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GB201005430D0 - Semiconductor apparatus - Google Patents

Semiconductor apparatus

Info

Publication number
GB201005430D0
GB201005430D0 GBGB1005430.2A GB201005430A GB201005430D0 GB 201005430 D0 GB201005430 D0 GB 201005430D0 GB 201005430 A GB201005430 A GB 201005430A GB 201005430 D0 GB201005430 D0 GB 201005430D0
Authority
GB
United Kingdom
Prior art keywords
semiconductor apparatus
semiconductor
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
GBGB1005430.2A
Other versions
GB2479174A (en
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
GE Aviation Systems Ltd
Original Assignee
GE Aviation Systems Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by GE Aviation Systems Ltd filed Critical GE Aviation Systems Ltd
Priority to GB1005430A priority Critical patent/GB2479174A/en
Publication of GB201005430D0 publication Critical patent/GB201005430D0/en
Publication of GB2479174A publication Critical patent/GB2479174A/en
Withdrawn legal-status Critical Current

Links

Classifications

    • H10W40/10—
    • H10W40/22—
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/367—Cooling facilitated by shape of device

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
GB1005430A 2010-03-31 2010-03-31 Semiconductor apparatus with heat sink Withdrawn GB2479174A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
GB1005430A GB2479174A (en) 2010-03-31 2010-03-31 Semiconductor apparatus with heat sink

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
GB1005430A GB2479174A (en) 2010-03-31 2010-03-31 Semiconductor apparatus with heat sink

Publications (2)

Publication Number Publication Date
GB201005430D0 true GB201005430D0 (en) 2010-05-19
GB2479174A GB2479174A (en) 2011-10-05

Family

ID=42228685

Family Applications (1)

Application Number Title Priority Date Filing Date
GB1005430A Withdrawn GB2479174A (en) 2010-03-31 2010-03-31 Semiconductor apparatus with heat sink

Country Status (1)

Country Link
GB (1) GB2479174A (en)

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4504156A (en) * 1982-07-06 1985-03-12 Sperry Corporation Cooling system monitor assembly and method
US6362522B1 (en) * 2000-06-28 2002-03-26 Advanced Micro Devices, Inc. Cool frame for protecting packaged electronic devices
TWI300261B (en) * 2003-07-02 2008-08-21 Advanced Semiconductor Eng Chip package structur
US20060208365A1 (en) * 2005-03-17 2006-09-21 Chipmos Technologies Inc. Flip-chip-on-film package structure
US7446412B2 (en) * 2006-03-28 2008-11-04 Intel Corporation Heat sink design using clad metal
JP2009206390A (en) * 2008-02-29 2009-09-10 Nec Electronics Corp Semiconductor laser device, heat sink, and manufacturing method of semiconductor laser device
TWI369767B (en) * 2008-03-11 2012-08-01 Advanced Semiconductor Eng Heat sink structure and semiconductor package as well as method for configuring heat sinks on a semiconductor package
US20100019379A1 (en) * 2008-07-24 2010-01-28 Broadcom Corporation External heat sink for bare-die flip chip packages

Also Published As

Publication number Publication date
GB2479174A (en) 2011-10-05

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Legal Events

Date Code Title Description
WAP Application withdrawn, taken to be withdrawn or refused ** after publication under section 16(1)