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GB2093401B - Composite film - Google Patents

Composite film

Info

Publication number
GB2093401B
GB2093401B GB8200313A GB8200313A GB2093401B GB 2093401 B GB2093401 B GB 2093401B GB 8200313 A GB8200313 A GB 8200313A GB 8200313 A GB8200313 A GB 8200313A GB 2093401 B GB2093401 B GB 2093401B
Authority
GB
United Kingdom
Prior art keywords
composite film
lead patterns
patterns
semiconductor element
leads
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
GB8200313A
Other versions
GB2093401A (en
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Tokyo Sanyo Electric Co Ltd
Sanyo Electric Co Ltd
Original Assignee
Tokyo Sanyo Electric Co Ltd
Sanyo Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP56005672A external-priority patent/JPS57120361A/en
Priority claimed from JP706981A external-priority patent/JPS57120398A/en
Priority claimed from JP706881A external-priority patent/JPS57120397A/en
Priority claimed from JP56016182A external-priority patent/JPS57130457A/en
Priority claimed from JP56016183A external-priority patent/JPS57130458A/en
Priority claimed from JP56024028A external-priority patent/JPS57138167A/en
Application filed by Tokyo Sanyo Electric Co Ltd, Sanyo Electric Co Ltd filed Critical Tokyo Sanyo Electric Co Ltd
Publication of GB2093401A publication Critical patent/GB2093401A/en
Application granted granted Critical
Publication of GB2093401B publication Critical patent/GB2093401B/en
Expired legal-status Critical Current

Links

Classifications

    • H10W70/047—
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
    • B32B7/04—Interconnection of layers
    • B32B7/12—Interconnection of layers using interposed adhesives or interposed materials with bonding properties
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/022—Processes for manufacturing precursors of printed circuits, i.e. copper-clad substrates
    • H10W70/451—
    • H10W70/453—
    • H10W70/611—
    • H10W70/635—
    • H10W72/0198—
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00—Properties of the layers or laminate
    • B32B2307/20—Properties of the layers or laminate having particular electrical or magnetic properties, e.g. piezoelectric
    • B32B2307/202—Conductive
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2398/00—Unspecified macromolecular compounds
    • B32B2398/10—Thermosetting resins
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2457/00—Electrical equipment
    • H10W70/682—
    • H10W70/685—
    • H10W72/5449—
    • H10W74/00—
    • H10W90/754—
    • H10W90/756—

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Lead Frames For Integrated Circuits (AREA)
  • Wire Bonding (AREA)

Abstract

A composite film comprises two copper films (11, 12) adhered to and insulated from each other by a thermal setting resin (13) to be shaped in a belt shape. A lead frame is formed by etching one copper film of the composite film such that a plurality of lead patterns (15) are in succession defined including a plurality of leads (16) arranged approximately equispaced to extend in the length direction and the other copper film of the composite film is etched to form supporting patterns (19) corresponding to the respective lead patterns and for supporting the corresponding ones. A semiconductor element (20) is provided in association with the respective lead patterns and the semiconductor element is connected to the respective leads of the corresponding lead patterns by wire bonding, while the respective leads are connected to external terminals (22). The semiconductor element, the lead patterns and a portion of the external terminals are molded with a resin material so that a mold layer (23) is formed and then the composite film is severed for each of the mold layers, whereby a semiconductor device is provided. <IMAGE>
GB8200313A 1981-01-17 1982-01-06 Composite film Expired GB2093401B (en)

Applications Claiming Priority (6)

Application Number Priority Date Filing Date Title
JP56005672A JPS57120361A (en) 1981-01-17 1981-01-17 Structure of film substrate
JP706981A JPS57120398A (en) 1981-01-19 1981-01-19 Method of connecting both-side printed foil of both-side printed circuit board
JP706881A JPS57120397A (en) 1981-01-19 1981-01-19 Method of connecting both-side printed foil of both-side printed circuit board
JP56016182A JPS57130457A (en) 1981-02-04 1981-02-04 Mass assembling method of semiconductor device
JP56016183A JPS57130458A (en) 1981-02-04 1981-02-04 Film substrate structure
JP56024028A JPS57138167A (en) 1981-02-19 1981-02-19 Manufacture of semiconductor device

Publications (2)

Publication Number Publication Date
GB2093401A GB2093401A (en) 1982-09-02
GB2093401B true GB2093401B (en) 1985-07-17

Family

ID=27547925

Family Applications (1)

Application Number Title Priority Date Filing Date
GB8200313A Expired GB2093401B (en) 1981-01-17 1982-01-06 Composite film

Country Status (2)

Country Link
DE (1) DE3201133A1 (en)
GB (1) GB2093401B (en)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3051195C2 (en) * 1980-08-05 1997-08-28 Gao Ges Automation Org Package for integrated circuit incorporated in identity cards
GB2147457A (en) * 1983-09-28 1985-05-09 Philips Electronic Associated Encapsulated semiconductor device with composite conductive leads
US4571354A (en) * 1983-12-27 1986-02-18 Rogers Corporation Tape automated bonding of integrated circuits
KR920018907A (en) * 1991-03-23 1992-10-22 김광호 Semiconductor leadframe
KR101687860B1 (en) * 2010-05-12 2016-12-19 랑셍 홀딩 Method of manufacture of flexible printed circuits

Also Published As

Publication number Publication date
DE3201133A1 (en) 1982-11-11
GB2093401A (en) 1982-09-02

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Legal Events

Date Code Title Description
732 Registration of transactions, instruments or events in the register (sect. 32/1977)
PE20 Patent expired after termination of 20 years

Effective date: 20020105