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GB202316027D0 - Stabilisation of low melting point solder interfaces - Google Patents

Stabilisation of low melting point solder interfaces

Info

Publication number
GB202316027D0
GB202316027D0 GBGB2316027.8A GB202316027A GB202316027D0 GB 202316027 D0 GB202316027 D0 GB 202316027D0 GB 202316027 A GB202316027 A GB 202316027A GB 202316027 D0 GB202316027 D0 GB 202316027D0
Authority
GB
United Kingdom
Prior art keywords
stabilisation
melting point
low melting
point solder
solder interfaces
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
GBGB2316027.8A
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Tokamak Energy Ltd
Original Assignee
Tokamak Energy Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tokamak Energy Ltd filed Critical Tokamak Energy Ltd
Priority to GBGB2316027.8A priority Critical patent/GB202316027D0/en
Publication of GB202316027D0 publication Critical patent/GB202316027D0/en
Priority to PCT/EP2024/079338 priority patent/WO2025083124A1/en
Ceased legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/24—Selection of soldering or welding materials proper
    • B23K35/26—Selection of soldering or welding materials proper with the principal constituent melting at less than 400 degrees C
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K1/00—Soldering, e.g. brazing, or unsoldering
    • B23K1/0008—Soldering, e.g. brazing, or unsoldering specially adapted for particular articles or work
    • B23K1/0016—Brazing of electronic components
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C28/00—Alloys based on a metal not provided for in groups C22C5/00 - C22C27/00
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2101/00—Articles made by soldering, welding or cutting
    • B23K2101/36—Electric or electronic devices
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2101/00—Articles made by soldering, welding or cutting
    • B23K2101/36—Electric or electronic devices
    • B23K2101/42—Printed circuits

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
GBGB2316027.8A 2023-10-19 2023-10-19 Stabilisation of low melting point solder interfaces Ceased GB202316027D0 (en)

Priority Applications (2)

Application Number Priority Date Filing Date Title
GBGB2316027.8A GB202316027D0 (en) 2023-10-19 2023-10-19 Stabilisation of low melting point solder interfaces
PCT/EP2024/079338 WO2025083124A1 (en) 2023-10-19 2024-10-17 Stabilisation of low melting point solder interfaces

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
GBGB2316027.8A GB202316027D0 (en) 2023-10-19 2023-10-19 Stabilisation of low melting point solder interfaces

Publications (1)

Publication Number Publication Date
GB202316027D0 true GB202316027D0 (en) 2023-12-06

Family

ID=88970118

Family Applications (1)

Application Number Title Priority Date Filing Date
GBGB2316027.8A Ceased GB202316027D0 (en) 2023-10-19 2023-10-19 Stabilisation of low melting point solder interfaces

Country Status (2)

Country Link
GB (1) GB202316027D0 (en)
WO (1) WO2025083124A1 (en)

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2008118127A1 (en) * 2006-07-21 2008-10-02 American Superconductor Corporation Low resistance splice for high temperature superconductor wires
US8348139B2 (en) * 2010-03-09 2013-01-08 Indium Corporation Composite solder alloy preform

Also Published As

Publication number Publication date
WO2025083124A1 (en) 2025-04-24

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Legal Events

Date Code Title Description
AT Applications terminated before publication under section 16(1)