GB2008784B - Heat resistant photoresist composition and process for preparing the same - Google Patents
Heat resistant photoresist composition and process for preparing the sameInfo
- Publication number
- GB2008784B GB2008784B GB7844576A GB7844576A GB2008784B GB 2008784 B GB2008784 B GB 2008784B GB 7844576 A GB7844576 A GB 7844576A GB 7844576 A GB7844576 A GB 7844576A GB 2008784 B GB2008784 B GB 2008784B
- Authority
- GB
- United Kingdom
- Prior art keywords
- preparing
- same
- heat resistant
- photoresist composition
- resistant photoresist
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
- C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
- C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
- C08G73/14—Polyamide-imides
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
- G03F7/032—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with binders
- G03F7/037—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with binders the binders being polyamides or polyimides
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/038—Macromolecular compounds which are rendered insoluble or differentially wettable
- G03F7/0387—Polyamides or polyimides
Landscapes
- Physics & Mathematics (AREA)
- Spectroscopy & Molecular Physics (AREA)
- General Physics & Mathematics (AREA)
- Chemical & Material Sciences (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Organic Chemistry (AREA)
- Macromolecular Compounds Obtained By Forming Nitrogen-Containing Linkages In General (AREA)
- Polymerisation Methods In General (AREA)
- Addition Polymer Or Copolymer, Post-Treatments, Or Chemical Modifications (AREA)
Applications Claiming Priority (4)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP13725677A JPS6054666B2 (en) | 1977-11-17 | 1977-11-17 | Heat-resistant photoresist composition and method for producing the same |
| JP15561077A JPS5950049B2 (en) | 1977-12-26 | 1977-12-26 | Heat-resistant photoresist composition |
| JP15668777A JPS6023341B2 (en) | 1977-12-27 | 1977-12-27 | Heat-resistant photoresist composition and method for producing the same |
| JP15748177A JPS5950050B2 (en) | 1977-12-28 | 1977-12-28 | Heat-resistant photoresist composition and method for producing the same |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| GB2008784A GB2008784A (en) | 1979-06-06 |
| GB2008784B true GB2008784B (en) | 1982-04-15 |
Family
ID=27472052
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| GB7844576A Expired GB2008784B (en) | 1977-11-17 | 1978-11-15 | Heat resistant photoresist composition and process for preparing the same |
Country Status (3)
| Country | Link |
|---|---|
| DE (1) | DE2849981A1 (en) |
| FR (1) | FR2409535A1 (en) |
| GB (1) | GB2008784B (en) |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| BR8002860A (en) * | 1979-05-11 | 1980-12-23 | Minnesota Mining & Mfg | PROCESS FOR THE CURE OF A POLYAMIC ACID OR SALT FILM OF THIS, PROCESS FOR FORMING A PICTURE CONSTRUCTION, ARTICLE THAT CONSISTS OF A SUBSTRATE HAVING POLYIMIDIC IMAGE AREAS ON THIS AND LIGHT-SENSITIVE ARTICLE |
| JPS5614554A (en) * | 1979-07-13 | 1981-02-12 | Kanegafuchi Chem Ind Co Ltd | Heat resistant resin composition |
| DE3407201A1 (en) * | 1984-02-28 | 1985-08-29 | Bayer Ag, 5090 Leverkusen | METHOD FOR THE PHENOL-FREE PRODUCTION OF ALIPHATIC-AROMATIC POLYAMIDIMIDES |
| US8771924B2 (en) | 2006-12-26 | 2014-07-08 | Fujifilm Corporation | Polymerizable composition, lithographic printing plate precursor and lithographic printing method |
Family Cites Families (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| GB1181446A (en) * | 1966-07-22 | 1970-02-18 | Hitachi Chemical Co Ltd | Process for producing Amide-Imide Resins |
| ZA716460B (en) * | 1970-11-19 | 1972-07-26 | Gen Electric | Improved polyamideimides |
| DE2112141A1 (en) * | 1971-03-13 | 1972-10-05 | Agfa Gevaert Ag | Photographic material |
| US4079041A (en) * | 1975-06-18 | 1978-03-14 | Ciba-Geigy Corporation | Crosslinkable polymeric compounds |
-
1978
- 1978-11-15 GB GB7844576A patent/GB2008784B/en not_active Expired
- 1978-11-17 FR FR7832525A patent/FR2409535A1/en active Granted
- 1978-11-17 DE DE19782849981 patent/DE2849981A1/en active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| FR2409535B1 (en) | 1983-01-21 |
| DE2849981C2 (en) | 1987-07-16 |
| GB2008784A (en) | 1979-06-06 |
| DE2849981A1 (en) | 1979-05-23 |
| FR2409535A1 (en) | 1979-06-15 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PCNP | Patent ceased through non-payment of renewal fee |
Effective date: 19951115 |