[go: up one dir, main page]

GB2009504A - Protected integrated electrical circuits - Google Patents

Protected integrated electrical circuits

Info

Publication number
GB2009504A
GB2009504A GB7839193A GB7839193A GB2009504A GB 2009504 A GB2009504 A GB 2009504A GB 7839193 A GB7839193 A GB 7839193A GB 7839193 A GB7839193 A GB 7839193A GB 2009504 A GB2009504 A GB 2009504A
Authority
GB
United Kingdom
Prior art keywords
working face
integrated electrical
electrical circuits
protected integrated
resin
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
GB7839193A
Other versions
GB2009504B (en
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
CII HONEYWELL BULL
Original Assignee
CII HONEYWELL BULL
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by CII HONEYWELL BULL filed Critical CII HONEYWELL BULL
Publication of GB2009504A publication Critical patent/GB2009504A/en
Application granted granted Critical
Publication of GB2009504B publication Critical patent/GB2009504B/en
Expired legal-status Critical Current

Links

Classifications

    • H10W74/114—
    • H10W74/01—
    • H10W74/137—
    • H10W74/476—
    • H10W72/01515—
    • H10W72/075—
    • H10W72/5449—
    • H10W72/884—
    • H10W74/00—
    • H10W90/734—
    • H10W90/754—

Landscapes

  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)

Abstract

A chip 6 forming an integrated electrical circuit has a working face 6a provided with circuit components connected to terminals situated at the periphery of the working face 6a which is entirely covered with a surface layer 9 of insulating resin e.g. silicone resin, which is resilient or in the form of a solidified gel and which does not extend beyond the boundaries 10 of the working face 6a, and the tangent to the resin surface at the periphery makes an angle of from 25 DEG -45 DEG with the working face 6a. <IMAGE>
GB7839193A 1977-10-03 1978-10-03 Protected integrated electrical circuits Expired GB2009504B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
FR7729686A FR2404992A1 (en) 1977-10-03 1977-10-03 PROTECTED INTEGRATED ELECTRICAL CIRCUITS, PROTECTED INTERCONNECTION SUBSTRATES CONTAINING SUCH CIRCUITS AND PROCESS FOR OBTAINING SUCH CIRCUITS AND SUBSTRATES

Publications (2)

Publication Number Publication Date
GB2009504A true GB2009504A (en) 1979-06-13
GB2009504B GB2009504B (en) 1982-05-12

Family

ID=9196038

Family Applications (1)

Application Number Title Priority Date Filing Date
GB7839193A Expired GB2009504B (en) 1977-10-03 1978-10-03 Protected integrated electrical circuits

Country Status (8)

Country Link
JP (1) JPS5460566A (en)
BE (1) BE870878A (en)
DE (1) DE2843133A1 (en)
FR (1) FR2404992A1 (en)
GB (1) GB2009504B (en)
IT (1) IT1098983B (en)
NL (1) NL7809979A (en)
SE (1) SE7810315L (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4711688A (en) * 1984-03-09 1987-12-08 Oy Lohja Ab Method for encapsulating semiconductor components mounted on a carrier tape

Families Citing this family (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE2922005A1 (en) * 1979-05-30 1980-12-04 Siemens Ag SEMICONDUCTOR COMPONENT WITH PASSIVATED SEMICONDUCTOR BODY
JPS5623759A (en) * 1979-08-01 1981-03-06 Hitachi Ltd Resin-sealed semiconductor device and manufacture thereof
JPS56114363A (en) * 1980-02-15 1981-09-08 Toshiba Corp Semiconductor device sealed with resin
US4419999A (en) * 1981-04-17 1983-12-13 May Jr James W Method and apparatus for monitoring vascular flow
FR2521350B1 (en) * 1982-02-05 1986-01-24 Hitachi Ltd SEMICONDUCTOR CHIP HOLDER
JPS59193596A (en) * 1983-04-18 1984-11-02 Kyodo Printing Co Ltd Ic module for ic card
US4511620A (en) * 1984-06-29 1985-04-16 Dow Corning Corporation Method for prevention of bubble formation in polyorganosiloxane gels
DE3442131A1 (en) * 1984-11-17 1986-05-22 Messerschmitt-Bölkow-Blohm GmbH, 8012 Ottobrunn METHOD FOR ENCODING MICROELECTRONIC SEMICONDUCTOR AND LAYER CIRCUITS
US6437464B1 (en) 1999-07-29 2002-08-20 Encap Motor Corporation Motor and disc assembly for computer hard drive
US6753628B1 (en) 1999-07-29 2004-06-22 Encap Motor Corporation High speed spindle motor for disc drive
US6617721B1 (en) 1999-07-29 2003-09-09 Encap Motor Corporation High speed spindle motor
US6362554B1 (en) 1999-07-29 2002-03-26 Encap Motor Corporation Stator assembly
US6300695B1 (en) 1999-07-29 2001-10-09 Encap Motor Corporation High speed spindle motor with hydrodynamic bearings
US6501616B1 (en) 1999-07-29 2002-12-31 Encap Motor Corporation Hard disc drive with base incorporating a spindle motor stator
WO2001045233A1 (en) 1999-12-17 2001-06-21 Encap Motor Corporation Spindle motor with encapsulated stator and method of making same
US6892439B1 (en) 2001-02-01 2005-05-17 Encap Motor Corporation Motor with stator made from linear core preform
US7036207B2 (en) 2001-03-02 2006-05-02 Encap Motor Corporation Stator assembly made from a plurality of toroidal core segments and motor using same

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4711688A (en) * 1984-03-09 1987-12-08 Oy Lohja Ab Method for encapsulating semiconductor components mounted on a carrier tape

Also Published As

Publication number Publication date
DE2843133A1 (en) 1979-04-19
FR2404992B1 (en) 1981-05-08
NL7809979A (en) 1979-04-05
SE7810315L (en) 1979-04-04
JPS5460566A (en) 1979-05-16
IT1098983B (en) 1985-09-18
GB2009504B (en) 1982-05-12
IT7828365A0 (en) 1978-10-03
FR2404992A1 (en) 1979-04-27
BE870878A (en) 1979-01-15

Similar Documents

Publication Publication Date Title
GB2009504A (en) Protected integrated electrical circuits
JPS5237721A (en) Semiconductor integrated circuit
GB2014785A (en) Semiconductor integrated circuit devices
JPS54154290A (en) Planar semiconductor integrated circuit
JPS5521195A (en) Integrated circuit module
YU42187B (en) Method of passivating an integrated circuit device
GB2028585B (en) On board integrated circuit chip signal source abstract of the disclosure
SE8107793L (en) encapsulant
AT383228B (en) COOLING ELEMENT WITH FORCED CIRCUIT COOLING FOR SEMICONDUCTOR COMPONENTS OF THE POWER ELECTRONICS
SE7900229L (en) INTEGRATED SEMICONDUCTOR CIRCUIT AND WAY TO MANUFACTURE THE SAME
EP0242020A3 (en) Electrical circuits
JPS55130154A (en) Disposition of integrated circuit on circuit board
AU4818779A (en) Integrated circuit generator chip for an electronic organ
JPS538566A (en) Mounting structure of semiconductor ic circuit
JPS5353261A (en) Electronic device
JPS55138241A (en) Sealing structure for semiconductor device
GB2069756B (en) Arrangement of diodes integrated on an insulating substrate
JPS5521175A (en) Semiconductor device
JPS5481073A (en) Sealing method for semiconductor element
JPS5338377A (en) Electronic wristwatch
JPS55107251A (en) Electronic part and its packaging construction
JPS5280798A (en) Electrical connection equipment for display substance
GB2002967A (en) Integrated circuit assembly
JPS52116073A (en) Hermetic structure in which integrated circuit element is sealed up ai rtightly
JPS54158863A (en) Integrated-circuit device

Legal Events

Date Code Title Description
PCNP Patent ceased through non-payment of renewal fee