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GB201303655D0 - A module for cooling one or more heat generating components - Google Patents

A module for cooling one or more heat generating components

Info

Publication number
GB201303655D0
GB201303655D0 GBGB1303655.3A GB201303655A GB201303655D0 GB 201303655 D0 GB201303655 D0 GB 201303655D0 GB 201303655 A GB201303655 A GB 201303655A GB 201303655 D0 GB201303655 D0 GB 201303655D0
Authority
GB
United Kingdom
Prior art keywords
cooling
module
heat generating
generating components
components
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
GBGB1303655.3A
Other versions
GB2511354A (en
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Iceotope Ltd
Original Assignee
Iceotope Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Iceotope Ltd filed Critical Iceotope Ltd
Priority to GB1303655.3A priority Critical patent/GB2511354A/en
Publication of GB201303655D0 publication Critical patent/GB201303655D0/en
Priority to PCT/GB2014/050615 priority patent/WO2014132085A1/en
Publication of GB2511354A publication Critical patent/GB2511354A/en
Withdrawn legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20709—Modifications to facilitate cooling, ventilating, or heating for server racks or cabinets; for data centers, e.g. 19-inch computer racks
    • H05K7/208—Liquid cooling with phase change
    • H05K7/20809—Liquid cooling with phase change within server blades for removing heat from heat source
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
    • H05K7/20436—Inner thermal coupling elements in heat dissipating housings, e.g. protrusions or depressions integrally formed in the housing
    • H05K7/20445—Inner thermal coupling elements in heat dissipating housings, e.g. protrusions or depressions integrally formed in the housing the coupling element being an additional piece, e.g. thermal standoff
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/0233—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes the conduits having a particular shape, e.g. non-circular cross-section, annular
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/04—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with tubes having a capillary structure
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/16—Constructional details or arrangements
    • G06F1/20—Cooling means
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2029—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant with phase change in electronic enclosures
    • H05K7/203—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant with phase change in electronic enclosures by immersion
    • H10W40/25—
    • H10W40/70—
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D2015/0216—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes having particular orientation, e.g. slanted, or being orientation-independent

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • General Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Sustainable Development (AREA)
  • Theoretical Computer Science (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Mechanical Engineering (AREA)
  • General Physics & Mathematics (AREA)
  • Human Computer Interaction (AREA)
  • Computer Hardware Design (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
GB1303655.3A 2013-03-01 2013-03-01 A module for cooling one or more heat generating components Withdrawn GB2511354A (en)

Priority Applications (2)

Application Number Priority Date Filing Date Title
GB1303655.3A GB2511354A (en) 2013-03-01 2013-03-01 A module for cooling one or more heat generating components
PCT/GB2014/050615 WO2014132085A1 (en) 2013-03-01 2014-03-03 A module for cooling one or more heat generating components

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
GB1303655.3A GB2511354A (en) 2013-03-01 2013-03-01 A module for cooling one or more heat generating components

Publications (2)

Publication Number Publication Date
GB201303655D0 true GB201303655D0 (en) 2013-04-17
GB2511354A GB2511354A (en) 2014-09-03

Family

ID=48142232

Family Applications (1)

Application Number Title Priority Date Filing Date
GB1303655.3A Withdrawn GB2511354A (en) 2013-03-01 2013-03-01 A module for cooling one or more heat generating components

Country Status (2)

Country Link
GB (1) GB2511354A (en)
WO (1) WO2014132085A1 (en)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2542844B (en) * 2015-10-01 2021-06-16 Iceotope Group Ltd An immersion cooling system
GB2558204A (en) * 2016-11-25 2018-07-11 Iceotope Ltd I/O Circuit board for immersion-cooled electronics
CN109210640A (en) * 2018-09-11 2019-01-15 珠海格力电器股份有限公司 Heat radiator and air conditioner using the same
US11612081B2 (en) * 2021-08-23 2023-03-21 Baidu Usa Llc Two phase containment system having controlled air flow
CN115776799A (en) * 2021-09-07 2023-03-10 英业达科技有限公司 Heat dissipation system and electronic device
US12178005B1 (en) 2023-06-01 2024-12-24 MTS IP Holdings Ltd Boiler enhancement coatings with active boiling management

Family Cites Families (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3512582A (en) * 1968-07-15 1970-05-19 Ibm Immersion cooling system for modularly packaged components
FR2337483A1 (en) * 1975-12-31 1977-07-29 Europ Composants Electron COMPONENTS WITH HIGH PERMISSIBLE DISSIPATING POWER BY HEAT TRANSFER
US4833567A (en) * 1986-05-30 1989-05-23 Digital Equipment Corporation Integral heat pipe module
EP0456508A3 (en) * 1990-05-11 1993-01-20 Fujitsu Limited Immersion cooling coolant and electronic device using this coolant
US8462508B2 (en) * 2007-04-30 2013-06-11 Hewlett-Packard Development Company, L.P. Heat sink with surface-formed vapor chamber base
US7907409B2 (en) * 2008-03-25 2011-03-15 Raytheon Company Systems and methods for cooling a computing component in a computing rack
US7768783B1 (en) * 2009-06-16 2010-08-03 Microsoft Corporation Electronic module cooling
CN102003903B (en) * 2009-08-31 2013-07-03 富准精密工业(深圳)有限公司 Heat pipe and heat-radiating device using same
JP2012132661A (en) * 2010-12-01 2012-07-12 Fujitsu Ltd Cooling device and electronic device
FR2971114B1 (en) * 2011-01-28 2013-02-15 Peugeot Citroen Automobiles Sa COOLING DEVICE FOR ELECTRONIC POWER SYSTEM IN A VEHICLE
CN102693949A (en) * 2011-03-22 2012-09-26 富准精密工业(深圳)有限公司 Heat spreader
CN102811589A (en) * 2011-05-31 2012-12-05 富准精密工业(深圳)有限公司 Electronic device
TWI524046B (en) * 2011-08-17 2016-03-01 奇鋐科技股份有限公司 Fixed structure of heat dissipating component
JP5906607B2 (en) * 2011-08-17 2016-04-20 富士通株式会社 Loop heat pipe and electronic device provided with the loop heat pipe
US9095942B2 (en) * 2012-09-26 2015-08-04 International Business Machines Corporation Wicking and coupling element(s) facilitating evaporative cooling of component(s)

Also Published As

Publication number Publication date
GB2511354A (en) 2014-09-03
WO2014132085A1 (en) 2014-09-04

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Legal Events

Date Code Title Description
WAP Application withdrawn, taken to be withdrawn or refused ** after publication under section 16(1)