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GB2087654B - Printed circuit boards - Google Patents

Printed circuit boards

Info

Publication number
GB2087654B
GB2087654B GB8036530A GB8036530A GB2087654B GB 2087654 B GB2087654 B GB 2087654B GB 8036530 A GB8036530 A GB 8036530A GB 8036530 A GB8036530 A GB 8036530A GB 2087654 B GB2087654 B GB 2087654B
Authority
GB
United Kingdom
Prior art keywords
printed circuit
circuit boards
boards
printed
circuit
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
GB8036530A
Other versions
GB2087654A (en
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
STC PLC
Original Assignee
Standard Telephone and Cables PLC
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Standard Telephone and Cables PLC filed Critical Standard Telephone and Cables PLC
Priority to GB8036530A priority Critical patent/GB2087654B/en
Publication of GB2087654A publication Critical patent/GB2087654A/en
Application granted granted Critical
Publication of GB2087654B publication Critical patent/GB2087654B/en
Expired legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/10Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/102Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by bonding of conductive powder, i.e. metallic powder
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01Dielectrics
    • H05K2201/0104Properties and characteristics in general
    • H05K2201/0129Thermoplastic polymer, e.g. auto-adhesive layer; Shaping of thermoplastic polymer
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03Conductive materials
    • H05K2201/0332Structure of the conductor
    • H05K2201/0335Layered conductors or foils
    • H05K2201/0347Overplating, e.g. for reinforcing conductors or bumps; Plating over filled vias
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/10Using electric, magnetic and electromagnetic fields; Using laser light
    • H05K2203/107Using laser light

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing Of Printed Wiring (AREA)
GB8036530A 1980-11-13 1980-11-13 Printed circuit boards Expired GB2087654B (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
GB8036530A GB2087654B (en) 1980-11-13 1980-11-13 Printed circuit boards

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
GB8036530A GB2087654B (en) 1980-11-13 1980-11-13 Printed circuit boards

Publications (2)

Publication Number Publication Date
GB2087654A GB2087654A (en) 1982-05-26
GB2087654B true GB2087654B (en) 1984-04-26

Family

ID=10517290

Family Applications (1)

Application Number Title Priority Date Filing Date
GB8036530A Expired GB2087654B (en) 1980-11-13 1980-11-13 Printed circuit boards

Country Status (1)

Country Link
GB (1) GB2087654B (en)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2160712B (en) * 1984-06-21 1987-11-25 Stc Plc Forming conductive tracks on circuit boards
DE10050167A1 (en) * 2000-10-10 2002-04-11 Poesl Rudolf Production of electrically conducting pathways on an insulating substrate comprises forming the pathways in a layer made of metallic molybdenum and/or tungsten powder applied on the substrate using an IR laser
DE10145750A1 (en) * 2001-09-17 2003-04-24 Infineon Technologies Ag Process for producing a metal layer on a carrier body and carrier body with a metal layer
DE10154110A1 (en) * 2001-11-03 2003-05-22 Leoni Ag Manufacture of carrier material e.g. for motor vehicle heated seat, by incorporating e.g. metal fibers or powder in textile carrier material in region corresponding to conductive track
DE102012100299A1 (en) * 2012-01-13 2013-07-18 Lpkf Laser & Electronics Ag Method for manufacturing strip conductor structure on support material, involves enclosing proportion of non-dispersed particles so that metal deposited on exposed areas is separated to manufacture conductor structure

Also Published As

Publication number Publication date
GB2087654A (en) 1982-05-26

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Legal Events

Date Code Title Description
PCNP Patent ceased through non-payment of renewal fee