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GB201005889D0 - Tuning of mechanical properties of polymers - Google Patents

Tuning of mechanical properties of polymers

Info

Publication number
GB201005889D0
GB201005889D0 GBGB1005889.9A GB201005889A GB201005889D0 GB 201005889 D0 GB201005889 D0 GB 201005889D0 GB 201005889 A GB201005889 A GB 201005889A GB 201005889 D0 GB201005889 D0 GB 201005889D0
Authority
GB
United Kingdom
Prior art keywords
tuning
polymers
mechanical properties
properties
mechanical
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
GBGB1005889.9A
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Cambridge Enterprise Ltd
Original Assignee
Cambridge Enterprise Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Cambridge Enterprise Ltd filed Critical Cambridge Enterprise Ltd
Priority to GBGB1005889.9A priority Critical patent/GB201005889D0/en
Publication of GB201005889D0 publication Critical patent/GB201005889D0/en
Priority to PCT/GB2011/000552 priority patent/WO2011124898A1/en
Ceased legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J3/00—Processes of treating or compounding macromolecular substances
    • C08J3/28—Treatment by wave energy or particle radiation
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
    • C08L83/04—Polysiloxanes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0277—Bendability or stretchability details
    • H05K1/0283—Stretchable printed circuits
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04—Polysiloxanes
    • C08G77/20—Polysiloxanes containing silicon bound to unsaturated aliphatic groups
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J2383/00—Characterised by the use of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen, or carbon only; Derivatives of such polymers
    • C08J2383/04—Polysiloxanes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0183—Dielectric layers
    • H05K2201/0187—Dielectric layers with regions of different dielectrics in the same layer, e.g. in a printed capacitor for locally changing the dielectric properties

Landscapes

  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacture Of Macromolecular Shaped Articles (AREA)
GBGB1005889.9A 2010-04-08 2010-04-08 Tuning of mechanical properties of polymers Ceased GB201005889D0 (en)

Priority Applications (2)

Application Number Priority Date Filing Date Title
GBGB1005889.9A GB201005889D0 (en) 2010-04-08 2010-04-08 Tuning of mechanical properties of polymers
PCT/GB2011/000552 WO2011124898A1 (en) 2010-04-08 2011-04-08 Elastically deformable sheet with regions of different elastic modulus for stretchable electronics

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
GBGB1005889.9A GB201005889D0 (en) 2010-04-08 2010-04-08 Tuning of mechanical properties of polymers

Publications (1)

Publication Number Publication Date
GB201005889D0 true GB201005889D0 (en) 2010-05-26

Family

ID=42236030

Family Applications (1)

Application Number Title Priority Date Filing Date
GBGB1005889.9A Ceased GB201005889D0 (en) 2010-04-08 2010-04-08 Tuning of mechanical properties of polymers

Country Status (2)

Country Link
GB (1) GB201005889D0 (en)
WO (1) WO2011124898A1 (en)

Families Citing this family (26)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9123614B2 (en) 2008-10-07 2015-09-01 Mc10, Inc. Methods and applications of non-planar imaging arrays
US8097926B2 (en) 2008-10-07 2012-01-17 Mc10, Inc. Systems, methods, and devices having stretchable integrated circuitry for sensing and delivering therapy
US8389862B2 (en) 2008-10-07 2013-03-05 Mc10, Inc. Extremely stretchable electronics
US9226402B2 (en) * 2012-06-11 2015-12-29 Mc10, Inc. Strain isolation structures for stretchable electronics
JP2016500869A (en) 2012-10-09 2016-01-14 エムシー１０ インコーポレイテッドＭｃ１０，Ｉｎｃ． Conformal electronic circuit integrated with clothing
US9171794B2 (en) 2012-10-09 2015-10-27 Mc10, Inc. Embedding thin chips in polymer
US9706647B2 (en) 2013-05-14 2017-07-11 Mc10, Inc. Conformal electronics including nested serpentine interconnects
EP3071096A4 (en) 2013-11-22 2017-08-09 Mc10, Inc. Conformal sensor systems for sensing and analysis of cardiac activity
CA2940539C (en) 2014-03-04 2022-10-04 Mc10, Inc. Multi-part flexible encapsulation housing for electronic devices
JP6482206B2 (en) 2014-08-22 2019-03-13 キヤノン株式会社 Method for forming pattern having hollow structure
USD781270S1 (en) 2014-10-15 2017-03-14 Mc10, Inc. Electronic device having antenna
WO2016134306A1 (en) 2015-02-20 2016-08-25 Mc10, Inc. Automated detection and configuration of wearable devices based on on-body status, location, and/or orientation
US10709384B2 (en) 2015-08-19 2020-07-14 Mc10, Inc. Wearable heat flux devices and methods of use
WO2017059215A1 (en) 2015-10-01 2017-04-06 Mc10, Inc. Method and system for interacting with a virtual environment
CN108289630A (en) 2015-10-05 2018-07-17 Mc10股份有限公司 Method and system for nerve modulation and stimulation
EP3420732B8 (en) 2016-02-22 2020-12-30 Medidata Solutions, Inc. System, devices, and method for on-body data and power transmission
CN108781313B (en) 2016-02-22 2022-04-08 美谛达解决方案公司 Systems, devices, and methods for coupled hubs and sensor nodes for on-body acquisition of sensor information
CN109310340A (en) 2016-04-19 2019-02-05 Mc10股份有限公司 Method and system for measuring sweat
US10447347B2 (en) 2016-08-12 2019-10-15 Mc10, Inc. Wireless charger and high speed data off-loader
CN110870087B (en) 2017-07-10 2023-11-21 高丽大学校世宗产学协力团 Stretchable substrate and manufacturing method thereof, substrate structure manufacturing device and method
KR101953468B1 (en) * 2017-07-10 2019-02-28 고려대학교 세종산학협력단 Stretchable substrate and Manufacturing Method thereof
CN212677438U (en) * 2018-02-14 2021-03-09 株式会社村田制作所 Stretchable substrate
WO2019205130A1 (en) * 2018-04-28 2019-10-31 Boe Technology Group Co., Ltd. Method of fabricating stretchable electronic device, stretchable electronic device, and stretchable display apparatus
WO2020133229A1 (en) * 2018-12-28 2020-07-02 深圳市柔宇科技有限公司 Flexible module for flexible electronic device
JP7272074B2 (en) * 2019-04-08 2023-05-12 大日本印刷株式会社 Wiring board and method for manufacturing wiring board
DE102019216713A1 (en) 2019-10-30 2021-05-06 Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. Process for the production of silicone substrates or silicone composite substrates, the silicone substrate or silicone composite substrate which can be produced with the process and its use

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101185613B1 (en) 2004-04-27 2012-09-24 더 보오드 오브 트러스티스 오브 더 유니버시티 오브 일리노이즈 Composite patterning devices for soft lithography
US20080055581A1 (en) 2004-04-27 2008-03-06 Rogers John A Devices and methods for pattern generation by ink lithography
DE102006011159A1 (en) * 2006-03-10 2007-09-13 Benecke-Kaliko Ag Process for producing a thermoplastic film
EP2255378B1 (en) 2008-03-05 2015-08-05 The Board of Trustees of the University of Illinois Stretchable and foldable electronic devices

Also Published As

Publication number Publication date
WO2011124898A1 (en) 2011-10-13

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Legal Events

Date Code Title Description
AT Applications terminated before publication under section 16(1)