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GB201322904D0 - An apparatus and associated methods for flexible carrier substrates - Google Patents

An apparatus and associated methods for flexible carrier substrates

Info

Publication number
GB201322904D0
GB201322904D0 GBGB1322904.2A GB201322904A GB201322904D0 GB 201322904 D0 GB201322904 D0 GB 201322904D0 GB 201322904 A GB201322904 A GB 201322904A GB 201322904 D0 GB201322904 D0 GB 201322904D0
Authority
GB
United Kingdom
Prior art keywords
associated methods
flexible carrier
carrier substrates
substrates
flexible
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
GBGB1322904.2A
Other versions
GB2521619A (en
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nokia Technologies Oy
Original Assignee
Nokia Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nokia Inc filed Critical Nokia Inc
Priority to GB1322904.2A priority Critical patent/GB2521619A/en
Publication of GB201322904D0 publication Critical patent/GB201322904D0/en
Publication of GB2521619A publication Critical patent/GB2521619A/en
Withdrawn legal-status Critical Current

Links

Classifications

    • H10W72/00—
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/189—Printed circuits structurally associated with non-printed electric components characterised by the use of a flexible or folded printed circuit
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/325—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by abutting or pinching, i.e. without alloying process; mechanical auxiliary parts therefor
    • H05K3/326—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by abutting or pinching, i.e. without alloying process; mechanical auxiliary parts therefor the printed circuit having integral resilient or deformable parts, e.g. tabs or parts of flexible circuits
    • H10W70/093—
    • H10W70/644—
    • H10W70/688—
    • H10W90/701—
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0277—Bendability or stretchability details
    • H05K1/0283—Stretchable printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/182—Printed circuits structurally associated with non-printed electric components associated with components mounted in the printed circuit board, e.g. insert mounted components [IMC]
    • H05K1/183—Components mounted in and supported by recessed areas of the printed circuit board
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0104—Properties and characteristics in general
    • H05K2201/0133—Elastomeric or compliant polymer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10151—Sensor
    • H10W70/60—
    • H10W70/6523—
    • H10W70/68—
    • H10W70/682—
    • H10W90/00—

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Metallurgy (AREA)
  • Manufacturing & Machinery (AREA)
  • Structure Of Printed Boards (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
GB1322904.2A 2013-12-23 2013-12-23 An apparatus and associated methods for flexible carrier substrates Withdrawn GB2521619A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
GB1322904.2A GB2521619A (en) 2013-12-23 2013-12-23 An apparatus and associated methods for flexible carrier substrates

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
GB1322904.2A GB2521619A (en) 2013-12-23 2013-12-23 An apparatus and associated methods for flexible carrier substrates

Publications (2)

Publication Number Publication Date
GB201322904D0 true GB201322904D0 (en) 2014-02-12
GB2521619A GB2521619A (en) 2015-07-01

Family

ID=50114668

Family Applications (1)

Application Number Title Priority Date Filing Date
GB1322904.2A Withdrawn GB2521619A (en) 2013-12-23 2013-12-23 An apparatus and associated methods for flexible carrier substrates

Country Status (1)

Country Link
GB (1) GB2521619A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN109130496A (en) * 2018-08-21 2019-01-04 嘉兴学院 A kind of method and apparatus preparing flexible extending multilevel structure interconnection line
CN113321177A (en) * 2021-05-28 2021-08-31 北京京东方技术开发有限公司 Flexible MEMS device and electronic equipment

Families Citing this family (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP3317896B1 (en) * 2015-07-02 2025-05-07 Lumileds LLC A surface mount device and a method of attaching such a device
US11211305B2 (en) 2016-04-01 2021-12-28 Texas Instruments Incorporated Apparatus and method to support thermal management of semiconductor-based components
US10861796B2 (en) * 2016-05-10 2020-12-08 Texas Instruments Incorporated Floating die package
US10179730B2 (en) 2016-12-08 2019-01-15 Texas Instruments Incorporated Electronic sensors with sensor die in package structure cavity
US10411150B2 (en) 2016-12-30 2019-09-10 Texas Instruments Incorporated Optical isolation systems and circuits and photon detectors with extended lateral P-N junctions
US10074639B2 (en) 2016-12-30 2018-09-11 Texas Instruments Incorporated Isolator integrated circuits with package structure cavity and fabrication methods
US9929110B1 (en) 2016-12-30 2018-03-27 Texas Instruments Incorporated Integrated circuit wave device and method
US10355371B2 (en) * 2017-03-03 2019-07-16 Microsoft Technology Licensing, Llc Flexible conductive bonding
US10121847B2 (en) 2017-03-17 2018-11-06 Texas Instruments Incorporated Galvanic isolation device
CN112912243A (en) * 2018-07-16 2021-06-04 维纳米技术公司 Method and system for improving connectivity of integrated components embedded in a host structure
CN109704268A (en) * 2019-02-21 2019-05-03 厦门大学 A Stretchable Electron Interference Deformation Immune Substrate
EP3751626A1 (en) * 2019-06-11 2020-12-16 ZKW Group GmbH Electronic module and method for producing at least one electrical connection to an electronic module
DE102020216191A1 (en) 2020-12-17 2022-06-23 Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung eingetragener Verein Method of making a flexible electrical conductor and flexible electrical conductors
CN116916851A (en) * 2021-03-05 2023-10-20 圣犹达医疗用品心脏病学部门有限公司 Flexible electronic circuits for ultrasound catheters
GB2633780A (en) * 2023-09-20 2025-03-26 Pragmatic Semiconductor Ltd Integrated circuit
US20250372904A1 (en) * 2024-05-31 2025-12-04 Daniel Hines 3d printed bridges for printed interconnects

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4026759A (en) * 1975-12-11 1977-05-31 International Business Machines Corporation Method of making ingrown lead frame with strain relief
US4873123A (en) * 1986-10-06 1989-10-10 International Business Machines Corporation Flexible electrical connection and method of making same
JP2770485B2 (en) * 1989-10-11 1998-07-02 東レ株式会社 Circuit board
US6295729B1 (en) * 1992-10-19 2001-10-02 International Business Machines Corporation Angled flying lead wire bonding process
US6313402B1 (en) * 1997-10-29 2001-11-06 Packard Hughes Interconnect Company Stress relief bend useful in an integrated circuit redistribution patch
JP4923402B2 (en) * 2004-11-19 2012-04-25 富士通株式会社 Optical module and electrical wiring board
TWI723953B (en) * 2008-03-05 2021-04-11 美國伊利諾大學理事會 Stretchable and foldable electronic devices

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN109130496A (en) * 2018-08-21 2019-01-04 嘉兴学院 A kind of method and apparatus preparing flexible extending multilevel structure interconnection line
CN109130496B (en) * 2018-08-21 2023-12-01 嘉兴学院 A method and equipment for preparing flexible and ductile multi-level structural interconnection lines
CN113321177A (en) * 2021-05-28 2021-08-31 北京京东方技术开发有限公司 Flexible MEMS device and electronic equipment
CN113321177B (en) * 2021-05-28 2023-03-10 北京京东方技术开发有限公司 Flexible MEMS device and electronic equipment

Also Published As

Publication number Publication date
GB2521619A (en) 2015-07-01

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Legal Events

Date Code Title Description
COOA Change in applicant's name or ownership of the application

Owner name: NOKIA TECHNOLOGIES OY

Free format text: FORMER OWNER: NOKIA CORPORATION

WAP Application withdrawn, taken to be withdrawn or refused ** after publication under section 16(1)