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GB2013027A - Integrated circuit packages - Google Patents

Integrated circuit packages

Info

Publication number
GB2013027A
GB2013027A GB796716A GB7906716A GB2013027A GB 2013027 A GB2013027 A GB 2013027A GB 796716 A GB796716 A GB 796716A GB 7906716 A GB7906716 A GB 7906716A GB 2013027 A GB2013027 A GB 2013027A
Authority
GB
United Kingdom
Prior art keywords
chip
frame
recess
base
integrated circuit
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
GB796716A
Other versions
GB2013027B (en
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fujitsu Services Ltd
Original Assignee
Fujitsu Services Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fujitsu Services Ltd filed Critical Fujitsu Services Ltd
Priority to GB796716A priority Critical patent/GB2013027B/en
Publication of GB2013027A publication Critical patent/GB2013027A/en
Application granted granted Critical
Publication of GB2013027B publication Critical patent/GB2013027B/en
Expired legal-status Critical Current

Links

Classifications

    • H10W99/00—
    • H10W70/60—
    • H10W70/6875—
    • H10W76/60—

Landscapes

  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)

Abstract

A large scale integrated circuit package (1) includes a base or substrate section (2) and a lid structure (3) of thermally conductive material to which the chip or die 12 of the package is mounted. The lid 3 comprises a ceramic frame (11) defining a recess 5 for the chip and a metal plate 10. The frame 11 carries conductive tracks (14) which are coupled to the connector pads (15) of the chip or die 12. The base (2) has a recess (5) which accommodate the chip and frame and which is closed by the lid structure. The base of the recess is provided with conductive tracks (7) which co-operate with those on the frame. The electrical connections between the two sets of tracks is formed by thermo-compression techniques, which compress balls (18) of conductive material. <IMAGE>
GB796716A 1978-01-19 1979-02-26 Integrated circuit packages Expired GB2013027B (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
GB796716A GB2013027B (en) 1978-01-19 1979-02-26 Integrated circuit packages

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
GB216978 1978-01-19
GB796716A GB2013027B (en) 1978-01-19 1979-02-26 Integrated circuit packages

Publications (2)

Publication Number Publication Date
GB2013027A true GB2013027A (en) 1979-08-01
GB2013027B GB2013027B (en) 1982-09-22

Family

ID=26237332

Family Applications (1)

Application Number Title Priority Date Filing Date
GB796716A Expired GB2013027B (en) 1978-01-19 1979-02-26 Integrated circuit packages

Country Status (1)

Country Link
GB (1) GB2013027B (en)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2136205A (en) * 1983-03-09 1984-09-12 Printed Circuits Int Semiconductor chip carrier and contact array package and method of construction
EP0081419A3 (en) * 1981-12-03 1985-05-15 FAIRCHILD CAMERA &amp; INSTRUMENT CORPORATION High lead count hermetic mass bond integrated circuit carrier
FR2596608A1 (en) * 1986-03-25 1987-10-02 Western Digital Corp MECHANICAL MOUNTING AND PROTECTION STRUCTURE FOR AN INTEGRATED CIRCUIT CHIP
GB2247104A (en) * 1990-08-15 1992-02-19 Emi Plc Thorn Connections for semiconductor chips
GB2393326A (en) * 2002-09-21 2004-03-24 Hewlett Packard Co Shielding electronic devices from electromagnetic radiation

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0081419A3 (en) * 1981-12-03 1985-05-15 FAIRCHILD CAMERA &amp; INSTRUMENT CORPORATION High lead count hermetic mass bond integrated circuit carrier
GB2136205A (en) * 1983-03-09 1984-09-12 Printed Circuits Int Semiconductor chip carrier and contact array package and method of construction
US4630172A (en) * 1983-03-09 1986-12-16 Printed Circuits International Semiconductor chip carrier package with a heat sink
FR2596608A1 (en) * 1986-03-25 1987-10-02 Western Digital Corp MECHANICAL MOUNTING AND PROTECTION STRUCTURE FOR AN INTEGRATED CIRCUIT CHIP
GB2247104A (en) * 1990-08-15 1992-02-19 Emi Plc Thorn Connections for semiconductor chips
GB2393326A (en) * 2002-09-21 2004-03-24 Hewlett Packard Co Shielding electronic devices from electromagnetic radiation

Also Published As

Publication number Publication date
GB2013027B (en) 1982-09-22

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Legal Events

Date Code Title Description
PCNP Patent ceased through non-payment of renewal fee

Effective date: 19930226