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GB2003321A - Integrated circuit package structures - Google Patents

Integrated circuit package structures

Info

Publication number
GB2003321A
GB2003321A GB7830197A GB7830197A GB2003321A GB 2003321 A GB2003321 A GB 2003321A GB 7830197 A GB7830197 A GB 7830197A GB 7830197 A GB7830197 A GB 7830197A GB 2003321 A GB2003321 A GB 2003321A
Authority
GB
United Kingdom
Prior art keywords
integrated circuit
container
circuit package
frame
package structures
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
GB7830197A
Other versions
GB2003321B (en
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Citizen Watch Co Ltd
Original Assignee
Citizen Watch Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Citizen Watch Co Ltd filed Critical Citizen Watch Co Ltd
Publication of GB2003321A publication Critical patent/GB2003321A/en
Application granted granted Critical
Publication of GB2003321B publication Critical patent/GB2003321B/en
Expired legal-status Critical Current

Links

Classifications

    • H10W76/157—
    • H10W70/68—
    • H10W74/114—
    • H10W76/47—
    • H10W70/682—
    • H10W72/075—
    • H10W72/536—
    • H10W72/5445—
    • H10W72/5522—
    • H10W74/00—
    • H10W90/754—

Landscapes

  • Electric Clocks (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)

Abstract

An integrated circuit package structure for electronic timepieces, comprising an integrated circuit holder 1 moulded from plastics which comprises a container 2, a frame 3 surrounding the container, and bars 4 connecting the container with the frame. The container is received within an aperture 6 provided in a circuit board 5, and an integrated circuit chip 8 is secured in the container. Electrodes of the integrated circuit chip and electrodes 7 provided on the circuit board are wire-bonded and synthetic resin is potted in the frame which limits the spreading range of the resin. <IMAGE>
GB7830197A 1977-07-19 1978-07-18 Integrated circuit package structures Expired GB2003321B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1977096319U JPS5423570U (en) 1977-07-19 1977-07-19

Publications (2)

Publication Number Publication Date
GB2003321A true GB2003321A (en) 1979-03-07
GB2003321B GB2003321B (en) 1982-01-20

Family

ID=14161690

Family Applications (1)

Application Number Title Priority Date Filing Date
GB7830197A Expired GB2003321B (en) 1977-07-19 1978-07-18 Integrated circuit package structures

Country Status (2)

Country Link
JP (1) JPS5423570U (en)
GB (1) GB2003321B (en)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2651923A1 (en) * 1989-09-14 1991-03-15 Peugeot Power integrated circuit
US5089878A (en) * 1989-06-09 1992-02-18 Lee Jaesup N Low impedance packaging
EP0472766A1 (en) * 1990-08-30 1992-03-04 Siemens Aktiengesellschaft Process for encapsulating a contacted semiconductor chip
US6091135A (en) * 1996-12-27 2000-07-18 Lg Semicon Co., Ltd. Lead frame with pre-mold paddle for a semiconductor chip package

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS54135367A (en) * 1978-04-11 1979-10-20 Seiko Instr & Electronics Circuit block construction for watch

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5131628U (en) * 1974-08-28 1976-03-08

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5089878A (en) * 1989-06-09 1992-02-18 Lee Jaesup N Low impedance packaging
FR2651923A1 (en) * 1989-09-14 1991-03-15 Peugeot Power integrated circuit
EP0472766A1 (en) * 1990-08-30 1992-03-04 Siemens Aktiengesellschaft Process for encapsulating a contacted semiconductor chip
US6091135A (en) * 1996-12-27 2000-07-18 Lg Semicon Co., Ltd. Lead frame with pre-mold paddle for a semiconductor chip package

Also Published As

Publication number Publication date
GB2003321B (en) 1982-01-20
JPS5423570U (en) 1979-02-16

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Legal Events

Date Code Title Description
PCNP Patent ceased through non-payment of renewal fee