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GB2009012B - Wave soldering system - Google Patents

Wave soldering system

Info

Publication number
GB2009012B
GB2009012B GB7847116A GB7847116A GB2009012B GB 2009012 B GB2009012 B GB 2009012B GB 7847116 A GB7847116 A GB 7847116A GB 7847116 A GB7847116 A GB 7847116A GB 2009012 B GB2009012 B GB 2009012B
Authority
GB
United Kingdom
Prior art keywords
wave soldering
soldering system
wave
soldering
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
GB7847116A
Other versions
GB2009012A (en
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
HOLLIS ENGINEERING
HOLLIS ENG Inc
Original Assignee
HOLLIS ENGINEERING
HOLLIS ENG Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by HOLLIS ENGINEERING, HOLLIS ENG Inc filed Critical HOLLIS ENGINEERING
Publication of GB2009012A publication Critical patent/GB2009012A/en
Application granted granted Critical
Publication of GB2009012B publication Critical patent/GB2009012B/en
Expired legal-status Critical Current

Links

Classifications

    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K1/00Soldering, e.g. brazing, or unsoldering
    • B23K1/018Unsoldering; Removal of melted solder or other residues
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K1/00Soldering, e.g. brazing, or unsoldering
    • B23K1/08Soldering by means of dipping in molten solder
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K1/00Soldering, e.g. brazing, or unsoldering
    • B23K1/08Soldering by means of dipping in molten solder
    • B23K1/085Wave soldering
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/30Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3457Solder materials or compositions; Methods of application thereof
    • H05K3/3468Applying molten solder
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2101/00Articles made by soldering, welding or cutting
    • B23K2101/36Electric or electronic devices
    • B23K2101/42Printed circuits
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/08Treatments involving gases
    • H05K2203/081Blowing of gas, e.g. for cooling or for providing heat during solder reflowing

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Molten Solder (AREA)
  • Lining Or Joining Of Plastics Or The Like (AREA)
GB7847116A 1977-12-02 1978-12-04 Wave soldering system Expired GB2009012B (en)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
US85675977A 1977-12-02 1977-12-02
US85676077A 1977-12-02 1977-12-02
US89749278A 1978-04-18 1978-04-18
US89749378A 1978-04-18 1978-04-18

Publications (2)

Publication Number Publication Date
GB2009012A GB2009012A (en) 1979-06-13
GB2009012B true GB2009012B (en) 1982-10-13

Family

ID=27505924

Family Applications (2)

Application Number Title Priority Date Filing Date
GB23564/78A Expired GB1602779A (en) 1977-12-02 1978-05-26 Methods and apparatus for mass soldering of printed circuit boards
GB7847116A Expired GB2009012B (en) 1977-12-02 1978-12-04 Wave soldering system

Family Applications Before (1)

Application Number Title Priority Date Filing Date
GB23564/78A Expired GB1602779A (en) 1977-12-02 1978-05-26 Methods and apparatus for mass soldering of printed circuit boards

Country Status (7)

Country Link
JP (2) JPS5495955A (en)
DE (1) DE2852132A1 (en)
FR (1) FR2410938A1 (en)
GB (2) GB1602779A (en)
HK (1) HK83388A (en)
IT (1) IT1107979B (en)
NL (1) NL184862C (en)

Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5897894A (en) * 1981-12-07 1983-06-10 日本電気株式会社 Soldering device
US4451000A (en) * 1982-06-11 1984-05-29 Hollis Engineering, Inc. Soldering apparatus exhaust system
DE3309648A1 (en) * 1983-03-15 1984-09-20 Siemens AG, 1000 Berlin und 8000 München METHOD FOR SOLDERING PLATE-SHAPED CIRCUIT CARRIERS WITHIN A PROTECTIVE GAS SOLDERING DEVICE
GB8331200D0 (en) * 1983-11-23 1983-12-29 Treiber Automation Ltd Solder method and apparatus
FR2572970B1 (en) * 1984-11-15 1987-02-13 Outillages Scient Lab HEATING DEVICE FOR GENERATING A WELDING WAVE FOR A WAVE WELDING MACHINE
DE3539585A1 (en) * 1985-10-11 1987-07-02 Kaspar Eidenberg METHOD FOR SOLDERING THE CONNECTIONS OF COMPONENTS TO THE CIRCUIT LAYERS AND SOLDERING EYES OF CIRCUIT BOARDS, AND DEVICE FOR CARRYING OUT THIS METHOD
JPH039263U (en) * 1989-06-08 1991-01-29
US5228614A (en) * 1990-07-09 1993-07-20 Electrovert Ltd. Solder nozzle with gas knife jet
JP2506695Y2 (en) * 1990-08-04 1996-08-14 三菱電機株式会社 Printed circuit board cooling device
DE4416788C2 (en) * 1994-05-06 1999-08-19 Siemens Ag Process for wave soldering of printed circuit boards
US6168065B1 (en) 1998-02-17 2001-01-02 Soltec B.V. Movable selective debridging apparatus for debridging soldered joints on printed circuit boards
DE10061032A1 (en) * 2000-12-08 2002-06-27 Messer Griesheim Gmbh Method and device for soldering electronic components on printed circuit boards

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3605244A (en) * 1966-04-20 1971-09-20 Electrovert Mfg Co Ltd Soldering methods and apparatus
US3398873A (en) * 1966-09-07 1968-08-27 Hollis Engineering Sumps and nozzles for soldering machines
US3500536A (en) * 1966-11-17 1970-03-17 Burroughs Corp Process for finishing solder joints on a circuit board
US3603329A (en) * 1968-11-06 1971-09-07 Brown Eng Co Inc Apparatus for manufacturing printed circuits
US3773261A (en) * 1969-06-13 1973-11-20 North American Rockwell Material removing device
US3705457A (en) * 1970-11-02 1972-12-12 Electrovert Mfg Co Ltd Wave soldering using inert gas to protect pretinned and soldered surfaces of relatively flat workpieces
US3724418A (en) * 1971-08-20 1973-04-03 Lain J Mc Solder coating apparatus
US3765591A (en) * 1972-01-19 1973-10-16 Dynamics Corp America Wave soldering electrical connections
US3948212A (en) * 1972-03-30 1976-04-06 Robert Bosch G.M.B.H. Coating apparatus
US3865298A (en) * 1973-08-14 1975-02-11 Atomic Energy Commission Solder leveling
JPS5258042A (en) * 1975-11-10 1977-05-13 Hitachi Ltd Dip soldering device

Also Published As

Publication number Publication date
FR2410938A1 (en) 1979-06-29
HK83388A (en) 1988-10-21
GB1602779A (en) 1981-11-18
IT7852160A0 (en) 1978-12-01
DE2852132C2 (en) 1989-08-10
JPS5495955A (en) 1979-07-28
FR2410938B1 (en) 1984-11-02
DE2852132A1 (en) 1979-06-07
NL7811803A (en) 1979-06-06
JPS63268563A (en) 1988-11-07
NL184862C (en) 1989-11-16
GB2009012A (en) 1979-06-13
IT1107979B (en) 1985-12-02

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Legal Events

Date Code Title Description
732 Registration of transactions, instruments or events in the register (sect. 32/1977)
732 Registration of transactions, instruments or events in the register (sect. 32/1977)
PE20 Patent expired after termination of 20 years

Effective date: 19981203