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GB2002967B - Integrated circuit assembly - Google Patents

Integrated circuit assembly

Info

Publication number
GB2002967B
GB2002967B GB7830237A GB7830237A GB2002967B GB 2002967 B GB2002967 B GB 2002967B GB 7830237 A GB7830237 A GB 7830237A GB 7830237 A GB7830237 A GB 7830237A GB 2002967 B GB2002967 B GB 2002967B
Authority
GB
United Kingdom
Prior art keywords
integrated circuit
circuit assembly
assembly
integrated
circuit
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
GB7830237A
Other versions
GB2002967A (en
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Seiko Instruments Inc
Original Assignee
Seiko Instruments Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Seiko Instruments Inc filed Critical Seiko Instruments Inc
Publication of GB2002967A publication Critical patent/GB2002967A/en
Application granted granted Critical
Publication of GB2002967B publication Critical patent/GB2002967B/en
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H05K3/284—Applying non-metallic protective coatings for encapsulating mounted components
    • H10W74/00—
    • H10W90/754—

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Wire Bonding (AREA)
GB7830237A 1977-08-19 1978-07-18 Integrated circuit assembly Expired GB2002967B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1977111739U JPS5636140Y2 (en) 1977-08-19 1977-08-19

Publications (2)

Publication Number Publication Date
GB2002967A GB2002967A (en) 1979-02-28
GB2002967B true GB2002967B (en) 1982-01-06

Family

ID=14568949

Family Applications (1)

Application Number Title Priority Date Filing Date
GB7830237A Expired GB2002967B (en) 1977-08-19 1978-07-18 Integrated circuit assembly

Country Status (2)

Country Link
JP (1) JPS5636140Y2 (en)
GB (1) GB2002967B (en)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS57141338A (en) * 1981-02-26 1982-09-01 Purakoo:Kk Method and apparatus to wind up synthetic resin film
JPH063836B2 (en) * 1982-03-31 1994-01-12 株式会社東芝 Multi-chip module
GB2204184A (en) * 1987-04-29 1988-11-02 Stanley Bracey Mounting electronic components on substrates

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5127984B2 (en) * 1973-06-20 1976-08-16

Also Published As

Publication number Publication date
GB2002967A (en) 1979-02-28
JPS5636140Y2 (en) 1981-08-25
JPS5438468U (en) 1979-03-13

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Legal Events

Date Code Title Description
PCNP Patent ceased through non-payment of renewal fee

Effective date: 19920718