TWM634899U (en) * 2022-07-07 2022-12-01 建準電機工業股份有限公司 Electronic apparatus having immersion cooling system
TWI846195B (en) * 2022-12-09 2024-06-21 緯創資通股份有限公司 Immersion cooling device, active heat dissipation module and active flow-guiding module

Also Published As

Publication number Publication date
WO2025003248A1 (en) 2025-01-02

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Legal Events

Date Code Title Description
AT Applications terminated before publication under section 16(1)