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GB202005541D0 - Method and apparatus for performing laser ablation - Google Patents

Method and apparatus for performing laser ablation

Info

Publication number
GB202005541D0
GB202005541D0 GBGB2005541.4A GB202005541A GB202005541D0 GB 202005541 D0 GB202005541 D0 GB 202005541D0 GB 202005541 A GB202005541 A GB 202005541A GB 202005541 D0 GB202005541 D0 GB 202005541D0
Authority
GB
United Kingdom
Prior art keywords
laser ablation
performing laser
ablation
laser
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
GBGB2005541.4A
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
M Solv Ltd
Original Assignee
M Solv Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by M Solv Ltd filed Critical M Solv Ltd
Priority to GBGB2005541.4A priority Critical patent/GB202005541D0/en
Publication of GB202005541D0 publication Critical patent/GB202005541D0/en
Priority to TW110113383A priority patent/TWI890775B/en
Priority to CN202110407590.XA priority patent/CN113523579A/en
Ceased legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/362—Laser etching
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/064—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms
    • B23K26/0648—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms comprising lenses
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/60—Preliminary treatment
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/70—Auxiliary operations or equipment

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Plasma & Fusion (AREA)
  • Mechanical Engineering (AREA)
  • Laser Beam Processing (AREA)
  • Electroluminescent Light Sources (AREA)
GBGB2005541.4A 2020-04-16 2020-04-16 Method and apparatus for performing laser ablation Ceased GB202005541D0 (en)

Priority Applications (3)

Application Number Priority Date Filing Date Title
GBGB2005541.4A GB202005541D0 (en) 2020-04-16 2020-04-16 Method and apparatus for performing laser ablation
TW110113383A TWI890775B (en) 2020-04-16 2021-04-14 Method and apparatus of performing laser ablation and method of depositing organic light emitting molecules
CN202110407590.XA CN113523579A (en) 2020-04-16 2021-04-15 Method and apparatus for laser ablation

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
GBGB2005541.4A GB202005541D0 (en) 2020-04-16 2020-04-16 Method and apparatus for performing laser ablation

Publications (1)

Publication Number Publication Date
GB202005541D0 true GB202005541D0 (en) 2020-06-03

Family

ID=70860194

Family Applications (1)

Application Number Title Priority Date Filing Date
GBGB2005541.4A Ceased GB202005541D0 (en) 2020-04-16 2020-04-16 Method and apparatus for performing laser ablation

Country Status (3)

Country Link
CN (1) CN113523579A (en)
GB (1) GB202005541D0 (en)
TW (1) TWI890775B (en)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2024002050A (en) * 2022-06-23 2024-01-11 株式会社オーク製作所 Ablation processing method, laser processing equipment and mask for ablation processing
CN117066709B (en) * 2023-06-26 2024-05-28 西南石油大学 A process for laser cutting medium-thick and thicker steel without auxiliary air blowing
CN117001168A (en) * 2023-07-31 2023-11-07 伊欧激光科技（苏州）有限公司 A laser processing method for multi-layer film cross-section structures or multi-layer composite material substrates

Family Cites Families (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5841099A (en) * 1994-07-18 1998-11-24 Electro Scientific Industries, Inc. Method employing UV laser pulses of varied energy density to form depthwise self-limiting blind vias in multilayered targets
TW482705B (en) * 1999-05-28 2002-04-11 Electro Scient Ind Inc Beam shaping and projection imaging with solid state UV Gaussian beam to form blind vias
SG90732A1 (en) * 1999-06-30 2002-08-20 Canon Kk Laser processing method, method for manufacturing ink jet recording head using such method of manufacture, and ink jet recording head manufactured by such method of manufacture
US6555783B2 (en) * 2000-02-03 2003-04-29 Canon Kabushiki Kaisha Laser processing method and laser processing apparatus
NL1016735C2 (en) * 2000-11-29 2002-05-31 Ocu Technologies B V Method for forming a nozzle in a member for an inkjet printhead, a nozzle member, an inkjet printhead provided with this nozzle member and an inkjet printer provided with such a printhead.
US7880117B2 (en) * 2002-12-24 2011-02-01 Panasonic Corporation Method and apparatus of drilling high density submicron cavities using parallel laser beams
JP2004230458A (en) * 2003-01-31 2004-08-19 Fujitsu Hitachi Plasma Display Ltd Laser beam machining device
GB2438600B (en) * 2006-05-19 2008-07-09 Exitech Ltd Method for patterning thin films on moving substrates
GB2438601B (en) * 2006-05-24 2008-04-09 Exitech Ltd Method and unit for micro-structuring a moving substrate
GB0804955D0 (en) * 2008-03-18 2008-04-16 Rumsby Philip T Method and apparatus for laser processing the surface of a drum
TWI523720B (en) * 2009-05-28 2016-03-01 伊雷克托科學工業股份有限公司 Acousto-optic deflector applications in laser processing of features in a workpiece, and related laser processing method
KR101182235B1 (en) * 2009-12-14 2012-09-12 삼성디스플레이 주식회사 Mask for evaporation, manufacturing method and manufacturing apparatus for the same
GB2507542B (en) * 2012-11-02 2016-01-13 M Solv Ltd Apparatus and Method for forming fine scale structures in the surface of a substrate to different depths
JP6536941B2 (en) * 2015-04-02 2019-07-03 大日本印刷株式会社 Deposition mask manufacturing method
KR102402998B1 (en) * 2017-05-22 2022-05-30 삼성디스플레이 주식회사 Deposition mask manufacturing method and manufacturing apparatus thereof

Also Published As

Publication number Publication date
TWI890775B (en) 2025-07-21
CN113523579A (en) 2021-10-22
TW202140821A (en) 2021-11-01

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Legal Events

Date Code Title Description
AT Applications terminated before publication under section 16(1)