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GB2082388A - Improvements in or relating to carrier racks for disc-like objects - Google Patents

Improvements in or relating to carrier racks for disc-like objects Download PDF

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Publication number
GB2082388A
GB2082388A GB8124972A GB8124972A GB2082388A GB 2082388 A GB2082388 A GB 2082388A GB 8124972 A GB8124972 A GB 8124972A GB 8124972 A GB8124972 A GB 8124972A GB 2082388 A GB2082388 A GB 2082388A
Authority
GB
United Kingdom
Prior art keywords
rods
carrier rack
rack
carrier
slots
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
GB8124972A
Other versions
GB2082388B (en
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Heraeus Quarzschmelze GmbH
Heraeus Schott Quarzschmelze GmbH
Original Assignee
Heraeus Quarzschmelze GmbH
Heraeus Schott Quarzschmelze GmbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Heraeus Quarzschmelze GmbH, Heraeus Schott Quarzschmelze GmbH filed Critical Heraeus Quarzschmelze GmbH
Publication of GB2082388A publication Critical patent/GB2082388A/en
Application granted granted Critical
Publication of GB2082388B publication Critical patent/GB2082388B/en
Expired legal-status Critical Current

Links

Classifications

    • H10P72/135
    • CCHEMISTRY; METALLURGY
    • C30CRYSTAL GROWTH
    • C30BSINGLE-CRYSTAL GROWTH; UNIDIRECTIONAL SOLIDIFICATION OF EUTECTIC MATERIAL OR UNIDIRECTIONAL DEMIXING OF EUTECTOID MATERIAL; REFINING BY ZONE-MELTING OF MATERIAL; PRODUCTION OF A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; SINGLE CRYSTALS OR HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; AFTER-TREATMENT OF SINGLE CRYSTALS OR A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; APPARATUS THEREFOR
    • C30B31/00Diffusion or doping processes for single crystals or homogeneous polycrystalline material with defined structure; Apparatus therefor
    • C30B31/06Diffusion or doping processes for single crystals or homogeneous polycrystalline material with defined structure; Apparatus therefor by contacting with diffusion material in the gaseous state
    • C30B31/10Reaction chambers; Selection of materials therefor
    • C30B31/103Mechanisms for moving either the charge or heater
    • CCHEMISTRY; METALLURGY
    • C30CRYSTAL GROWTH
    • C30BSINGLE-CRYSTAL GROWTH; UNIDIRECTIONAL SOLIDIFICATION OF EUTECTIC MATERIAL OR UNIDIRECTIONAL DEMIXING OF EUTECTOID MATERIAL; REFINING BY ZONE-MELTING OF MATERIAL; PRODUCTION OF A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; SINGLE CRYSTALS OR HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; AFTER-TREATMENT OF SINGLE CRYSTALS OR A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; APPARATUS THEREFOR
    • C30B33/00After-treatment of single crystals or homogeneous polycrystalline material with defined structure
    • C30B33/005Oxydation

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Packaging Frangible Articles (AREA)

Abstract

A carrier rack for holding disc- like objects, e.g. semiconductor discs, wafers or slices which rack consists of two pairs of slotted transparent fused silica rods 1 and 2 which are secured to transparent fused silica tubes 3 between each pair of rods at their end area. The upper rods 1 have bores 5 at their end areas to provide index marks on transfer of discs between the silica rack and a plastics carrier rack. The rods may have slots of a greater width at periodically recurring spaces (eg for dopant sources) as well as the slots previously referred to. An additional transverse support tube may be provided between the ends of the rack. <IMAGE>

Description

SPECIFICATION Improvements in or relating to carrier racks for disc-like objects The present invention relates to carrier racks of transparent fused silica to hold a plurality of disc-like objects, the edge areas of which objects extend into slots in elements of the rack, said elements comprising two pairs of rods each provided with slots and extending parallel to each other, the space between one pair of rods being greater than the space between the other pair of rods, both pairs of rods being held immovably in the area of their ends. In use the rack is positioned so that rods are substantially horizontal, the widerspaced rods being above the closer-spaced rods. Hereinafter such racks will be referred to as "of the kind described".
Carrier racks of the kind described are disclosed in British Patent Specification No. GB PS 1 426 503, and have proven very efficient in use. Generally speaking they find application in the semi-conductor industry for processing and holding semiconductor wafers or slices.
It is an object of the present invention to provide a carrier rack of the kind described which is simple to make and economical in use of the expensive transparent fused silica involved and so that the racks loaded with semiconductor wafers or slices can easily be manipulated, and enables them to be easily loaded or reloaded with semiconductor wafers from the usual storage racks of ordinary plastics materials.
It is another object that the use of such racks shall be extended.
Accordingly, the invention consists in a carrier rack of the kind described wherein a transparent fused silica tube is secured at or adjacent each end area of the rods and transversely between the wider and closer-spaced pairs of rods. Advantageously the tubes are welded to the rods.
In order that the invention may be more clearly understood, reference will now be made to the accompanying drawings which show certain embodiments thereof by way of example and in which: Figure 1 shows an elevation of a first embodiment, Figure 2 shows an elevation of a second embodiment, and Figure 3 shows an elevation of a slotted rod.
Referring now to the drawings, Fig. 1 shows a carrier rack which comprises six parts viz. a pair of upper rods 1, a pair of lower rods 2, and two transverse rods 3 arranged between the pair of rods 1, 2, and adjacent the end areas thereof. All the rods and tubes are of transparent fused silica and the tubes are each welded to the upper and lower rods at points 4. The rods 1 and 2 are slotted at 7, the slots all being of the same width and into which can be engaged the end areas of semi conductor wafers or slices with which the carrier rack is to be loaded in one example of use. As can be seen from Fig. 1, the ends of the transparent fused silica tubes 3 are down wardly chamfered.The transparent fused silica tubes 3 which are arranged transversely to the rods 1, 2 are arranged to receive the tines 6 of a forked handle with which the loaded or unloaded carrier racks can be held and moved. The ends of the upper rods 1 are also pierced with bores 5 which serve as indexing marks on transferring the semi-conductor discs from a plastics carrier rack for example to a carrier rack and vice versa.
The embodiment shown in Fig. 2 differs from that shown in Fig. 1 in that the upper and lower pairs of rods 1, and 2 have an unslotted area 8 each at a given distance from the rod ends and each of these areas is welded to an additional securing tube 9 of transparent fused silica which is mounted transversely to and between the pairs of rods 1 and 2. This reinforcing tube enables double carrier racks or multiple-length carrier racks to be made compared with what might be the normal length of a rack as shown in Fig. 1 and each "normal" length of such a multiple rack can be separated from its neighbour by a pre-determined distance by such additional tube.
Instead of the rods 1 and 2 with slots of the same width as used in Figs. 1 and 2, two rods 10 can be used as shown in the embodi ment according to Fig. 3, having slots 7 of the same width and slots 11 of greater width.
The slots 11 and be located at periodically recurrent spacings 12 in the rod 10 to serve for the reception of plate-like or differently shaped dopant wafers or slices, the slots 7 still serving to receive semiconductor discs.
Carrier racks with rods 10 formed in this way are used for carrying out a doping process with the help of solid sources whereas carrier racks with rods 1 and 2 according to Figs. 1 and 2 are used for other methods of process ing for semi-conductor discs such as the oxi dation and tempering processes as well as doping from the gas phase.

Claims (9)

1. A carrier rack of the kind described, wherein a transparent fused silica tube is secured at or adjacent each end area of the rods and transversely thereto between the wider and closer-spaced pairs of rods.
2. A carrier rack as claimed in claim 1, wherein all said rods have an unslotted area at a given distance from the ends of the rod, and said area being secured to an additional secur ing tube which is arranged transversely to and between the pairs of rods.
3. A carrier rack as claimed in claim 1 or 2, wherein the ends of the tubes interconnecting the pairs of rods are downwardly chamfered.
4. A carrier rack as claimed in claim 1, 2 or 3, wherein each rod of the pair is pierced with a bore adjacent their end areas.
5. A carrier rack as claimed in any of the preceding claims, wherein all said rods have some slots of greater width than the remaining slots at periodically recurrent intervals.
6. A carrier rack as claimed in any of the preceding claims, wherein the rods and tubes are welded together.
7. A carrier rack substantially as hereinbefore described with reference to Fig. 1 of the accompanying drawings.
8. A carrier rack substantially as hereinbefore described with reference to Fig. 2 of the accompanying drawings.
9. A carrier rack substantially as hereinbefore described with reference to Fig. 3 of the accompanying drawings.
GB8124972A 1980-08-16 1981-08-14 Improvements in or relating to carrier racks for disc-like objects Expired GB2082388B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE19808021868U DE8021868U1 (en) 1980-08-16 1980-08-16 CARRIER HORDE FOR SEMICONDUCTOR DISCS

Publications (2)

Publication Number Publication Date
GB2082388A true GB2082388A (en) 1982-03-03
GB2082388B GB2082388B (en) 1984-05-23

Family

ID=6718055

Family Applications (1)

Application Number Title Priority Date Filing Date
GB8124972A Expired GB2082388B (en) 1980-08-16 1981-08-14 Improvements in or relating to carrier racks for disc-like objects

Country Status (4)

Country Link
JP (1) JPS5737826A (en)
DE (1) DE8021868U1 (en)
FR (1) FR2488731A1 (en)
GB (1) GB2082388B (en)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0100539A3 (en) * 1982-07-30 1985-05-22 Tecnisco Ltd. Assembled device for supporting semiconductor wafers or the like
US4775317A (en) * 1984-11-16 1988-10-04 Heraeus Quarzschmelze Gmbh Oven for the heat treatment of semiconductor substrates
EP0267462A3 (en) * 1986-11-12 1990-01-31 Heraeus Amersil, Inc. Mass transferable semiconductor substrate processing and handling full shell carrier (boat)
WO1996007199A3 (en) * 1994-08-31 1996-05-02 Heraeus Quarzglas Quartz glass jig for the heat treatment of silicon wafers and method and device for producing same

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5844836U (en) * 1981-09-21 1983-03-25 日本電気ホームエレクトロニクス株式会社 Semiconductor manufacturing jig
DE3419866C2 (en) * 1984-05-28 1986-06-26 Heraeus Quarzschmelze Gmbh, 6450 Hanau Carrier tray made of quartz glass for disk-shaped substrates
DE3440111C1 (en) * 1984-11-02 1986-05-15 Heraeus Quarzschmelze Gmbh, 6450 Hanau Carrier horde
DE3829159A1 (en) * 1988-08-27 1990-03-08 Westdeutsche Quarzschmelze Gmb DEVICE FOR RECEIVING SEMICONDUCTOR DISC

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5068775A (en) * 1973-10-19 1975-06-09
JPS53133366A (en) * 1977-04-27 1978-11-21 Nec Corp Impurity diffusion method

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0100539A3 (en) * 1982-07-30 1985-05-22 Tecnisco Ltd. Assembled device for supporting semiconductor wafers or the like
US4775317A (en) * 1984-11-16 1988-10-04 Heraeus Quarzschmelze Gmbh Oven for the heat treatment of semiconductor substrates
EP0267462A3 (en) * 1986-11-12 1990-01-31 Heraeus Amersil, Inc. Mass transferable semiconductor substrate processing and handling full shell carrier (boat)
WO1996007199A3 (en) * 1994-08-31 1996-05-02 Heraeus Quarzglas Quartz glass jig for the heat treatment of silicon wafers and method and device for producing same

Also Published As

Publication number Publication date
FR2488731A1 (en) 1982-02-19
JPS6141128B2 (en) 1986-09-12
DE8021868U1 (en) 1981-01-29
JPS5737826A (en) 1982-03-02
FR2488731B3 (en) 1983-06-10
GB2082388B (en) 1984-05-23

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Legal Events

Date Code Title Description
732 Registration of transactions, instruments or events in the register (sect. 32/1977)
PCNP Patent ceased through non-payment of renewal fee