GB1562016A - Coagulation coating process - Google Patents
Coagulation coating process Download PDFInfo
- Publication number
- GB1562016A GB1562016A GB679077A GB679077A GB1562016A GB 1562016 A GB1562016 A GB 1562016A GB 679077 A GB679077 A GB 679077A GB 679077 A GB679077 A GB 679077A GB 1562016 A GB1562016 A GB 1562016A
- Authority
- GB
- United Kingdom
- Prior art keywords
- bath
- substrate
- coating
- metal
- salt
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 238000000576 coating method Methods 0.000 title claims description 148
- 230000015271 coagulation Effects 0.000 title description 34
- 238000005345 coagulation Methods 0.000 title description 34
- 239000011248 coating agent Substances 0.000 claims description 134
- 238000000034 method Methods 0.000 claims description 131
- 230000008569 process Effects 0.000 claims description 119
- 229920005989 resin Polymers 0.000 claims description 111
- 239000011347 resin Substances 0.000 claims description 111
- 239000000758 substrate Substances 0.000 claims description 95
- 239000002253 acid Substances 0.000 claims description 72
- 239000000463 material Substances 0.000 claims description 66
- 150000001875 compounds Chemical class 0.000 claims description 65
- 229910052751 metal Inorganic materials 0.000 claims description 65
- 239000002184 metal Substances 0.000 claims description 65
- 150000003839 salts Chemical class 0.000 claims description 55
- 239000000203 mixture Substances 0.000 claims description 50
- 230000001112 coagulating effect Effects 0.000 claims description 48
- 239000002245 particle Substances 0.000 claims description 44
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 42
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 32
- 238000010438 heat treatment Methods 0.000 claims description 29
- 229910052782 aluminium Inorganic materials 0.000 claims description 27
- 238000009792 diffusion process Methods 0.000 claims description 24
- 239000002923 metal particle Substances 0.000 claims description 24
- 239000011236 particulate material Substances 0.000 claims description 23
- 239000007787 solid Substances 0.000 claims description 23
- 239000000243 solution Substances 0.000 claims description 22
- 239000002585 base Substances 0.000 claims description 19
- 229910045601 alloy Inorganic materials 0.000 claims description 17
- 239000000956 alloy Substances 0.000 claims description 17
- 239000003973 paint Substances 0.000 claims description 15
- 239000007864 aqueous solution Substances 0.000 claims description 14
- 239000000919 ceramic Substances 0.000 claims description 14
- 239000000843 powder Substances 0.000 claims description 14
- 230000001464 adherent effect Effects 0.000 claims description 13
- 239000012298 atmosphere Substances 0.000 claims description 13
- 125000004432 carbon atom Chemical group C* 0.000 claims description 13
- 229910000831 Steel Inorganic materials 0.000 claims description 12
- 239000010959 steel Substances 0.000 claims description 12
- 239000011521 glass Substances 0.000 claims description 11
- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical compound O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 claims description 10
- 239000008399 tap water Substances 0.000 claims description 10
- 235000020679 tap water Nutrition 0.000 claims description 10
- XTVVROIMIGLXTD-UHFFFAOYSA-N copper(II) nitrate Chemical compound [Cu+2].[O-][N+]([O-])=O.[O-][N+]([O-])=O XTVVROIMIGLXTD-UHFFFAOYSA-N 0.000 claims description 9
- 239000000178 monomer Substances 0.000 claims description 9
- 229910021586 Nickel(II) chloride Inorganic materials 0.000 claims description 8
- ORTQZVOHEJQUHG-UHFFFAOYSA-L copper(II) chloride Chemical compound Cl[Cu]Cl ORTQZVOHEJQUHG-UHFFFAOYSA-L 0.000 claims description 8
- QMMRZOWCJAIUJA-UHFFFAOYSA-L nickel dichloride Chemical compound Cl[Ni]Cl QMMRZOWCJAIUJA-UHFFFAOYSA-L 0.000 claims description 8
- 238000005422 blasting Methods 0.000 claims description 7
- 150000001447 alkali salts Chemical class 0.000 claims description 6
- 238000000354 decomposition reaction Methods 0.000 claims description 6
- 238000007654 immersion Methods 0.000 claims description 6
- 229920003023 plastic Polymers 0.000 claims description 6
- 239000004033 plastic Substances 0.000 claims description 6
- 229910052783 alkali metal Inorganic materials 0.000 claims description 5
- 125000004433 nitrogen atom Chemical group N* 0.000 claims description 5
- 239000002023 wood Substances 0.000 claims description 5
- 150000008044 alkali metal hydroxides Chemical group 0.000 claims description 4
- GVPFVAHMJGGAJG-UHFFFAOYSA-L cobalt dichloride Chemical compound [Cl-].[Cl-].[Co+2] GVPFVAHMJGGAJG-UHFFFAOYSA-L 0.000 claims description 4
- 229940097267 cobaltous chloride Drugs 0.000 claims description 4
- 229960003280 cupric chloride Drugs 0.000 claims description 4
- JIAARYAFYJHUJI-UHFFFAOYSA-L zinc dichloride Chemical compound [Cl-].[Cl-].[Zn+2] JIAARYAFYJHUJI-UHFFFAOYSA-L 0.000 claims description 4
- 229910000838 Al alloy Inorganic materials 0.000 claims description 3
- 150000001340 alkali metals Chemical class 0.000 claims description 3
- ARUVKPQLZAKDPS-UHFFFAOYSA-L copper(II) sulfate Chemical compound [Cu+2].[O-][S+2]([O-])([O-])[O-] ARUVKPQLZAKDPS-UHFFFAOYSA-L 0.000 claims description 3
- 229910000366 copper(II) sulfate Inorganic materials 0.000 claims description 3
- 239000004744 fabric Substances 0.000 claims description 3
- 230000008018 melting Effects 0.000 claims description 3
- 238000002844 melting Methods 0.000 claims description 3
- KBJMLQFLOWQJNF-UHFFFAOYSA-N nickel(ii) nitrate Chemical compound [Ni+2].[O-][N+]([O-])=O.[O-][N+]([O-])=O KBJMLQFLOWQJNF-UHFFFAOYSA-N 0.000 claims description 3
- 239000000123 paper Substances 0.000 claims description 3
- 230000007704 transition Effects 0.000 claims description 3
- BDAGIHXWWSANSR-UHFFFAOYSA-M Formate Chemical compound [O-]C=O BDAGIHXWWSANSR-UHFFFAOYSA-M 0.000 claims description 2
- BPQQTUXANYXVAA-UHFFFAOYSA-N Orthosilicate Chemical compound [O-][Si]([O-])([O-])[O-] BPQQTUXANYXVAA-UHFFFAOYSA-N 0.000 claims description 2
- MUBZPKHOEPUJKR-UHFFFAOYSA-N Oxalic acid Chemical compound OC(=O)C(O)=O MUBZPKHOEPUJKR-UHFFFAOYSA-N 0.000 claims description 2
- 125000005587 carbonate group Chemical group 0.000 claims description 2
- 229910044991 metal oxide Inorganic materials 0.000 claims description 2
- 150000004706 metal oxides Chemical class 0.000 claims description 2
- YGSDEFSMJLZEOE-UHFFFAOYSA-M salicylate Chemical compound OC1=CC=CC=C1C([O-])=O YGSDEFSMJLZEOE-UHFFFAOYSA-M 0.000 claims description 2
- 229960001860 salicylate Drugs 0.000 claims description 2
- 239000012266 salt solution Substances 0.000 claims description 2
- 238000009834 vaporization Methods 0.000 claims description 2
- 230000008016 vaporization Effects 0.000 claims description 2
- 239000011592 zinc chloride Substances 0.000 claims description 2
- 235000005074 zinc chloride Nutrition 0.000 claims description 2
- LRXTYHSAJDENHV-UHFFFAOYSA-H zinc phosphate Chemical compound [Zn+2].[Zn+2].[Zn+2].[O-]P([O-])([O-])=O.[O-]P([O-])([O-])=O LRXTYHSAJDENHV-UHFFFAOYSA-H 0.000 claims description 2
- 229910000165 zinc phosphate Inorganic materials 0.000 claims description 2
- 239000004411 aluminium Substances 0.000 claims 7
- 230000000694 effects Effects 0.000 claims 1
- -1 hydrochloric Chemical class 0.000 description 27
- 239000000049 pigment Substances 0.000 description 24
- HEMHJVSKTPXQMS-UHFFFAOYSA-M Sodium hydroxide Chemical compound [OH-].[Na+] HEMHJVSKTPXQMS-UHFFFAOYSA-M 0.000 description 23
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 22
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 16
- 150000001412 amines Chemical class 0.000 description 12
- 239000006185 dispersion Substances 0.000 description 12
- KUBDPQJOLOUJRM-UHFFFAOYSA-N 2-(chloromethyl)oxirane;4-[2-(4-hydroxyphenyl)propan-2-yl]phenol Chemical compound ClCC1CO1.C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 KUBDPQJOLOUJRM-UHFFFAOYSA-N 0.000 description 11
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 11
- 239000000701 coagulant Substances 0.000 description 11
- 238000005260 corrosion Methods 0.000 description 11
- 230000007797 corrosion Effects 0.000 description 11
- 150000007513 acids Chemical class 0.000 description 10
- 239000011230 binding agent Substances 0.000 description 10
- 229920001577 copolymer Polymers 0.000 description 10
- 239000003381 stabilizer Substances 0.000 description 10
- 230000002378 acidificating effect Effects 0.000 description 9
- 229910052759 nickel Inorganic materials 0.000 description 9
- 239000000047 product Substances 0.000 description 9
- PPBRXRYQALVLMV-UHFFFAOYSA-N Styrene Chemical compound C=CC1=CC=CC=C1 PPBRXRYQALVLMV-UHFFFAOYSA-N 0.000 description 8
- 239000007795 chemical reaction product Substances 0.000 description 8
- 239000008367 deionised water Substances 0.000 description 8
- 229910021641 deionized water Inorganic materials 0.000 description 8
- 239000003822 epoxy resin Substances 0.000 description 8
- 150000002739 metals Chemical class 0.000 description 8
- 229920000647 polyepoxide Polymers 0.000 description 8
- 229920000642 polymer Polymers 0.000 description 8
- 239000002904 solvent Substances 0.000 description 8
- NIXOWILDQLNWCW-UHFFFAOYSA-N 2-Propenoic acid Natural products OC(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 7
- 125000003277 amino group Chemical group 0.000 description 7
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N phenol group Chemical group C1(=CC=CC=C1)O ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 7
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 description 7
- 239000000126 substance Substances 0.000 description 7
- 229920003002 synthetic resin Polymers 0.000 description 7
- 239000004925 Acrylic resin Substances 0.000 description 6
- OKKJLVBELUTLKV-UHFFFAOYSA-N Methanol Chemical compound OC OKKJLVBELUTLKV-UHFFFAOYSA-N 0.000 description 6
- 239000004677 Nylon Substances 0.000 description 6
- 239000003513 alkali Substances 0.000 description 6
- 125000000129 anionic group Chemical group 0.000 description 6
- 125000002091 cationic group Chemical group 0.000 description 6
- 238000006243 chemical reaction Methods 0.000 description 6
- 239000003795 chemical substances by application Substances 0.000 description 6
- 229910017052 cobalt Inorganic materials 0.000 description 6
- 239000010941 cobalt Substances 0.000 description 6
- GUTLYIVDDKVIGB-UHFFFAOYSA-N cobalt atom Chemical compound [Co] GUTLYIVDDKVIGB-UHFFFAOYSA-N 0.000 description 6
- 229910021645 metal ion Inorganic materials 0.000 description 6
- 229920001778 nylon Polymers 0.000 description 6
- 239000003921 oil Substances 0.000 description 6
- 125000002924 primary amino group Chemical group [H]N([H])* 0.000 description 6
- 239000000057 synthetic resin Substances 0.000 description 6
- QTBSBXVTEAMEQO-UHFFFAOYSA-N Acetic acid Chemical compound CC(O)=O QTBSBXVTEAMEQO-UHFFFAOYSA-N 0.000 description 5
- 238000013019 agitation Methods 0.000 description 5
- 229910052804 chromium Inorganic materials 0.000 description 5
- 239000011651 chromium Substances 0.000 description 5
- LVTYICIALWPMFW-UHFFFAOYSA-N diisopropanolamine Chemical compound CC(O)CNCC(C)O LVTYICIALWPMFW-UHFFFAOYSA-N 0.000 description 5
- 229940043276 diisopropanolamine Drugs 0.000 description 5
- 239000000839 emulsion Substances 0.000 description 5
- 150000002500 ions Chemical class 0.000 description 5
- 229910052742 iron Inorganic materials 0.000 description 5
- 229920000126 latex Polymers 0.000 description 5
- 235000019198 oils Nutrition 0.000 description 5
- 230000003647 oxidation Effects 0.000 description 5
- 238000007254 oxidation reaction Methods 0.000 description 5
- 229920006122 polyamide resin Polymers 0.000 description 5
- 239000002562 thickening agent Substances 0.000 description 5
- 229920002554 vinyl polymer Polymers 0.000 description 5
- SMZOUWXMTYCWNB-UHFFFAOYSA-N 2-(2-methoxy-5-methylphenyl)ethanamine Chemical compound COC1=CC=C(C)C=C1CCN SMZOUWXMTYCWNB-UHFFFAOYSA-N 0.000 description 4
- NIXOWILDQLNWCW-UHFFFAOYSA-M Acrylate Chemical compound [O-]C(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-M 0.000 description 4
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 description 4
- RPNUMPOLZDHAAY-UHFFFAOYSA-N Diethylenetriamine Chemical compound NCCNCCN RPNUMPOLZDHAAY-UHFFFAOYSA-N 0.000 description 4
- 239000004606 Fillers/Extenders Substances 0.000 description 4
- KRHYYFGTRYWZRS-UHFFFAOYSA-N Fluorane Chemical compound F KRHYYFGTRYWZRS-UHFFFAOYSA-N 0.000 description 4
- VEXZGXHMUGYJMC-UHFFFAOYSA-N Hydrochloric acid Chemical compound Cl VEXZGXHMUGYJMC-UHFFFAOYSA-N 0.000 description 4
- 239000005062 Polybutadiene Substances 0.000 description 4
- 239000003945 anionic surfactant Substances 0.000 description 4
- 239000001913 cellulose Substances 0.000 description 4
- 229920002678 cellulose Polymers 0.000 description 4
- 239000012141 concentrate Substances 0.000 description 4
- 238000000151 deposition Methods 0.000 description 4
- 230000008021 deposition Effects 0.000 description 4
- 239000012153 distilled water Substances 0.000 description 4
- 230000000873 masking effect Effects 0.000 description 4
- 238000012986 modification Methods 0.000 description 4
- 230000004048 modification Effects 0.000 description 4
- QJGQUHMNIGDVPM-UHFFFAOYSA-N nitrogen group Chemical group [N] QJGQUHMNIGDVPM-UHFFFAOYSA-N 0.000 description 4
- 150000007524 organic acids Chemical class 0.000 description 4
- 230000001590 oxidative effect Effects 0.000 description 4
- 229920001568 phenolic resin Polymers 0.000 description 4
- 239000005011 phenolic resin Substances 0.000 description 4
- 229920000058 polyacrylate Polymers 0.000 description 4
- 229920000768 polyamine Polymers 0.000 description 4
- 229920002857 polybutadiene Polymers 0.000 description 4
- 239000000725 suspension Substances 0.000 description 4
- 239000010936 titanium Substances 0.000 description 4
- 238000011282 treatment Methods 0.000 description 4
- KXGFMDJXCMQABM-UHFFFAOYSA-N 2-methoxy-6-methylphenol Chemical compound [CH]OC1=CC=CC([CH])=C1O KXGFMDJXCMQABM-UHFFFAOYSA-N 0.000 description 3
- IAYPIBMASNFSPL-UHFFFAOYSA-N Ethylene oxide Chemical compound C1CO1 IAYPIBMASNFSPL-UHFFFAOYSA-N 0.000 description 3
- PIICEJLVQHRZGT-UHFFFAOYSA-N Ethylenediamine Chemical compound NCCN PIICEJLVQHRZGT-UHFFFAOYSA-N 0.000 description 3
- 229910001209 Low-carbon steel Inorganic materials 0.000 description 3
- CERQOIWHTDAKMF-UHFFFAOYSA-M Methacrylate Chemical compound CC(=C)C([O-])=O CERQOIWHTDAKMF-UHFFFAOYSA-M 0.000 description 3
- CERQOIWHTDAKMF-UHFFFAOYSA-N Methacrylic acid Chemical compound CC(=C)C(O)=O CERQOIWHTDAKMF-UHFFFAOYSA-N 0.000 description 3
- KWYUFKZDYYNOTN-UHFFFAOYSA-M Potassium hydroxide Chemical compound [OH-].[K+] KWYUFKZDYYNOTN-UHFFFAOYSA-M 0.000 description 3
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 3
- ZMANZCXQSJIPKH-UHFFFAOYSA-N Triethylamine Chemical compound CCN(CC)CC ZMANZCXQSJIPKH-UHFFFAOYSA-N 0.000 description 3
- 229960000583 acetic acid Drugs 0.000 description 3
- 125000002015 acyclic group Chemical group 0.000 description 3
- 229920000180 alkyd Polymers 0.000 description 3
- 239000003054 catalyst Substances 0.000 description 3
- KRKNYBCHXYNGOX-UHFFFAOYSA-N citric acid Chemical compound OC(=O)CC(O)(C(O)=O)CC(O)=O KRKNYBCHXYNGOX-UHFFFAOYSA-N 0.000 description 3
- 239000008199 coating composition Substances 0.000 description 3
- HPNMFZURTQLUMO-UHFFFAOYSA-N diethylamine Chemical compound CCNCC HPNMFZURTQLUMO-UHFFFAOYSA-N 0.000 description 3
- 239000000539 dimer Substances 0.000 description 3
- 238000001035 drying Methods 0.000 description 3
- 238000004070 electrodeposition Methods 0.000 description 3
- 125000003700 epoxy group Chemical group 0.000 description 3
- 150000002148 esters Chemical class 0.000 description 3
- 238000010304 firing Methods 0.000 description 3
- 229940093915 gynecological organic acid Drugs 0.000 description 3
- 229910052500 inorganic mineral Inorganic materials 0.000 description 3
- 239000011707 mineral Substances 0.000 description 3
- 235000010755 mineral Nutrition 0.000 description 3
- 229910052750 molybdenum Inorganic materials 0.000 description 3
- LAIZPRYFQUWUBN-UHFFFAOYSA-L nickel chloride hexahydrate Chemical compound O.O.O.O.O.O.[Cl-].[Cl-].[Ni+2] LAIZPRYFQUWUBN-UHFFFAOYSA-L 0.000 description 3
- 239000002736 nonionic surfactant Substances 0.000 description 3
- 235000005985 organic acids Nutrition 0.000 description 3
- 239000003960 organic solvent Substances 0.000 description 3
- KDLHZDBZIXYQEI-UHFFFAOYSA-N palladium Substances [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 description 3
- 229910052697 platinum Inorganic materials 0.000 description 3
- 238000012545 processing Methods 0.000 description 3
- 150000004760 silicates Chemical class 0.000 description 3
- 229920001169 thermoplastic Polymers 0.000 description 3
- 239000004416 thermosoftening plastic Substances 0.000 description 3
- 229910052719 titanium Inorganic materials 0.000 description 3
- 125000000391 vinyl group Chemical group [H]C([*])=C([H])[H] 0.000 description 3
- OZAIFHULBGXAKX-UHFFFAOYSA-N 2-(2-cyanopropan-2-yldiazenyl)-2-methylpropanenitrile Chemical compound N#CC(C)(C)N=NC(C)(C)C#N OZAIFHULBGXAKX-UHFFFAOYSA-N 0.000 description 2
- GOXQRTZXKQZDDN-UHFFFAOYSA-N 2-Ethylhexyl acrylate Chemical compound CCCCC(CC)COC(=O)C=C GOXQRTZXKQZDDN-UHFFFAOYSA-N 0.000 description 2
- POAOYUHQDCAZBD-UHFFFAOYSA-N 2-butoxyethanol Chemical compound CCCCOCCO POAOYUHQDCAZBD-UHFFFAOYSA-N 0.000 description 2
- HGINCPLSRVDWNT-UHFFFAOYSA-N Acrolein Chemical compound C=CC=O HGINCPLSRVDWNT-UHFFFAOYSA-N 0.000 description 2
- QGZKDVFQNNGYKY-UHFFFAOYSA-N Ammonia Chemical compound N QGZKDVFQNNGYKY-UHFFFAOYSA-N 0.000 description 2
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 2
- KAKZBPTYRLMSJV-UHFFFAOYSA-N Butadiene Chemical compound C=CC=C KAKZBPTYRLMSJV-UHFFFAOYSA-N 0.000 description 2
- 229910000975 Carbon steel Inorganic materials 0.000 description 2
- 229910000531 Co alloy Inorganic materials 0.000 description 2
- 239000004593 Epoxy Substances 0.000 description 2
- LYCAIKOWRPUZTN-UHFFFAOYSA-N Ethylene glycol Chemical compound OCCO LYCAIKOWRPUZTN-UHFFFAOYSA-N 0.000 description 2
- 229910000640 Fe alloy Inorganic materials 0.000 description 2
- VZCYOOQTPOCHFL-OWOJBTEDSA-N Fumaric acid Chemical compound OC(=O)\C=C\C(O)=O VZCYOOQTPOCHFL-OWOJBTEDSA-N 0.000 description 2
- 239000013032 Hydrocarbon resin Substances 0.000 description 2
- WOBHKFSMXKNTIM-UHFFFAOYSA-N Hydroxyethyl methacrylate Chemical compound CC(=C)C(=O)OCCO WOBHKFSMXKNTIM-UHFFFAOYSA-N 0.000 description 2
- OFOBLEOULBTSOW-UHFFFAOYSA-N Malonic acid Chemical compound OC(=O)CC(O)=O OFOBLEOULBTSOW-UHFFFAOYSA-N 0.000 description 2
- BAPJBEWLBFYGME-UHFFFAOYSA-N Methyl acrylate Chemical compound COC(=O)C=C BAPJBEWLBFYGME-UHFFFAOYSA-N 0.000 description 2
- ZOKXTWBITQBERF-UHFFFAOYSA-N Molybdenum Chemical compound [Mo] ZOKXTWBITQBERF-UHFFFAOYSA-N 0.000 description 2
- 229910000990 Ni alloy Inorganic materials 0.000 description 2
- NBIIXXVUZAFLBC-UHFFFAOYSA-N Phosphoric acid Chemical compound OP(O)(O)=O NBIIXXVUZAFLBC-UHFFFAOYSA-N 0.000 description 2
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 2
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 2
- FEWJPZIEWOKRBE-UHFFFAOYSA-N Tartaric acid Natural products [H+].[H+].[O-]C(=O)C(O)C(O)C([O-])=O FEWJPZIEWOKRBE-UHFFFAOYSA-N 0.000 description 2
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Natural products CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 description 2
- XTXRWKRVRITETP-UHFFFAOYSA-N Vinyl acetate Chemical compound CC(=O)OC=C XTXRWKRVRITETP-UHFFFAOYSA-N 0.000 description 2
- BZHJMEDXRYGGRV-UHFFFAOYSA-N Vinyl chloride Chemical compound ClC=C BZHJMEDXRYGGRV-UHFFFAOYSA-N 0.000 description 2
- QCWXUUIWCKQGHC-UHFFFAOYSA-N Zirconium Chemical compound [Zr] QCWXUUIWCKQGHC-UHFFFAOYSA-N 0.000 description 2
- WNLRTRBMVRJNCN-UHFFFAOYSA-N adipic acid Chemical compound OC(=O)CCCCC(O)=O WNLRTRBMVRJNCN-UHFFFAOYSA-N 0.000 description 2
- 125000001931 aliphatic group Chemical group 0.000 description 2
- 125000000217 alkyl group Chemical group 0.000 description 2
- 238000005275 alloying Methods 0.000 description 2
- VSCWAEJMTAWNJL-UHFFFAOYSA-K aluminium trichloride Chemical compound Cl[Al](Cl)Cl VSCWAEJMTAWNJL-UHFFFAOYSA-K 0.000 description 2
- 238000010420 art technique Methods 0.000 description 2
- 230000008901 benefit Effects 0.000 description 2
- 230000015572 biosynthetic process Effects 0.000 description 2
- 150000007942 carboxylates Chemical class 0.000 description 2
- 150000001732 carboxylic acid derivatives Chemical class 0.000 description 2
- 229920002301 cellulose acetate Polymers 0.000 description 2
- HNEGQIOMVPPMNR-IHWYPQMZSA-N citraconic acid Chemical compound OC(=O)C(/C)=C\C(O)=O HNEGQIOMVPPMNR-IHWYPQMZSA-N 0.000 description 2
- UFMZWBIQTDUYBN-UHFFFAOYSA-N cobalt dinitrate Chemical compound [Co+2].[O-][N+]([O-])=O.[O-][N+]([O-])=O UFMZWBIQTDUYBN-UHFFFAOYSA-N 0.000 description 2
- 230000003750 conditioning effect Effects 0.000 description 2
- 239000003431 cross linking reagent Substances 0.000 description 2
- ZSWFCLXCOIISFI-UHFFFAOYSA-N cyclopentadiene Chemical compound C1C=CC=C1 ZSWFCLXCOIISFI-UHFFFAOYSA-N 0.000 description 2
- 230000007812 deficiency Effects 0.000 description 2
- 210000003298 dental enamel Anatomy 0.000 description 2
- 150000004985 diamines Chemical class 0.000 description 2
- JQVDAXLFBXTEQA-UHFFFAOYSA-N dibutylamine Chemical compound CCCCNCCCC JQVDAXLFBXTEQA-UHFFFAOYSA-N 0.000 description 2
- QDOXWKRWXJOMAK-UHFFFAOYSA-N dichromium trioxide Chemical compound O=[Cr]O[Cr]=O QDOXWKRWXJOMAK-UHFFFAOYSA-N 0.000 description 2
- GYZLOYUZLJXAJU-UHFFFAOYSA-N diglycidyl ether Chemical compound C1OC1COCC1CO1 GYZLOYUZLJXAJU-UHFFFAOYSA-N 0.000 description 2
- XBDQKXXYIPTUBI-UHFFFAOYSA-N dimethylselenoniopropionate Natural products CCC(O)=O XBDQKXXYIPTUBI-UHFFFAOYSA-N 0.000 description 2
- 238000007598 dipping method Methods 0.000 description 2
- JRBPAEWTRLWTQC-UHFFFAOYSA-N dodecylamine Chemical compound CCCCCCCCCCCCN JRBPAEWTRLWTQC-UHFFFAOYSA-N 0.000 description 2
- 150000002118 epoxides Chemical class 0.000 description 2
- JBKVHLHDHHXQEQ-UHFFFAOYSA-N epsilon-caprolactam Chemical compound O=C1CCCCCN1 JBKVHLHDHHXQEQ-UHFFFAOYSA-N 0.000 description 2
- 150000004675 formic acid derivatives Chemical class 0.000 description 2
- 239000012362 glacial acetic acid Substances 0.000 description 2
- 125000005456 glyceride group Chemical group 0.000 description 2
- 125000003055 glycidyl group Chemical group C(C1CO1)* 0.000 description 2
- VOZRXNHHFUQHIL-UHFFFAOYSA-N glycidyl methacrylate Chemical compound CC(=C)C(=O)OCC1CO1 VOZRXNHHFUQHIL-UHFFFAOYSA-N 0.000 description 2
- LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical compound C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 description 2
- VKYKSIONXSXAKP-UHFFFAOYSA-N hexamethylenetetramine Chemical compound C1N(C2)CN3CN1CN2C3 VKYKSIONXSXAKP-UHFFFAOYSA-N 0.000 description 2
- 229920006270 hydrocarbon resin Polymers 0.000 description 2
- 230000002401 inhibitory effect Effects 0.000 description 2
- QQVIHTHCMHWDBS-UHFFFAOYSA-N isophthalic acid Chemical compound OC(=O)C1=CC=CC(C(O)=O)=C1 QQVIHTHCMHWDBS-UHFFFAOYSA-N 0.000 description 2
- 239000000944 linseed oil Substances 0.000 description 2
- 239000000314 lubricant Substances 0.000 description 2
- FPYJFEHAWHCUMM-UHFFFAOYSA-N maleic anhydride Chemical compound O=C1OC(=O)C=C1 FPYJFEHAWHCUMM-UHFFFAOYSA-N 0.000 description 2
- 239000011572 manganese Substances 0.000 description 2
- 230000007246 mechanism Effects 0.000 description 2
- BDAGIHXWWSANSR-UHFFFAOYSA-N methanoic acid Natural products OC=O BDAGIHXWWSANSR-UHFFFAOYSA-N 0.000 description 2
- CRVGTESFCCXCTH-UHFFFAOYSA-N methyl diethanolamine Chemical compound OCCN(C)CCO CRVGTESFCCXCTH-UHFFFAOYSA-N 0.000 description 2
- 239000003607 modifier Substances 0.000 description 2
- 239000011733 molybdenum Substances 0.000 description 2
- 230000007935 neutral effect Effects 0.000 description 2
- 230000003472 neutralizing effect Effects 0.000 description 2
- 150000004027 organic amino compounds Chemical class 0.000 description 2
- 150000003891 oxalate salts Chemical class 0.000 description 2
- 239000007800 oxidant agent Substances 0.000 description 2
- 229920002037 poly(vinyl butyral) polymer Polymers 0.000 description 2
- 229920000728 polyester Polymers 0.000 description 2
- 229920001225 polyester resin Polymers 0.000 description 2
- 239000004645 polyester resin Substances 0.000 description 2
- 229920005862 polyol Polymers 0.000 description 2
- 229920005672 polyolefin resin Polymers 0.000 description 2
- 150000003077 polyols Chemical class 0.000 description 2
- 150000007519 polyprotic acids Polymers 0.000 description 2
- 229920005749 polyurethane resin Polymers 0.000 description 2
- 238000002360 preparation method Methods 0.000 description 2
- BDERNNFJNOPAEC-UHFFFAOYSA-N propan-1-ol Chemical compound CCCO BDERNNFJNOPAEC-UHFFFAOYSA-N 0.000 description 2
- 239000011253 protective coating Substances 0.000 description 2
- 230000001681 protective effect Effects 0.000 description 2
- 239000011819 refractory material Substances 0.000 description 2
- 229910052709 silver Inorganic materials 0.000 description 2
- 239000004332 silver Substances 0.000 description 2
- SQGYOTSLMSWVJD-UHFFFAOYSA-N silver(1+) nitrate Chemical compound [Ag+].[O-]N(=O)=O SQGYOTSLMSWVJD-UHFFFAOYSA-N 0.000 description 2
- 230000003381 solubilizing effect Effects 0.000 description 2
- 150000003467 sulfuric acid derivatives Chemical class 0.000 description 2
- 229910052715 tantalum Inorganic materials 0.000 description 2
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N titanium dioxide Inorganic materials O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 description 2
- 239000003981 vehicle Substances 0.000 description 2
- 229910052726 zirconium Inorganic materials 0.000 description 2
- ALSTYHKOOCGGFT-KTKRTIGZSA-N (9Z)-octadecen-1-ol Chemical compound CCCCCCCC\C=C/CCCCCCCCO ALSTYHKOOCGGFT-KTKRTIGZSA-N 0.000 description 1
- 229920002818 (Hydroxyethyl)methacrylate Polymers 0.000 description 1
- BJEPYKJPYRNKOW-REOHCLBHSA-N (S)-malic acid Chemical compound OC(=O)[C@@H](O)CC(O)=O BJEPYKJPYRNKOW-REOHCLBHSA-N 0.000 description 1
- XGIKILRODBEJIL-UHFFFAOYSA-N 1-(ethylamino)ethanol Chemical compound CCNC(C)O XGIKILRODBEJIL-UHFFFAOYSA-N 0.000 description 1
- HXKKHQJGJAFBHI-UHFFFAOYSA-N 1-aminopropan-2-ol Chemical compound CC(O)CN HXKKHQJGJAFBHI-UHFFFAOYSA-N 0.000 description 1
- PAOHAQSLJSMLAT-UHFFFAOYSA-N 1-butylperoxybutane Chemical group CCCCOOCCCC PAOHAQSLJSMLAT-UHFFFAOYSA-N 0.000 description 1
- OZCMOJQQLBXBKI-UHFFFAOYSA-N 1-ethenoxy-2-methylpropane Chemical compound CC(C)COC=C OZCMOJQQLBXBKI-UHFFFAOYSA-N 0.000 description 1
- OSSNTDFYBPYIEC-UHFFFAOYSA-N 1-ethenylimidazole Chemical compound C=CN1C=CN=C1 OSSNTDFYBPYIEC-UHFFFAOYSA-N 0.000 description 1
- VXYQHUWWRWOEBB-UHFFFAOYSA-N 2,11-dioctyldodecanedioic acid Chemical compound CCCCCCCCC(CCCCCCCCC(CCCCCCCC)C(O)=O)C(O)=O VXYQHUWWRWOEBB-UHFFFAOYSA-N 0.000 description 1
- VILCJCGEZXAXTO-UHFFFAOYSA-N 2,2,2-tetramine Chemical compound NCCNCCNCCN VILCJCGEZXAXTO-UHFFFAOYSA-N 0.000 description 1
- FXNDIJDIPNCZQJ-UHFFFAOYSA-N 2,4,4-trimethylpent-1-ene Chemical group CC(=C)CC(C)(C)C FXNDIJDIPNCZQJ-UHFFFAOYSA-N 0.000 description 1
- STMDPCBYJCIZOD-UHFFFAOYSA-N 2-(2,4-dinitroanilino)-4-methylpentanoic acid Chemical compound CC(C)CC(C(O)=O)NC1=CC=C([N+]([O-])=O)C=C1[N+]([O-])=O STMDPCBYJCIZOD-UHFFFAOYSA-N 0.000 description 1
- OEPOKWHJYJXUGD-UHFFFAOYSA-N 2-(3-phenylmethoxyphenyl)-1,3-thiazole-4-carbaldehyde Chemical compound O=CC1=CSC(C=2C=C(OCC=3C=CC=CC=3)C=CC=2)=N1 OEPOKWHJYJXUGD-UHFFFAOYSA-N 0.000 description 1
- RSNDTPFSMDVWCS-UHFFFAOYSA-N 2-(butoxymethyl)prop-2-enamide Chemical compound CCCCOCC(=C)C(N)=O RSNDTPFSMDVWCS-UHFFFAOYSA-N 0.000 description 1
- JKNCOURZONDCGV-UHFFFAOYSA-N 2-(dimethylamino)ethyl 2-methylprop-2-enoate Chemical compound CN(C)CCOC(=O)C(C)=C JKNCOURZONDCGV-UHFFFAOYSA-N 0.000 description 1
- DPBJAVGHACCNRL-UHFFFAOYSA-N 2-(dimethylamino)ethyl prop-2-enoate Chemical compound CN(C)CCOC(=O)C=C DPBJAVGHACCNRL-UHFFFAOYSA-N 0.000 description 1
- HZLYGAQNCRJBDT-UHFFFAOYSA-N 2-(ethylamino)propan-2-ol Chemical compound CCNC(C)(C)O HZLYGAQNCRJBDT-UHFFFAOYSA-N 0.000 description 1
- ULEVTQHCVWIDPC-UHFFFAOYSA-N 2-(methylamino)ethyl prop-2-enoate Chemical compound CNCCOC(=O)C=C ULEVTQHCVWIDPC-UHFFFAOYSA-N 0.000 description 1
- HZAXFHJVJLSVMW-UHFFFAOYSA-N 2-Aminoethan-1-ol Chemical compound NCCO HZAXFHJVJLSVMW-UHFFFAOYSA-N 0.000 description 1
- LLUZMBOVFAZJPE-UHFFFAOYSA-N 2-aminoethanol;ethane-1,2-diamine Chemical compound NCCN.NCCO LLUZMBOVFAZJPE-UHFFFAOYSA-N 0.000 description 1
- QLIBJPGWWSHWBF-UHFFFAOYSA-N 2-aminoethyl methacrylate Chemical compound CC(=C)C(=O)OCCN QLIBJPGWWSHWBF-UHFFFAOYSA-N 0.000 description 1
- UGIJCMNGQCUTPI-UHFFFAOYSA-N 2-aminoethyl prop-2-enoate Chemical compound NCCOC(=O)C=C UGIJCMNGQCUTPI-UHFFFAOYSA-N 0.000 description 1
- ZNQVEEAIQZEUHB-UHFFFAOYSA-N 2-ethoxyethanol Chemical compound CCOCCO ZNQVEEAIQZEUHB-UHFFFAOYSA-N 0.000 description 1
- RUMACXVDVNRZJZ-UHFFFAOYSA-N 2-methylpropyl 2-methylprop-2-enoate Chemical compound CC(C)COC(=O)C(C)=C RUMACXVDVNRZJZ-UHFFFAOYSA-N 0.000 description 1
- KFZMGEQAYNKOFK-UHFFFAOYSA-N 2-propanol Substances CC(C)O KFZMGEQAYNKOFK-UHFFFAOYSA-N 0.000 description 1
- KGIGUEBEKRSTEW-UHFFFAOYSA-N 2-vinylpyridine Chemical compound C=CC1=CC=CC=N1 KGIGUEBEKRSTEW-UHFFFAOYSA-N 0.000 description 1
- ZSLUVFAKFWKJRC-IGMARMGPSA-N 232Th Chemical compound [232Th] ZSLUVFAKFWKJRC-IGMARMGPSA-N 0.000 description 1
- XYUINKARGUCCQJ-UHFFFAOYSA-N 3-imino-n-propylpropan-1-amine Chemical compound CCCNCCC=N XYUINKARGUCCQJ-UHFFFAOYSA-N 0.000 description 1
- AYKYXWQEBUNJCN-UHFFFAOYSA-N 3-methylfuran-2,5-dione Chemical compound CC1=CC(=O)OC1=O AYKYXWQEBUNJCN-UHFFFAOYSA-N 0.000 description 1
- OSWFIVFLDKOXQC-UHFFFAOYSA-N 4-(3-methoxyphenyl)aniline Chemical compound COC1=CC=CC(C=2C=CC(N)=CC=2)=C1 OSWFIVFLDKOXQC-UHFFFAOYSA-N 0.000 description 1
- BLFRQYKZFKYQLO-UHFFFAOYSA-N 4-aminobutan-1-ol Chemical compound NCCCCO BLFRQYKZFKYQLO-UHFFFAOYSA-N 0.000 description 1
- IEOMKERTJQIKKF-UHFFFAOYSA-N 4-aminobutyl prop-2-enoate Chemical compound NCCCCOC(=O)C=C IEOMKERTJQIKKF-UHFFFAOYSA-N 0.000 description 1
- CSCPPACGZOOCGX-UHFFFAOYSA-N Acetone Chemical class CC(C)=O CSCPPACGZOOCGX-UHFFFAOYSA-N 0.000 description 1
- HRPVXLWXLXDGHG-UHFFFAOYSA-N Acrylamide Chemical compound NC(=O)C=C HRPVXLWXLXDGHG-UHFFFAOYSA-N 0.000 description 1
- NLHHRLWOUZZQLW-UHFFFAOYSA-N Acrylonitrile Chemical compound C=CC#N NLHHRLWOUZZQLW-UHFFFAOYSA-N 0.000 description 1
- 229910000951 Aluminide Inorganic materials 0.000 description 1
- VHUUQVKOLVNVRT-UHFFFAOYSA-N Ammonium hydroxide Chemical compound [NH4+].[OH-] VHUUQVKOLVNVRT-UHFFFAOYSA-N 0.000 description 1
- 229920003319 Araldite® Polymers 0.000 description 1
- 240000002791 Brassica napus Species 0.000 description 1
- 235000004977 Brassica sinapistrum Nutrition 0.000 description 1
- 241000273930 Brevoortia tyrannus Species 0.000 description 1
- XATVIGNYRVCZOR-UHFFFAOYSA-N C(C)(C)NC(C)C.N(CCO)CCO Chemical compound C(C)(C)NC(C)C.N(CCO)CCO XATVIGNYRVCZOR-UHFFFAOYSA-N 0.000 description 1
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 1
- 239000004215 Carbon black (E152) Substances 0.000 description 1
- 244000020518 Carthamus tinctorius Species 0.000 description 1
- 235000003255 Carthamus tinctorius Nutrition 0.000 description 1
- XTEGARKTQYYJKE-UHFFFAOYSA-M Chlorate Chemical class [O-]Cl(=O)=O XTEGARKTQYYJKE-UHFFFAOYSA-M 0.000 description 1
- VEXZGXHMUGYJMC-UHFFFAOYSA-M Chloride anion Chemical compound [Cl-] VEXZGXHMUGYJMC-UHFFFAOYSA-M 0.000 description 1
- 239000004709 Chlorinated polyethylene Substances 0.000 description 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 229910017610 Cu(NO3) Inorganic materials 0.000 description 1
- VKOUCJUTMGHNOR-UHFFFAOYSA-N Diphenolic acid Chemical compound C=1C=C(O)C=CC=1C(CCC(O)=O)(C)C1=CC=C(O)C=C1 VKOUCJUTMGHNOR-UHFFFAOYSA-N 0.000 description 1
- BRLQWZUYTZBJKN-UHFFFAOYSA-N Epichlorohydrin Chemical compound ClCC1CO1 BRLQWZUYTZBJKN-UHFFFAOYSA-N 0.000 description 1
- JIGUQPWFLRLWPJ-UHFFFAOYSA-N Ethyl acrylate Chemical compound CCOC(=O)C=C JIGUQPWFLRLWPJ-UHFFFAOYSA-N 0.000 description 1
- CWYNVVGOOAEACU-UHFFFAOYSA-N Fe2+ Chemical compound [Fe+2] CWYNVVGOOAEACU-UHFFFAOYSA-N 0.000 description 1
- VTLYFUHAOXGGBS-UHFFFAOYSA-N Fe3+ Chemical compound [Fe+3] VTLYFUHAOXGGBS-UHFFFAOYSA-N 0.000 description 1
- 244000068988 Glycine max Species 0.000 description 1
- 235000010469 Glycine max Nutrition 0.000 description 1
- 244000020551 Helianthus annuus Species 0.000 description 1
- 235000003222 Helianthus annuus Nutrition 0.000 description 1
- 239000005057 Hexamethylene diisocyanate Substances 0.000 description 1
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 description 1
- AVXURJPOCDRRFD-UHFFFAOYSA-N Hydroxylamine Chemical compound ON AVXURJPOCDRRFD-UHFFFAOYSA-N 0.000 description 1
- DGAQECJNVWCQMB-PUAWFVPOSA-M Ilexoside XXIX Chemical compound C[C@@H]1CC[C@@]2(CC[C@@]3(C(=CC[C@H]4[C@]3(CC[C@@H]5[C@@]4(CC[C@@H](C5(C)C)OS(=O)(=O)[O-])C)C)[C@@H]2[C@]1(C)O)C)C(=O)O[C@H]6[C@@H]([C@H]([C@@H]([C@H](O6)CO)O)O)O.[Na+] DGAQECJNVWCQMB-PUAWFVPOSA-M 0.000 description 1
- RRHGJUQNOFWUDK-UHFFFAOYSA-N Isoprene Chemical compound CC(=C)C=C RRHGJUQNOFWUDK-UHFFFAOYSA-N 0.000 description 1
- 240000007049 Juglans regia Species 0.000 description 1
- 235000009496 Juglans regia Nutrition 0.000 description 1
- WHXSMMKQMYFTQS-UHFFFAOYSA-N Lithium Chemical compound [Li] WHXSMMKQMYFTQS-UHFFFAOYSA-N 0.000 description 1
- 235000007688 Lycopersicon esculentum Nutrition 0.000 description 1
- FYYHWMGAXLPEAU-UHFFFAOYSA-N Magnesium Chemical compound [Mg] FYYHWMGAXLPEAU-UHFFFAOYSA-N 0.000 description 1
- PWHULOQIROXLJO-UHFFFAOYSA-N Manganese Chemical compound [Mn] PWHULOQIROXLJO-UHFFFAOYSA-N 0.000 description 1
- 239000004640 Melamine resin Substances 0.000 description 1
- 229920000877 Melamine resin Polymers 0.000 description 1
- VVQNEPGJFQJSBK-UHFFFAOYSA-N Methyl methacrylate Chemical compound COC(=O)C(C)=C VVQNEPGJFQJSBK-UHFFFAOYSA-N 0.000 description 1
- 101001034843 Mus musculus Interferon-induced transmembrane protein 1 Proteins 0.000 description 1
- 101001034845 Mus musculus Interferon-induced transmembrane protein 3 Proteins 0.000 description 1
- OPKOKAMJFNKNAS-UHFFFAOYSA-N N-methylethanolamine Chemical compound CNCCO OPKOKAMJFNKNAS-UHFFFAOYSA-N 0.000 description 1
- 229910002651 NO3 Inorganic materials 0.000 description 1
- REYJJPSVUYRZGE-UHFFFAOYSA-N Octadecylamine Chemical compound CCCCCCCCCCCCCCCCCCN REYJJPSVUYRZGE-UHFFFAOYSA-N 0.000 description 1
- 229910019142 PO4 Inorganic materials 0.000 description 1
- 235000004347 Perilla Nutrition 0.000 description 1
- 244000124853 Perilla frutescens Species 0.000 description 1
- FQYUMYWMJTYZTK-UHFFFAOYSA-N Phenyl glycidyl ether Chemical compound C1OC1COC1=CC=CC=C1 FQYUMYWMJTYZTK-UHFFFAOYSA-N 0.000 description 1
- 239000004698 Polyethylene Substances 0.000 description 1
- 239000004743 Polypropylene Substances 0.000 description 1
- 239000004793 Polystyrene Substances 0.000 description 1
- 229920001328 Polyvinylidene chloride Polymers 0.000 description 1
- ZLMJMSJWJFRBEC-UHFFFAOYSA-N Potassium Chemical compound [K] ZLMJMSJWJFRBEC-UHFFFAOYSA-N 0.000 description 1
- GOOHAUXETOMSMM-UHFFFAOYSA-N Propylene oxide Chemical compound CC1CO1 GOOHAUXETOMSMM-UHFFFAOYSA-N 0.000 description 1
- NPXOKRUENSOPAO-UHFFFAOYSA-N Raney nickel Chemical compound [Al].[Ni] NPXOKRUENSOPAO-UHFFFAOYSA-N 0.000 description 1
- 240000003768 Solanum lycopersicum Species 0.000 description 1
- 235000021355 Stearic acid Nutrition 0.000 description 1
- 229910052776 Thorium Inorganic materials 0.000 description 1
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 1
- GSEJCLTVZPLZKY-UHFFFAOYSA-N Triethanolamine Chemical compound OCCN(CCO)CCO GSEJCLTVZPLZKY-UHFFFAOYSA-N 0.000 description 1
- SLINHMUFWFWBMU-UHFFFAOYSA-N Triisopropanolamine Chemical compound CC(O)CN(CC(C)O)CC(C)O SLINHMUFWFWBMU-UHFFFAOYSA-N 0.000 description 1
- 240000008042 Zea mays Species 0.000 description 1
- 235000005824 Zea mays ssp. parviglumis Nutrition 0.000 description 1
- 235000002017 Zea mays subsp mays Nutrition 0.000 description 1
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 description 1
- 239000004957 Zytel Substances 0.000 description 1
- 229920006102 Zytel® Polymers 0.000 description 1
- UJXVAJQDLVNWPS-UHFFFAOYSA-N [Al].[Al].[Al].[Fe] Chemical compound [Al].[Al].[Al].[Fe] UJXVAJQDLVNWPS-UHFFFAOYSA-N 0.000 description 1
- 238000009825 accumulation Methods 0.000 description 1
- 235000011054 acetic acid Nutrition 0.000 description 1
- 150000001242 acetic acid derivatives Chemical class 0.000 description 1
- 150000001252 acrylic acid derivatives Chemical class 0.000 description 1
- 125000005396 acrylic acid ester group Chemical group 0.000 description 1
- 150000001253 acrylic acids Chemical class 0.000 description 1
- 229920006243 acrylic copolymer Polymers 0.000 description 1
- 239000000654 additive Substances 0.000 description 1
- 239000001361 adipic acid Substances 0.000 description 1
- 235000011037 adipic acid Nutrition 0.000 description 1
- 238000003483 aging Methods 0.000 description 1
- 230000032683 aging Effects 0.000 description 1
- 150000001298 alcohols Chemical class 0.000 description 1
- 150000001299 aldehydes Chemical class 0.000 description 1
- 150000008055 alkyl aryl sulfonates Chemical class 0.000 description 1
- 125000002947 alkylene group Chemical group 0.000 description 1
- XYLMUPLGERFSHI-UHFFFAOYSA-N alpha-Methylstyrene Chemical compound CC(=C)C1=CC=CC=C1 XYLMUPLGERFSHI-UHFFFAOYSA-N 0.000 description 1
- BJEPYKJPYRNKOW-UHFFFAOYSA-N alpha-hydroxysuccinic acid Natural products OC(=O)C(O)CC(O)=O BJEPYKJPYRNKOW-UHFFFAOYSA-N 0.000 description 1
- 229910000147 aluminium phosphate Inorganic materials 0.000 description 1
- 150000001413 amino acids Chemical class 0.000 description 1
- 150000001414 amino alcohols Chemical class 0.000 description 1
- 229920003180 amino resin Polymers 0.000 description 1
- LHIJANUOQQMGNT-UHFFFAOYSA-N aminoethylethanolamine Chemical compound NCCNCCO LHIJANUOQQMGNT-UHFFFAOYSA-N 0.000 description 1
- 229910021529 ammonia Inorganic materials 0.000 description 1
- 239000000908 ammonium hydroxide Substances 0.000 description 1
- 229910052787 antimony Inorganic materials 0.000 description 1
- WATWJIUSRGPENY-UHFFFAOYSA-N antimony atom Chemical compound [Sb] WATWJIUSRGPENY-UHFFFAOYSA-N 0.000 description 1
- 239000007900 aqueous suspension Substances 0.000 description 1
- 239000011324 bead Substances 0.000 description 1
- 150000001642 boronic acid derivatives Chemical class 0.000 description 1
- SXDBWCPKPHAZSM-UHFFFAOYSA-M bromate Chemical class [O-]Br(=O)=O SXDBWCPKPHAZSM-UHFFFAOYSA-M 0.000 description 1
- 150000001649 bromium compounds Chemical class 0.000 description 1
- MTAZNLWOLGHBHU-UHFFFAOYSA-N butadiene-styrene rubber Chemical compound C=CC=C.C=CC1=CC=CC=C1 MTAZNLWOLGHBHU-UHFFFAOYSA-N 0.000 description 1
- HQABUPZFAYXKJW-UHFFFAOYSA-N butan-1-amine Chemical compound CCCCN HQABUPZFAYXKJW-UHFFFAOYSA-N 0.000 description 1
- CQEYYJKEWSMYFG-UHFFFAOYSA-N butyl acrylate Chemical compound CCCCOC(=O)C=C CQEYYJKEWSMYFG-UHFFFAOYSA-N 0.000 description 1
- DNBZRBSJOJZJKV-UHFFFAOYSA-N butyl prop-2-enoate;methyl 2-methylprop-2-enoate;2-methylprop-2-enoic acid Chemical group CC(=C)C(O)=O.COC(=O)C(C)=C.CCCCOC(=O)C=C DNBZRBSJOJZJKV-UHFFFAOYSA-N 0.000 description 1
- 229910052793 cadmium Inorganic materials 0.000 description 1
- BDOSMKKIYDKNTQ-UHFFFAOYSA-N cadmium atom Chemical compound [Cd] BDOSMKKIYDKNTQ-UHFFFAOYSA-N 0.000 description 1
- 239000006229 carbon black Substances 0.000 description 1
- 239000010962 carbon steel Substances 0.000 description 1
- 150000004649 carbonic acid derivatives Chemical class 0.000 description 1
- 125000003178 carboxy group Chemical group [H]OC(*)=O 0.000 description 1
- 125000002843 carboxylic acid group Chemical group 0.000 description 1
- 150000001735 carboxylic acids Chemical class 0.000 description 1
- 230000003197 catalytic effect Effects 0.000 description 1
- 229920006217 cellulose acetate butyrate Polymers 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 230000009920 chelation Effects 0.000 description 1
- 150000001805 chlorine compounds Chemical class 0.000 description 1
- FOCAUTSVDIKZOP-UHFFFAOYSA-N chloroacetic acid Chemical compound OC(=O)CCl FOCAUTSVDIKZOP-UHFFFAOYSA-N 0.000 description 1
- 229940106681 chloroacetic acid Drugs 0.000 description 1
- ZCDOYSPFYFSLEW-UHFFFAOYSA-N chromate(2-) Chemical class [O-][Cr]([O-])(=O)=O ZCDOYSPFYFSLEW-UHFFFAOYSA-N 0.000 description 1
- 229940018557 citraconic acid Drugs 0.000 description 1
- 235000015165 citric acid Nutrition 0.000 description 1
- 238000004140 cleaning Methods 0.000 description 1
- GFHNAMRJFCEERV-UHFFFAOYSA-L cobalt chloride hexahydrate Chemical compound O.O.O.O.O.O.[Cl-].[Cl-].[Co+2] GFHNAMRJFCEERV-UHFFFAOYSA-L 0.000 description 1
- 229940097268 cobaltous chloride hexahydrate Drugs 0.000 description 1
- 229940045032 cobaltous nitrate Drugs 0.000 description 1
- 239000000084 colloidal system Substances 0.000 description 1
- 230000000536 complexating effect Effects 0.000 description 1
- 238000009833 condensation Methods 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- MPTQRFCYZCXJFQ-UHFFFAOYSA-L copper(II) chloride dihydrate Chemical compound O.O.[Cl-].[Cl-].[Cu+2] MPTQRFCYZCXJFQ-UHFFFAOYSA-L 0.000 description 1
- JZCCFEFSEZPSOG-UHFFFAOYSA-L copper(II) sulfate pentahydrate Chemical compound O.O.O.O.O.[Cu+2].[O-]S([O-])(=O)=O JZCCFEFSEZPSOG-UHFFFAOYSA-L 0.000 description 1
- 235000005822 corn Nutrition 0.000 description 1
- 239000007822 coupling agent Substances 0.000 description 1
- LDHQCZJRKDOVOX-NSCUHMNNSA-N crotonic acid Chemical compound C\C=C\C(O)=O LDHQCZJRKDOVOX-NSCUHMNNSA-N 0.000 description 1
- 230000018044 dehydration Effects 0.000 description 1
- 238000006297 dehydration reaction Methods 0.000 description 1
- 230000002939 deleterious effect Effects 0.000 description 1
- 230000001687 destabilization Effects 0.000 description 1
- ZBCBWPMODOFKDW-UHFFFAOYSA-N diethanolamine Chemical compound OCCNCCO ZBCBWPMODOFKDW-UHFFFAOYSA-N 0.000 description 1
- 125000005442 diisocyanate group Chemical group 0.000 description 1
- WLGSIWNFEGRXDF-UHFFFAOYSA-N dodecanoic acid Chemical compound CCCCCCCCCCCC(O)=O.CCCCCCCCCCCC(O)=O WLGSIWNFEGRXDF-UHFFFAOYSA-N 0.000 description 1
- 229920001971 elastomer Polymers 0.000 description 1
- 238000010292 electrical insulation Methods 0.000 description 1
- 230000008030 elimination Effects 0.000 description 1
- 238000003379 elimination reaction Methods 0.000 description 1
- GKIPXFAANLTWBM-UHFFFAOYSA-N epibromohydrin Chemical compound BrCC1CO1 GKIPXFAANLTWBM-UHFFFAOYSA-N 0.000 description 1
- 230000032050 esterification Effects 0.000 description 1
- 238000005886 esterification reaction Methods 0.000 description 1
- SUPCQIBBMFXVTL-UHFFFAOYSA-N ethyl 2-methylprop-2-enoate Chemical compound CCOC(=O)C(C)=C SUPCQIBBMFXVTL-UHFFFAOYSA-N 0.000 description 1
- 150000002222 fluorine compounds Chemical class 0.000 description 1
- NBVXSUQYWXRMNV-UHFFFAOYSA-N fluoromethane Chemical compound FC NBVXSUQYWXRMNV-UHFFFAOYSA-N 0.000 description 1
- 235000019253 formic acid Nutrition 0.000 description 1
- 239000001530 fumaric acid Substances 0.000 description 1
- 239000010439 graphite Substances 0.000 description 1
- 229910002804 graphite Inorganic materials 0.000 description 1
- 238000000227 grinding Methods 0.000 description 1
- 229910052735 hafnium Inorganic materials 0.000 description 1
- VBJZVLUMGGDVMO-UHFFFAOYSA-N hafnium atom Chemical compound [Hf] VBJZVLUMGGDVMO-UHFFFAOYSA-N 0.000 description 1
- RRAMGCGOFNQTLD-UHFFFAOYSA-N hexamethylene diisocyanate Chemical compound O=C=NCCCCCCN=C=O RRAMGCGOFNQTLD-UHFFFAOYSA-N 0.000 description 1
- 239000004312 hexamethylene tetramine Substances 0.000 description 1
- 235000010299 hexamethylene tetramine Nutrition 0.000 description 1
- 239000007970 homogeneous dispersion Substances 0.000 description 1
- 229920001519 homopolymer Polymers 0.000 description 1
- 150000004678 hydrides Chemical class 0.000 description 1
- 229930195733 hydrocarbon Natural products 0.000 description 1
- 150000002430 hydrocarbons Chemical class 0.000 description 1
- 235000011167 hydrochloric acid Nutrition 0.000 description 1
- 229910052739 hydrogen Inorganic materials 0.000 description 1
- 239000001257 hydrogen Substances 0.000 description 1
- 125000002887 hydroxy group Chemical group [H]O* 0.000 description 1
- WGCNASOHLSPBMP-UHFFFAOYSA-N hydroxyacetaldehyde Natural products OCC=O WGCNASOHLSPBMP-UHFFFAOYSA-N 0.000 description 1
- 229920003088 hydroxypropyl methyl cellulose Polymers 0.000 description 1
- 238000007689 inspection Methods 0.000 description 1
- 150000004694 iodide salts Chemical class 0.000 description 1
- 235000000396 iron Nutrition 0.000 description 1
- 229910021326 iron aluminide Inorganic materials 0.000 description 1
- JEIPFZHSYJVQDO-UHFFFAOYSA-N iron(III) oxide Inorganic materials O=[Fe]O[Fe]=O JEIPFZHSYJVQDO-UHFFFAOYSA-N 0.000 description 1
- 125000001449 isopropyl group Chemical group [H]C([H])([H])C([H])(*)C([H])([H])[H] 0.000 description 1
- 150000003951 lactams Chemical class 0.000 description 1
- 239000011133 lead Substances 0.000 description 1
- 239000001035 lead pigment Substances 0.000 description 1
- 235000021388 linseed oil Nutrition 0.000 description 1
- 229910052744 lithium Inorganic materials 0.000 description 1
- 229910003002 lithium salt Inorganic materials 0.000 description 1
- 159000000002 lithium salts Chemical class 0.000 description 1
- 239000011777 magnesium Substances 0.000 description 1
- 229910052749 magnesium Inorganic materials 0.000 description 1
- 239000001630 malic acid Substances 0.000 description 1
- 235000011090 malic acid Nutrition 0.000 description 1
- 229910052748 manganese Inorganic materials 0.000 description 1
- 150000001455 metallic ions Chemical class 0.000 description 1
- 239000013528 metallic particle Substances 0.000 description 1
- FQPSGWSUVKBHSU-UHFFFAOYSA-N methacrylamide Chemical compound CC(=C)C(N)=O FQPSGWSUVKBHSU-UHFFFAOYSA-N 0.000 description 1
- 229920003145 methacrylic acid copolymer Polymers 0.000 description 1
- 125000005395 methacrylic acid group Chemical class 0.000 description 1
- 229960004011 methenamine Drugs 0.000 description 1
- 239000010445 mica Substances 0.000 description 1
- 229910052618 mica group Inorganic materials 0.000 description 1
- 150000007522 mineralic acids Chemical class 0.000 description 1
- 238000002156 mixing Methods 0.000 description 1
- PSCWDXZBRYGBDI-UHFFFAOYSA-N n-(oxiran-2-ylmethyl)prop-2-enamide Chemical compound C=CC(=O)NCC1CO1 PSCWDXZBRYGBDI-UHFFFAOYSA-N 0.000 description 1
- JACMPVXHEARCBO-UHFFFAOYSA-N n-pentylpentan-1-amine Chemical compound CCCCCNCCCCC JACMPVXHEARCBO-UHFFFAOYSA-N 0.000 description 1
- 238000006386 neutralization reaction Methods 0.000 description 1
- 229910000907 nickel aluminide Inorganic materials 0.000 description 1
- 239000010955 niobium Substances 0.000 description 1
- GUCVJGMIXFAOAE-UHFFFAOYSA-N niobium atom Chemical compound [Nb] GUCVJGMIXFAOAE-UHFFFAOYSA-N 0.000 description 1
- 150000002823 nitrates Chemical class 0.000 description 1
- 150000002826 nitrites Chemical class 0.000 description 1
- 229910052757 nitrogen Inorganic materials 0.000 description 1
- QIQXTHQIDYTFRH-UHFFFAOYSA-N octadecanoic acid Chemical compound CCCCCCCCCCCCCCCCCC(O)=O QIQXTHQIDYTFRH-UHFFFAOYSA-N 0.000 description 1
- OQCDKBAXFALNLD-UHFFFAOYSA-N octadecanoic acid Natural products CCCCCCCC(C)CCCCCCCCC(O)=O OQCDKBAXFALNLD-UHFFFAOYSA-N 0.000 description 1
- UYDLBVPAAFVANX-UHFFFAOYSA-N octylphenoxy polyethoxyethanol Chemical compound CC(C)(C)CC(C)(C)C1=CC=C(OCCOCCOCCOCCO)C=C1 UYDLBVPAAFVANX-UHFFFAOYSA-N 0.000 description 1
- 229940055577 oleyl alcohol Drugs 0.000 description 1
- XMLQWXUVTXCDDL-UHFFFAOYSA-N oleyl alcohol Natural products CCCCCCC=CCCCCCCCCCCO XMLQWXUVTXCDDL-UHFFFAOYSA-N 0.000 description 1
- 239000011368 organic material Substances 0.000 description 1
- 150000002902 organometallic compounds Chemical class 0.000 description 1
- 238000000643 oven drying Methods 0.000 description 1
- RPQRDASANLAFCM-UHFFFAOYSA-N oxiran-2-ylmethyl prop-2-enoate Chemical compound C=CC(=O)OCC1CO1 RPQRDASANLAFCM-UHFFFAOYSA-N 0.000 description 1
- 229910052763 palladium Inorganic materials 0.000 description 1
- PNJWIWWMYCMZRO-UHFFFAOYSA-N pent‐4‐en‐2‐one Natural products CC(=O)CC=C PNJWIWWMYCMZRO-UHFFFAOYSA-N 0.000 description 1
- VLTRZXGMWDSKGL-UHFFFAOYSA-N perchloric acid Chemical class OCl(=O)(=O)=O VLTRZXGMWDSKGL-UHFFFAOYSA-N 0.000 description 1
- 230000035699 permeability Effects 0.000 description 1
- JRKICGRDRMAZLK-UHFFFAOYSA-L persulfate group Chemical group S(=O)(=O)([O-])OOS(=O)(=O)[O-] JRKICGRDRMAZLK-UHFFFAOYSA-L 0.000 description 1
- 239000003208 petroleum Substances 0.000 description 1
- 235000021317 phosphate Nutrition 0.000 description 1
- ACVYVLVWPXVTIT-UHFFFAOYSA-N phosphinic acid Chemical class O[PH2]=O ACVYVLVWPXVTIT-UHFFFAOYSA-N 0.000 description 1
- 235000011007 phosphoric acid Nutrition 0.000 description 1
- 150000003013 phosphoric acid derivatives Chemical class 0.000 description 1
- 230000000704 physical effect Effects 0.000 description 1
- 238000005554 pickling Methods 0.000 description 1
- 239000004014 plasticizer Substances 0.000 description 1
- 238000006068 polycondensation reaction Methods 0.000 description 1
- 229920000867 polyelectrolyte Polymers 0.000 description 1
- 229920000573 polyethylene Polymers 0.000 description 1
- 229920013716 polyethylene resin Polymers 0.000 description 1
- 229920000151 polyglycol Polymers 0.000 description 1
- 239000010695 polyglycol Substances 0.000 description 1
- 239000002952 polymeric resin Substances 0.000 description 1
- 229920000193 polymethacrylate Polymers 0.000 description 1
- 229920001155 polypropylene Polymers 0.000 description 1
- 229920001451 polypropylene glycol Polymers 0.000 description 1
- 229920002223 polystyrene Polymers 0.000 description 1
- 239000004800 polyvinyl chloride Substances 0.000 description 1
- 229920000915 polyvinyl chloride Polymers 0.000 description 1
- 239000005033 polyvinylidene chloride Substances 0.000 description 1
- 239000001267 polyvinylpyrrolidone Substances 0.000 description 1
- 229920000036 polyvinylpyrrolidone Polymers 0.000 description 1
- 235000013855 polyvinylpyrrolidone Nutrition 0.000 description 1
- 239000011148 porous material Substances 0.000 description 1
- BITYAPCSNKJESK-UHFFFAOYSA-N potassiosodium Chemical compound [Na].[K] BITYAPCSNKJESK-UHFFFAOYSA-N 0.000 description 1
- 229910052700 potassium Inorganic materials 0.000 description 1
- 239000011591 potassium Substances 0.000 description 1
- 238000001556 precipitation Methods 0.000 description 1
- HJWLCRVIBGQPNF-UHFFFAOYSA-N prop-2-enylbenzene Chemical compound C=CCC1=CC=CC=C1 HJWLCRVIBGQPNF-UHFFFAOYSA-N 0.000 description 1
- 235000019260 propionic acid Nutrition 0.000 description 1
- AOHJOMMDDJHIJH-UHFFFAOYSA-N propylenediamine Chemical compound CC(N)CN AOHJOMMDDJHIJH-UHFFFAOYSA-N 0.000 description 1
- IUVKMZGDUIUOCP-BTNSXGMBSA-N quinbolone Chemical compound O([C@H]1CC[C@H]2[C@H]3[C@@H]([C@]4(C=CC(=O)C=C4CC3)C)CC[C@@]21C)C1=CCCC1 IUVKMZGDUIUOCP-BTNSXGMBSA-N 0.000 description 1
- 229910052761 rare earth metal Inorganic materials 0.000 description 1
- 150000002910 rare earth metals Chemical class 0.000 description 1
- 230000002829 reductive effect Effects 0.000 description 1
- 238000010992 reflux Methods 0.000 description 1
- 230000004044 response Effects 0.000 description 1
- 230000000717 retained effect Effects 0.000 description 1
- 238000007151 ring opening polymerisation reaction Methods 0.000 description 1
- 239000005060 rubber Substances 0.000 description 1
- 150000003873 salicylate salts Chemical class 0.000 description 1
- 229920006395 saturated elastomer Polymers 0.000 description 1
- 238000010517 secondary reaction Methods 0.000 description 1
- 238000007873 sieving Methods 0.000 description 1
- 239000000377 silicon dioxide Substances 0.000 description 1
- 229910001961 silver nitrate Inorganic materials 0.000 description 1
- 239000002002 slurry Substances 0.000 description 1
- 239000000344 soap Substances 0.000 description 1
- 229910052708 sodium Inorganic materials 0.000 description 1
- 239000011734 sodium Substances 0.000 description 1
- 239000006104 solid solution Substances 0.000 description 1
- 239000007921 spray Substances 0.000 description 1
- 238000005507 spraying Methods 0.000 description 1
- 229910001220 stainless steel Inorganic materials 0.000 description 1
- 239000008117 stearic acid Substances 0.000 description 1
- 238000003756 stirring Methods 0.000 description 1
- 230000000153 supplemental effect Effects 0.000 description 1
- 239000000375 suspending agent Substances 0.000 description 1
- 230000008961 swelling Effects 0.000 description 1
- GUVRBAGPIYLISA-UHFFFAOYSA-N tantalum atom Chemical compound [Ta] GUVRBAGPIYLISA-UHFFFAOYSA-N 0.000 description 1
- 238000010998 test method Methods 0.000 description 1
- 238000012360 testing method Methods 0.000 description 1
- FAGUFWYHJQFNRV-UHFFFAOYSA-N tetraethylenepentamine Chemical compound NCCNCCNCCNCCN FAGUFWYHJQFNRV-UHFFFAOYSA-N 0.000 description 1
- 229920001187 thermosetting polymer Polymers 0.000 description 1
- 150000003567 thiocyanates Chemical class 0.000 description 1
- 150000004764 thiosulfuric acid derivatives Chemical class 0.000 description 1
- 229910052718 tin Inorganic materials 0.000 description 1
- 239000011135 tin Substances 0.000 description 1
- OGIDPMRJRNCKJF-UHFFFAOYSA-N titanium oxide Inorganic materials [Ti]=O OGIDPMRJRNCKJF-UHFFFAOYSA-N 0.000 description 1
- 231100000331 toxic Toxicity 0.000 description 1
- 230000002588 toxic effect Effects 0.000 description 1
- VZCYOOQTPOCHFL-UHFFFAOYSA-N trans-butenedioic acid Natural products OC(=O)C=CC(O)=O VZCYOOQTPOCHFL-UHFFFAOYSA-N 0.000 description 1
- LDHQCZJRKDOVOX-UHFFFAOYSA-N trans-crotonic acid Natural products CC=CC(O)=O LDHQCZJRKDOVOX-UHFFFAOYSA-N 0.000 description 1
- 229960001124 trientine Drugs 0.000 description 1
- 229940086542 triethylamine Drugs 0.000 description 1
- XFNJVJPLKCPIBV-UHFFFAOYSA-N trimethylenediamine Natural products NCCCN XFNJVJPLKCPIBV-UHFFFAOYSA-N 0.000 description 1
- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 description 1
- 229910052721 tungsten Inorganic materials 0.000 description 1
- 239000010937 tungsten Substances 0.000 description 1
- 235000021122 unsaturated fatty acids Nutrition 0.000 description 1
- 150000004670 unsaturated fatty acids Chemical class 0.000 description 1
- JOYRKODLDBILNP-UHFFFAOYSA-N urethane group Chemical group NC(=O)OCC JOYRKODLDBILNP-UHFFFAOYSA-N 0.000 description 1
- 235000020234 walnut Nutrition 0.000 description 1
- 239000001993 wax Substances 0.000 description 1
- 238000009736 wetting Methods 0.000 description 1
- 229910052725 zinc Inorganic materials 0.000 description 1
- 239000011701 zinc Substances 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D5/00—Coating compositions, e.g. paints, varnishes or lacquers, characterised by their physical nature or the effects produced; Filling pastes
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D7/00—Processes, other than flocking, specially adapted for applying liquids or other fluent materials to particular surfaces or for applying particular liquids or other fluent materials
- B05D7/14—Processes, other than flocking, specially adapted for applying liquids or other fluent materials to particular surfaces or for applying particular liquids or other fluent materials to metal, e.g. car bodies
- B05D7/142—Auto-deposited coatings, i.e. autophoretic coatings
Landscapes
- Life Sciences & Earth Sciences (AREA)
- Engineering & Computer Science (AREA)
- Wood Science & Technology (AREA)
- Chemical & Material Sciences (AREA)
- Materials Engineering (AREA)
- Organic Chemistry (AREA)
- Paints Or Removers (AREA)
- Application Of Or Painting With Fluid Materials (AREA)
- Separation Using Semi-Permeable Membranes (AREA)
- Compositions Of Macromolecular Compounds (AREA)
- Processes Of Treating Macromolecular Substances (AREA)
- Surface Treatment Of Glass (AREA)
- Separation Of Suspended Particles By Flocculating Agents (AREA)
Description
(54) COAGULATION COATING PROCESS
(71) We, FORD MOTOR
COMPANY LIMITED, a British Company
of Eagle Way, Brentwood, Essex, CM13 3BW, do hereby declare the invention, for which we pray that a patent may be granted to us, and the method by which it is to be performed, to be particularly described in and by the following statement:- This application relates to a coagulation coating process which is useful for applying coatings to various substrates.
More particularly, the process relates to the deposition of organic resins, which may be admixed with reactive or nonreactive particles, by coagulation on the surface of various substrates, followed by curing, aging or other treatments to provide the desired properties for the coating. The process may be employed to provide numerous types of coatings on many different substrates or articles.For example, coatings may be applied to: (1) improve corrosion and oxidation resistance at ambient and elevated temperatures of metal substrates such as turbine engine components, automotive exhaust train components, and automotive interior and exterior components; (2) reduce or eliminate water and/or solvent permeability of porous materials such as wood, unglazed ceramics, paper and fabrics; (3) improve solvent resistance of organic surfaces; (4) enhance the decorative value of metallic and nonmetallic surfaces such as on the interior and exterior of automobiles; (5) provide electrical insulation on conductive surfaces; (6) provide conductive surfaces on nonconductive substrates: (7) provide lubricants on metallic and nonmetallic surfaces such as graphite lubricant coatings for forged articles; and (8) provide acid and alkali resistant glass coatings for items such as water heaters.
Methods for coating surfaces bv coagulation from both acid and alkaline aqueous dispersions of polymeric particles are known in the art. Representative methods of coagulation coating from an acidic aqueous solution are discussed in
U.S. Patents 3,709,743 and 3,791,431. Patent
No. 3,791,431 discusses a method wherein an organic coating is applied to a metallic surface by immersing the surface in an acidic aqueous coating composition containing particles of an organic coatingforming material. The organic material may be in either dissolved, emulsified, or dispersed form. The coating composition is acidic as a result of the inclusion of an acidic oxidizing agent such as a mineral acid. This acidic oxidizing agent attacks the metal substrate causing metal ions to be dissolved from the surface.These ions cause the coating-forming material to be unstable in the region of the surface and, as a result, it deposits on the surface. One of the problems with this type of process is that the coating composition tends to become unstable as metal ions build up with repeated use. Patent No. 3,791,431 seeks to remedy this problem by removing metal ions from the composition or adding a material to render the metal ions innocuous.
The necessity of this additional step, of course, complicates the process and adds a further parameter which must be monitored and controlled during processing.
The process of Patent No. 3,709,743, which is similar to the above-discussed process also employs an oxidizing acid which attacks a metallic substrate causing metal ions to form which, in turn, cause coagulation of an organic coating. Thus, this suffers the same disadvantages with respect to metallic ion build-up. The process of 3,709,743 also employs an aqueous bath containing an anionic surfactant stabilized emulsion of the synthetic resinous filmforming composition and, as a result, suffers from certain other serious deficiencies which are treated more thoroughly in the discussion of prior art alkaline bath coagulation methods set forth below. Of course, it will also be noted that both of the acidic bath embodiments disclosed in the above referenced patents are useful only to coat certain metallic substrates. It should also be noted that both of these prior art.
processes also are unsuitable for the application of aluminide coatings because of the presence of strong oxidizing acids.
Many prior art references disclose applying coatings such as natural latex or synthetic latices by coagulation from alkaline aqueous dispersions of essentially insoluble particles. U.S. Patent Nos.
3,411,982 and 3,856,561 teach processes which are representative of these alkaline bath processes. These processes involve depositon of synthetic latices, which may contain small amounts of acrylic or methacrylic acid and which can be used alone or in combination with styrene, polystyrene, chlorinated polyethylene.
polyvinyl chloride, polyvinylidene chloride and polyacrylate resins, and vinyl chloride butyl acrylate copolymers, by polyvalent destabilization of stabilized polymers. In that process the polymers are anionically stabilized or stabilized with anionic surfactants in combination with nonionic surfactants or reaction products of such.
Soluble alkalies such as potassium hydroxide or ammonium hydroxide are also added in some cases to control pH and/or to assist the stabilizer in producing emulsions of the particles in water.
The presence of such anionic and nonionic surfactants or mixtures of nonionic and anionic surfactants or reaction products of such can have a deleterious effect on the final properties of coagulated polymer coatings by building up in the bath and/or in the coagulated film. Another disadvantage of such processes is the tendency of the emulsions to be unstable in the presence of chemically reactive substances such as pigments that release ions into solution and cause coagulation of dispersed film former.
Still another disadvantage of such processes is that the dispersed latices have a tendency to swell in the presence of various solvents.
The improved process of this invention which overcomes the deficiencies of prior art techniques, involves the controlled coagulation of water soluble film-formers along with, if desired, pigments which may be either inert or chemically reactive. The coagulation or desolubilization of the chemically soluble or solubilized filmformer is effected as a result of contact of the film-former with a coagulating compound which is applied to the substrate to be coated prior to exposure of the substrate in the aqueous bath containing the film-former.
The improved process has many advantages including:
1. A high degree of bath stability;
2. Uniformity and homogeneity of coagulated film;
3. Elimination of the use of anionic or nonionic stabilizers or reaction products thereof and/or mixtures of such stabilizers to provide dispersions of film-formers in water;
4. Improved film thickness control;
5. Minimization of film-former swelling, thus avoiding coagulation through dehydration;
6. Minimization of coagulation by reactive pigments such as finely divided powders of aluminum, catalytic platinum, lead pigment extenders and alkali earth silicates and borates:
7.Improved corrosion protection for metallic surfaces especially when the filmformers are: (a) coagulated as a mixture of corrosion inhibiting pigments and pigment extenders where the resin comprises the bulk of said mixture (commonly referred to as paints): (b) coagulated onto metal surfaces as a mixture of a minor amount of film-former and a major amount of metal pigments and heat treated at a temperature below the melting point of the metal particles in an atmosphere essentially inert to said particles to vaporize or thermally degrade the film-former so that metal particles may then be heated so as to react with and modify the metal substrate; (c) coagulated as a mixture of a minor amount of film-former and a major amount of refractory or ceramic enamel frit, and heat treated in an oxidizing atmosphere at temperatures above the point where the film-former vaporizes or thermally degrades so that the frit particles may then be fused with said metal substrate to form an adherent acid, alkali, high temperature or electrically resistant coating depending upon characteristics of the frit;
8. Improved water impermeability of porous surfaces such as wood (laminated or unlaminated) by coagulation of a coating consisting of a mixture of a major amount of film-former and a minor amount of pigments so that when such coatings are heated below the thermal flash point of the coated article and essentially at the cure temperature of the coagulated coating, an adherent water resistant coating is formed; and
9. Limits the use of toxic and/or corrosive oxidizing and reducing mineral acids such as hydrochloric, sulfuric, nitric, chromic, hydrofluoric, hydrobromic, oxychloroacetic, chloroacetic acid, and low molecular weight organic acids, as coagulants.
These and other advantages will be more readily apparent after reading the following detailed description of the invention.
The process claimed in this application relates to a coating process which comprises (A) providing the substrate to be coated with a dry coagulating compound surface coating or layer; and (B) exposing said substrate to an aqueous bath comprising organic film forming material, at least fifty (50) weight percent of which is an ionizable organic film former which (i) has at least 12 carbon atoms per molecule; (ii) is at least partially ionized such that it is substantially soluble in said aqueous bath; and (iii) coagulates and deposits in the presence of said coagulating compound.
In one preferred embodiment of the process the coagulating compound employed has a pH of less than 7.0 and the organic film former is a synthetic polycarboxylic acid resin which (i) is at least partially neutralized with a water soluble base, (ii) advantageously has an electrical equivalent weight between 1,000 and 20,000, and (iii) advantageously has an acid number between 30 and 300.
In a second preferred embodiment of the process, the coagulating compound employed has a pH greater than 7.0 and the organic film-former is selected from basic monomers and resins having one or more nitrogens in their molecular structure and is at least partially netralized by a water soluble acid compound (including a compound which can produce an acid compound when reacted with a basic resin).
Coagulating Compounds
In accordance with the process of the invention, the substrate to be coated is first provided with a dry coagulating compound surface coating or layer. This can be accomplished in a number of ways which will be apparent to those skilled in the art.
For example, the compound or mixture of compounds may be dissolved in suitable volatile solvents or mixtures of such suitable solvents (e.g. water, alcohols, acetones, cellosolves (RTM) etc.) and the solution then applied to the substrate by known means such as dipping, roll coating and, spraying. The coated substrate is then dried to remove the volatile solvent(s), thus leaving a surface coating of dry coagulating compound. If desired, the compound solution may include soluble or partially insoluble conditioning agents such as cellulose, cellulose acetates, colloidal silicates or polyvinylpyrolidones, to promote uniform application of the compound on the substrate. Generally, the coagulating compound will comprise between 1 and 40 weight percent of such solution.The coagulating compound surface coating or layer may also be provided, for example, by application of the compound or mixture of compounds in dry form in combination with conditioning agents, if required, such as finely divided aluminum oxide, silica, mica, or glass, to promote the uniform application of the compound(s) on the surface by any known prior art techniques such as dry dipping, blasting, surface grinding or fluidized bed.
By way of a still further example, the coagulating compound coating or layer may be formed on the substrate surface by application of a material to the substrate which reacts with or otherwise modifies the substrate surface to form a coagulating compound surface.
As mentioned above when the organic film-former is a synthetic polycarboxylic acid resin, the coagulating compound must have a pH less than 7.0. The preferred coagulating compound for use in this embodiment of the process is a salt.
Preferred salts are salts of polyvalent
metals. The salts of bivalent metals such as magnesium, the alkaline earths, zinc, copper, cobalt, cadmium, ferrous iron, lead, nickel and manganese are preferred, but the salts of polyvalent metals such as aluminum, ferric iron, antimony, chromium, molybdenum, tin, thorium and zirconium may also be used. In general, the chlorides and nitrates of these metals are the most useful because of the availability and great solubility in water and organic solvents, but the bromides, iodides, fluorides, chlorates, bromates, perchlorates, sulphates, persulfates, thiosulphates, permanganates, chromates, hypophosphites, thiocyanates, nitrites, acetates, formates and oxalates, of some of the metals are sufficiently soluble to merit consideration.Of all the salts mentioned, the salts of metals of the First
Transition Series are preferred, with nickel being most preferable. The salts are also preferably salts of strong acids, i.e., pH less than 4.5, and most preferably exhibit a pH in the range of 3.5 to 4.5. A list of salts which are ideal for use in this embodiment and their pH (10so by weight Aqueous) is as follows:: pH (100/, by Weight
Formula Aqueous) NiCl2.6H2O (Nickel Chloride) 4.0 CuCl2.2H2O (Cupric
Chloride) 3.6 CoCl2.6H2O (Cobaltous
Chloride) 4.5
Cu(NO3).6H2O (Cupric
Nitrate) 4.0 Ni(NO3)2.6H2O (Nickel
Nitrate) 4.0
CuSO4.5H2O (Cupric Sulfate) 4.0 ZnCl2.6H2O (Zine Chloride) 4.0
In this embodiment of the process another preferred manner of forming the metal salt when the substrate is metal to apply an acid which will react with the metal to form a metal salt. Such acids may include acids such as formic, acetic, oxalic, hydrochloric and sulphuric and preferably are strong mineral acids.In a modification of this process the salt may be formed by treating the surface of the substrate with a solution containing both a dissolved salt and an acid which reacts with the substrate to form a salt.
In the course of the coagulation process of the embodiment, the dry metal salt hydrate, when wetted, forms ions at the salt layer interface, which ions react with the polycarboxylic acid moiety of the acid resin.
It is thought that the metal ions are free to react with the resin to form complex organometallic compounds which, in turn, coagulate to form a film of resin on the continuously reacting salt (see "Electrodeposition of Epoxy Resin on
Electrodes of Iron and Platinum", Journal of
Paint Technologv, Vol. 12, No. 515, June, 1970). As suggested in the above reference, coagulation by formation of metallic complexes may occur as follows: MO=M"f+ne- n( RCOO-)+ Mn+=M( RCOO)n A secondary reaction which may take place at the interface and which is possibly coupled with the first reaction is the precipitation of the acid resin in an acid form as follows: RCOO-+H+=RCOOH Complexing through chelation and formation of other complex coordination compounds may play an important role in the first reaction.
The reactions set forth above are merely suggestions with respect to the possible mechanism of coagulation.
As also mentioned above, when the organic film-former is selected from basic monomers and resins having one or more nitrogens in their molecular structure, the compound must have a pH greater than 7.0.
Preferred coagulating compounds for use in this embodiment include: any or all of the soluble alkali metal salts such as sodium potassium and lithium salts and/or other salts of strong bases and weak acids and/or mixtures of said salts which exhibit a pH in solution greater than 7.0 and preferably greater than 10.0. Exemplary of the many salts which fall within this category and which will be apparent to those skilled in the art are: carbonates, silicates, oxalates, salicylates and formates of alkali metals sodium, potassium and lithium.
A second preferred type of coagulating compound for use in this embodiment of the process includes strong bases, i.e. those with a pH greater than 10.0 in aqueous solution, such as the alkali metal hydroxides.
Film-Former
All embodiments. of the invention employ an organic film-forming material, at least fifty (50) weight percent of which is a chemically ionizable, organic film-former which (i) has at least 12 carbon atoms per molecule; (ii) is at least partially ionized such that it is substantially soluble in said aqueous bath, i.e., sufficiently soluble that the film-former molecule would behave in the manner of an anionic (or cationic as the case may be) polyelectrolyte under the influence of a direct electric current when such aqueous bath is employed as the bath of an electrodeposition cell (in contrast to the behaviour in the manner of a hydrophilic colloid, e.g., an inert resin globule encased in a soap film and emulsified); and (iii) coagulates in the presence of said coagulating compound.
The organic film-former used in the process of this invention, unlike the filmformers used in processes discussed previously wherein ionic or nonionic stabilizers and/or reaction products of such are used, is a coating salt which is substantially soluble in water. In the prior art processes referred to the anionic or nonionic stabilizers and/or reaction products thereof are required to form emulsions of discretely insoluble particles in water. Essentially, the stability of such conventional emulsions used for the coagulation of a coating on a surface is provided by (1) anionic (e.g. alkyl-aryl sulfonates) or soap-like stabilizers which form a protective film around essentially insoluble particles keeping them from coalescing. The same pertains to nonionic stabilizers, except that these materials (e.g.
reaction product of ethylene oxide and oleyl alcohol or octyl phenoxy polyethoxyethanol) are used most commonly in combination with one or more anionic stabilizers which are salts or alkali metal salts or organic acids, particularly sulfates, phosphates or carboxylates.
In the coagulation mechanism of such conventional methods, the coagulating ion acts on the stabilizers, destroying the protective film around the particles and causing them to coalesce. It is the stabilizer which is antagonized in such a process. In the process of this invention, on the other hand, it is the solubilized polymer which is antagonized.
In the first embodiment of the process, discussed above, the coagulating compound has a pH of less than 7.0 and the organic film-former is a synthetic polycarboxylic acid resin which (i) is at least partially neutralized with a water-soluble base, (ii) advantageously has an electrical equivalent weight between 1,000 and 20,000, and (iii) has an acid number between 30 and 300.
The electrical equivalent weight of a given resin or resin mixture is herein defined as that amount of resin or resin mixture that will deposit per Faraday of electrical energy input under the conditions of operation set forth in detail below. For this purpose, the value of one Faraday in coulombs is herein taken to be 107.88 (atomic weight of silver);0.001118 (grams of silver deposited by one coulomb from silver nitrate solution) or 96.493. Thus, if 0.015 gram of coating, the binder polycarboxylic acid resin moiety of which is 90 /n by weight and the balance of which is amino compound used to disperse it in the bath is transfered and coated on the anode per coulomb input to the process, the electrical equivalent weight of the resin is about 1303 or 0.015x0.9x 107.88+0.001118.
By way of further illustration I find electrical equivalent weight (in the nature of gram equivalent weight in accordance with
Faraday's laws) of a particular polycarboxylic acid resin or resin mixture simply and conveniently for typical process conditions standardized on as follows: a polycarboxylic acid resin concentrate is made up at 65.560C. (150"F) by thoroughly mixing 50 grams of polycarboxylic acid resin, 8 grams of distilled water and diisopropanol amine in an amount sufficient to yield resin dispersion pH of 9.0 or slightly lower after the concentrate has ~ been reduced to 5% by weight resin concentration with additional distilled water.The concentrate is then diluted to one liter with additional distilled water to give 5% resin concentration in the resulting dispersion. (If a slight insufficiency of the amine has been used, and the dispersion pH is below 9.0, pH is brought up to 9.0 with additional diisopropanol amine). The dispersion is poured into a metal tank, the broadest side walls of which are substantially parallel with and 2.54 cm. out from the surfaces of a thin metal panel anode. The tank is wired as a direct current cathode, and the direct current anode is a 20 gauge, 10.17 cm (4 inches) wide, tared steel panel immersed in the bath 7.62 cm (3.5 inches) deep.At 26.67"C (800 F) bath temperature and while the bath is agitated sufficiently to provide turbulent flow direct current is impressed from anode to cathode at 100 volts for one minute from an external power source, the current measured by use of a coulometer, and the current turned off.
The anode panel is removed immediately.
rinsed with distilled water, baked for 20 minutes at 176.67"C (3500 F) and weighed.
All volatile material such as water and amine is presumed to be removed from the film for practical purposes by the baking operation. The difference between tared weight of the fresh panel and final weight of the baked panel divided by the coulombs of current used, times 107.88, divided by 0.001118 gives the electrical equivalent weight of the resin for purposes of this invention.
The polycarboxylic acid resins useful in the process of the invention include any of the polycarboxylic acid resins useful in the electrodeposition of paint from an aqueous bath. These acidic film-forming materials include, coupled oils such as sunflower, safflower, perilla, hempseed, walnut seed, dehydrated caster oil, rapeseed, tomato seed, menhaden, corn, tune. soya and oiticia, the olefinic double bonds in the oil being conjugated or nonconjugated or a mixture, the coupling agent being an acyclic olefinic acid or an hydride, preferably maleic anhydride, but also crotonic acid, citraconic acid or anhydride, fumaric acid, or an acyclic olefinic aldehyde or ester of an acyclic olefinic ester such as acrolein, vinyl acetate, or methyl maleate, or even a polybasic acid such as phthalic or succinic.
particularly coupled glyceride oils that are further reacted with 2 to 25% of a polymerizable vinyl monomer; maleinized unsaturated fatty acids; maleinized resin acids, alkyd resins, e.g., the esterification products of a polyol with a polybasic acid, particularly glyceride drying oil-extended alkyd resins; acidic hydrocarbon drying oil polymers such as those made from maleinized copolymers of butadiene and diisobutylene; diphenolic acid polymer resins; and acrylic polymers and copolymers having carboxylic acid groups such as butyl acrylate-methyl methacrylate-methacrylic acid copolymers, acrylic acid and lower alkyl (C, to C4) substituted acrylic acidcontaining polymers, i.e., those having carboxyl groups contributed by alpha-beta unsaturated carboxylic acids or residues of these acids.
These and other suitable resins are described in detail in many patents of which
U.S. Patents 3,230,162: 3,335,103; 3,378,477 and 3,403.088 are illustrative.
As discussed in the cited patents the polycarboxylic acid resin can also be modified and extended in various ways without impairing its useful characteristics.
Thus. one may use polycarboxylic acid resins wherein there is blended thermoplastic, non-heat reactive phenolic resins into - the polycarboxylic acid resin batches, which extended resins then were dispersed in water with the polyfunctional amino compound. The heating together, preferably with agitation, of the polycarboxylic acid resin with such phenolic resin for at least about 1/2 hour, and preferably about one to two hours or more, at a temperature between 200 and 260"C appears to give a chemical bonding between those two components and no free phenolic resin mixture.Thus, when the resulting resin is used in the process, the coating is essentially homogenous, and in a bath containing the resulting resin product there is no appreciable accumulation of free phenolic bodies dissociated from the resin in an appreciable operating time.
Other suitable extenders for the polycarboxylic acid resin include hydrocarbon resins such as cumaroneindene resins, which are generally inert and thermoplastic, and diolefinic petroleum resins such as those of essentially napthenic structure which are heat-reactive, e.g., cyclopentadiene resins. Addition of resins such as this also can give increased chemical resistance to the resulting cured film. Many other resinous extenders and film plasticizers of conventional nature, e.g., amino aldehyde resins, butadiene-styrene latices, vinyl chloride and vinylidene chloride homopolymer and copolymer latices, polyethylene resins, fluorocarbon resins, bis phenol-glycidyl ether resins, dicyclo diepoxy carboxylate resins, etc., are permissible also, provided, however, that their concentration is not so high as to mask the characteristics of the polycarboxylic acid resin.
Another acidic material which may be
employed is an organic acid containing at
least 12 carbon atoms, e.g., lauric acid
(dodecanoic acid), stearic acid
(octodecanoic acid), etc. These are
preferably used in conjunction with a minor
amount of neutral or essentially neutral
film-forming polymers, e.g., polyesters,
hydrocarbon resins, polyacrylates or
polymethacrylates, but may be used alone
or with the aforementioned carboxylic acid
resins.
As mentioned above, the carboxylic acid is at least partially neutralized in the
coagulation bath with a suitable water soluble base. The preferred water soluble
bases are alkali metal hydroxides with
sodium hydroxide being most preferred.
Other water soluble bases which may be
effectively used include water soluble amino
compounds and ammonia.
The especially suitable water soluble
amino compounds are soluble in water at 20"C to the extent of at least 1 t, basis weight of solution and include hydroxy amines, polyamines and di- and
polyfunctional monomericamines such as:
monoethanolamine, diethanolamine, triethanolamine, N-methyl ethanolamine,
N-aminoethylethanolamine, N-methyldiethanolamine, monoisopropanolamine, diisopropanolamine. triisopropanolamine, Polyglycol amines'' such as
HO(C2H4O)2C3H6NH2, hydroxylamine, butanolamine, hexanolamine.
methyldiethanolamine, octanolamine, and alkylene oxide reaction products of monoand polyamines such as the reaction product of ethylene diamine with ethylene oxide or propylene oxide, laurylamine with ethylene oxide; ethylene diamine, diethylene triamine, triethylene tetramine, hexamethylene tetramine, tetraethylene pentamine, propylene diamine 1,3 diaminopropane and imino-bis-propyl amine and mono-di-and tri-lower (alkyl (Cl 8) amines such as mono-, di- and tri-ethyl amine.
When using amines we have found that the best films are deposited when about 3040 X" total amino equivalents present in the bath, both combined and free, are contributed by water soluble polyamine, and thus it is preferred to operate that way when using amines. Preferably, when using amines diethylene triamine is employed for efficiency and economy. The polyamine can be added to the bath along with supplemental binder concentrate or separately.
The hydroxy amines, particularly those that are aliphatic in nature at points of hydroxyl attachment, such as the alkanol amines are also very useful for treating the polycarboxylic acid resin for dispersion and appear to have some desirable resin solubilizing effect in water over and above their neutralizing action.
In the second above mentioned embodiment, the coagulating compound has a pH in aqueous solution greater than 7.0 and the organic film-former is selected from basic monomers and resins having one or more nitrogens in their molecular structure. This basic material contains at least 12 carbon atoms, e.g., lauryl amine or stearyl amine. Obviously, when the basic material is polymeric, it will be of substantially greater molecular weight.
Examples of the basic resins containing nitrogen atoms in the molecule are amino group-added epoxy resins (aminoepoxy resins), amino group-containing acrylates (aminoacryl resins), amino groupcontaining vinyl compound copolymers (aminovinyl resins) and polyamide resins.
The aminoepoxy resins may be obtained by adding any organic amino compound to an epoxy group in an epoxy resin or epoxy modified resin. A glycidyl ether of phenol or a glycidyl ether of a phenol-aldehyde condensate is suitable as such epoxy compound. Among commercial products thereof are Epikote 828, Epikote 1001,
Epikote 1002, Epikote 1004, Epikote 1007 and Epikote 1009 (trademarks) produced by
Shell Oil Co., Araldite 6071, Araldite 6084,
Araldite 6097, Araldite 6099 and Araldite 7072 (trade marks) produced by Ciba Ltd.
and Epichlon 800, Epichlon 1000 and
Epichlon 1010 (trade marks) produced by
Dainippon Ink Co. Polyalkadiene epoxide such as polybutadiene epoxide can also be used. Further, a copolymer of an unsaturated compound containing an epoxy group such as glycidyl methacrylate, glycidyl acrylate, N-glycidylacrylamide, allylglycidylether or N-gl-ycidyl- methacrylamide with another unsaturated monomer copolymerizable therewith is also useful. As an organic amino compound to be added to such epoxy group, a secondary monoamine is most preferable. However, a primary monoamine or polyvalent amine can also be used together with such secondary monoamine.
Example of these amino compounds are diethylamine, diethanolamine diisopropylamine, dibutylamine, diamylamine, diisopropanolamine, ethylaminoethanol, ethylaminoisopropanol, n-butylamine, ethanolamine ethylenediamine and diethylentriamine.
The aminoacryl resins or aminovinyl resins are basic resins obtained by copolymerizing an acrylate or methacrylate having an amino group or a nitrogencontaining acrylic or vinyl compound such as vinyl pyridine or vinylimidazole with a vinyl compound having no free acid group.
Example of such acrylic acid esters having amino groups are esters of acrylic acids or methacrylic acids and amino alcohols, such
as aminoethyl acrylate, aminobutyl
acrylate, methylaminoethyl acrylate, dimethylaminoethyl acrylate, hydroxyethyl
aminoethyl acrylate, aminoethyl
methacrylate and dimethylaminoethyl
methacrylate.Examples of vinyl
compounds having no free acid group and to be copolymerized with the above amino- or nitrogen-containing compounds are acrylic acid and methacrylic acid derivatives such as methyl acrylate, ethyl acrylate, butyl acrylate, 2-ethylhexyl acrylate, acrylamide, Nmethylolacrylamide, butoxymethylacrylamide, acrylonitrile, methyl methacrylate, ethyl methacrylate nbutyl methacrylate, isobutyl methacrylate, 2-hydroxyethyl methacrylate, glycidyl methacrylate, and methacrylamide, aromatic vinyl compounds such as styrene, a-methyl styrene and vinyl toluene and other vinyl compounds such as vinyl acetate, vinyl chloride and vinyl isobutyl ether.
The polyamide resins are condensates of a dibasic acid and a polyvalent amine.
Examples of dibasic acids are isophthalic acid, adipic acid and dimer acid, and examples of polyvalent amines are ethylene diamine and diethylene triamine.
As mentioned previously, the basic monomers and resins are at least partially neutralized by a water soluble acid compound.
Examples of acid compounds to be used for the reaction with the basic resin are hydrochloric acid, phosphoric acid, formic acid, acetic acid, propionic acid, citric acid, malic acid, tartaric and acrylic acid, but any other inorganic acids and organic acids may also be used.
A water-dilutable or thinnable organic film-former resin may be obtained by adding to the basic resin 0.2 to 3 equivalents, preferably 0.5 to 1.5 equivalents of the acid compound per equivalent of amino groups or basic nitrogen atoms in the basic resin and agitating the mixture at the normal or room temperature.
As a compound which can produce an acid substance by reacting with the amino group or basic nitrogen in the basic resin at the time of the neutralization or modification of the basic resin, there may be mentioned epihalohydrins such as epichlorohydrin or epibromohydrin. The amount of this modifier may be 0.5 to 2 equivalents per equivalent of amino groups or basic nitrogen atoms in the basic resin. A mixture of the basic resin and modifier are heated to 500 to 1000C. The acid produced in the mixed system at the time of such modification will react with the amino groups in the basic resin to obtain a waterdilutable or thinnable cationic binder resin.
The non-ionic synthetic resins in the form of powder and to be used together with the cationic binder resin are preferably those which are solid at the normal or room temperature and can melt when heated in the subsequent baking operation, and may or may not be compatible with the binder resin in the fused film formed at an elevated temperature. The non-ionic synthetic resin should be used in the form of fine powder with an average particle size of 0.5 to 100 microns. Further, the non-ionic resin may be thermosetting by itself or thermoplastic but, preferably, is curable with a curing agent or catalyst which is known per se in the art.
The non-ionic synthetic resins which may be included with the basic resin include those selected from the group consisting of epoxy-resins, polyester resins, acrylate resins, polyurethane resins, polyamide resins, polyolefin resins and cellulose derivative resins.
The epoxy resin is preferably a glycidyl etheride of phenol, a glycidyl etheride of a phenol aldehyde condensate or a phenol glycidyl etheride esterified with 10 to 20% dimer acid. As for the polyester resin there may be used a blend of a melamine resin with a saturated linear polyester or an oilfree alkyd resin.
The acrylate resin is preferably a polymer or copolymer of an acrylate or methacrylate or its copolymer with another copolymerizable unsaturated monomer. For example, it is a copolymer of an acrylate and styrene. Such acrylate resin may be mixed with a cross-linking agent or curing catalyst such as amino resin or epoxy resin.
The polyurethane resin is preferably a copolymer produced by the poly-addition of diisocyanate such as trilenediisocyanate or hexamethylenediisocyanate with a polyol such as glycol or polyesterglycol, having more than two urethane groups in the molecule.
The polyamide resin is preferably a copolymer produced by the cocondensation of a dicarboxylic acid such as an aliphatic dicarboxylic acid having more than 6 carbon atoms with a diamine such as an aliphatic diamine having more than 6 carbon atoms, or by the polycondensation of amino acid having more than 6 carbon atoms, or by the ring-opening polymerization of a lactam having more than 4 carbon atoms. Examples of said polyamide resin are Tohmide (tradename of Fuji Chemicals Co.) derived from dimer acid and diamine, 6.6-nylon, 6.10-nylon, mixed type nylon Zytel 3606 (Trade Mark of
DuPont), alcohol soluble nylon Amilan
CM-4000, CM-8000 (trade name of Toray
Co.) produced by the co-condensation of caprolactam with 6.10-nylon salt, and Nmethoxymethyl substituted nylon Toresin
F-30, HF-30 (trade name of Teikoku
Chemical Ind.).
The polyolefin resin may be exemplified as polyethylene or polypropylene having a molecular weight of less than 100 thousand and a particle size of 1 micron to 50 microns.
The cellulose derivative resin may be such as cellulose acetate or cellulose acetatebutyrate and may be used supplementally in order to facilitate the flow of the deposited film in the baking step.
The above explained basic resins, cationic binder resins and non-ionic synthetic resins are all well known in the art and mostly commercially available, and therefore no further explanation thereabout will be necessary.
In any case, it will be understood that these resins in the state as used in the deposition bath are in the form of prepolymers or precondensates which are curable by themselves or in the presence of a cross-linking agent or catalyst upon the subsequent heat treatment or baking to form a rigid or tough film.
If desired a mixture of two or more different cationic binder resins, and/or two or more different non-ionic synthetic resins may be employed. In case the cationic binder resin is not compatible with the nonionic synthetic there is a tendency that there is formed a two-layer film upon subsequent baking.
While positive employment of a neutralizing solubilizer has been described for both of the above discussed process embodiments, it is within the scope of the invention to employ a film-former that ionizes in water without the addition of a neutralizer.
Coating Bath
The coating bath used in the process of the invention comprises an aqueous suspension of the solubilized carrier of organic film-former. The bath may optionally contain thickeners and suspending agents. Pigments or other particulate material which, if desired, is applied as the final coating on the substrate or as a part of that coating may also be included in the coating bath. As mentioned previously, both reactive and nonreactive pigments or other particulate materials and mixtures thereof may be employed in the process. Of course, the coating may consist entirely of the organic film-forming material and need not include particulate material.
In any event, the concentration of the organic film-forming material in the bath is preferably maintained in the range of 0.2 to 40 weight percent.
When pigment or other particulate material is included in the bath, the total amount of nonvolatile solids, i.e.
particulate material plus resin, preferably is between 3 and 60 weight percent of the bath most preferably between 10 and 50 weight percent. The weight ratio of particulate material to resin nonvolatiles is preferably in the range of 1/9 to 30/1, most preferably 1/4 to 20/1 with prefered minima of at least 2.5/1, preferably at least 5/1.
The concentration of thickeners, when used, is preferably in the range of 1 to 15 grams per kilogram of bath. For example, the preferred concentration of a cellulose thickener is 1 to 3 grams per kilogram of bath and the preferred concentration for a polyvinylpyrrolidone thickener is 9 to 12 grams per kilogram of bath. The bath may also contain a small amount of a curing agent for the organic film-forming material, a flow adjusting agent and other additives which are usually used in the art of synthetic resin type paints. Further, the bath may also contain a small amount (i.e., 0--100 parts by weight per 100 parts of the organic filmforming material) of an organic solvent.The organic solvent is useful to increase the adhesiveness of the organic film-forming material to the substrate, to improve the appearance of the coating film and to improve the stability of the paint.
By way of illustration of the preparation of the coating bath, the bath for practising the first aforementioned embodiment of the process may be prepared by solubilizing a weighed amount of a polycarboxylic acid resin with I normal sodium hydroxide to produce a homogeneous dispersion.
Pigment and water are then added to produce a viscous product which is mixed for a suitable time to ensure proper wetting of the pigment by the resin and the mixture is diluted with water to give the desired bath solids content.
Of course, the weight ratio of particulate material to organic film-forming material will vary widely depending upon the substrate being coated and the type of particulate material being applied. For example, when the particulate material being applied is metal and/or ceramic frit or other refractory material it is preferable to employ a particulate material to organic film-forming material weight ratio in the range of 1/1 to 20/1.
Coating by Coagulation
After the substrate to be coated is provided with a coagulating compound surface as discussed above, it is exposed to the coating bath by such known techniques as immersion or flow coating, for a time period, preferably greater than 5 seconds and less than 20 minutes, to obtain a coating of the desired thickness, e.g. in the range of 0.25 mils (0.00025 inches) to 35 mils (0.035) inches.
As will be apparent to those skilled in the art, the coating bath is preferably agitated as necessary to maintain the dispersion of materials therein during coating.
The completeness and thickness of the coating film which is applied, of course, will vary depending on a number of factors.
Perhaps the most important factor is the concentration of coagulating compound sites (e.g. salt sites) per unit area of the substrate. Other factors which will affect the completeness and thickness of the film are bath variables such as the pigment to binder weight ratio as well as the type of organic film-forming material being applied and the type of coagulating compound employed.
For example, a polycarboxylic acid resin of 200 acid number was reacted with sodium hydroxide to form a 2% by weight aqueous solution of a salt of the resin. The pigment (Reynolds 400 Aluminum Powder) was added to increase the pigment to binder ratio of the bath. Film thicknesses of the coatings, which were determined at various pigment to organic film-forming ratios are set forth below:
Pigment/Organic Film- Film
Forming Material Thickness
0/1 0.5 mil
0.5/1 0.8 mil
1/1 1.5 mil
2/1 2.5 mil
4/1 4.8 mil
8/1 4.8 mil
Post Coating Treatment
As will be apparent from the various examples set forth in this application, various post coating treatments of the coated substrate may be desirable. For example, the coated substrate is desirably heated to remove solvent or water from the coating, particularly if extensive handling of the part is contemplated shortly after coating.Depending on the nature of the organic film-forming material, heating to cure it may also be desirable. Also, it may be desirable to heat the substrate to remove the organic film-forming material. If the coating is intended to further modify the substrate surfaces, such as in diffusion coating of metals, further heat treatment may be necessary.For example, when the coating applied to a metal substrate includes particulate material comprising metal particles or mixtures of various metal particles and it is desired to diffuse the metal coating into the surface, it is desirable to heat the coated substrate in an atmosphere essentially inert to the metal particles in said coating to a decomposition temperature above the temperature required to decompose the organic filmforming material in the coating and below the diffusion temperature of the metal, maintain that decomposition temperature until the coating is essentially decomposed and gaseous products thereof are formed, evacuate the gaseous products from the heating zone, maintain the substrate in an atmospheric essentially inert to the metal particles and raise the temperature to the diffusion temperature of the metal particles for a suitable time to diffuse the coating into the substrate.
Preferred Uses of Process
A first preferred use of the process of the invention is in a process for modifying the surface of a metal substrate of which a major or principal component by weight is selected from cobalt, nickel and iron constitutes at least 40 weight percent of the substrate. The process comprises:
(a) providing said substrate with a dry coagulating compound, preferably a salt surface:
(b) codepositing by coagulation on said metal substrate a coating of
(I) metal particles having an average
diameter in the range of 0.5 to 20
microns and selected from
(A) aluminum comprising particles
wherein the weight ratio of
aluminum to other metal is in the
range of 200:1 to 1::3 and which are
selected from
(1) aluminum alloy particles,
(2) a mixture of aluminum particles
and particles of at least one other
metal,
(3) a mixture of aluminum particles
and particles of at least one alloy,
or
(B) aluminum particles:
(II) a heat decomposable organic film
forming material, at least 50 weight
percent of which is a chemically
ionizable organic film-former having at
least 12 carbon atoms per molecule in a
metal particle to organic film-forming
material weight ratio in excess of 3:1, from an aqueous dispersion which forms a coating bath wherein
(A) the weight ratio of metal particles
in said bath to organic film-forming
material in said bath is maintained
above 3::1,
(B) the concentration of organic film
forming material in said bath is
maintained in the range of 0.2 to 7
weight percent, and
(C) the total weight of non-volatile
solids in said bath is maintained
below 35 weight percent of said bath,
and
(c) heating the substrate and resultant coagulation coating thereon in a heating zone in an atmosphere essentially inert to the metal particles in said coating to a decomposition temperature above the temperature require to decompose the organic film-forming material in said coating and below the diffusion temperature hereinafter set forth, maintaining said decomposition temperature until said coating is essentially decomposed and gaseous products thereof are formed in said heating zone, essentially evacuating said gaseous products from said heating zone, maintaining the substrate in the heating zone in an atmosphere essentially inert to the metal particles and raising the temperature of the heating zone to the diffusion temperature of the metal particles and maintaining said diffusion temperature and said atmosphere for a time sufficient to obtain the desired diffusion.
The metallic substrate upon which the particulate metal is deposited is preferably a substrate which after being processed in accordance with this invention exhibits corrosion resistance at high temperatures.
Obviously, various uses of metal parts subjected to high temperatures require varying degrees of high temperature corrosion resistance.
Iron alloys which can be surface modified in accordance with this invention include those which contain very small amounts of alloying components, e.g., carbon steel, as well as those alloys wherein the alloying component or components constitute a substantial percentage of the alloy. The iron alloys contain a minimum of 50 weight percent iron and commonly much more, e.g., 60 to 99 weight percent iron. Thus, a broad spectrum of iron base materials are suitable for treatment in accordance with this process including carbon steels, stainless steels and nodular irons. Both cast and wrought alloys of these types can be processed provided heat treatment in a nonoxidizing atmosphere at 13000 F or above is permissible, i.e., provided that the temperature selected in this range is compatible with recognized metallurgical practices for such alloy.
The nickel and cobalt base materials which may be processed typically contain from 5 to 25 weight percent chromium for oxidation resistance, although nickel and cobalt alloys without chromium exist and can be surface modified by this process.
Various amounts of refractory elements such as tungsten, tantalum, columbium, molybdenum, zirconium and hafnium are commonly added as solid solution strengtheners and/or carbide formers to improve high temperature strength.
Aluminum and/or titanium are added to certain of the nickel base materials to produce age hardening response for additional high temperature strength. In such alloys, the total aluminum plus titanium contents may be as high as 10 weight percent in some.
The nickel alloys contain above 40 weight percent nickel, commonly 50 to 80 weight percent. Even when the nickel content of the alloy is between 40 and 50 weight percent, it is the largest single component of the alloy. Correspondingly, the cobalt alloys contain above 40 weight percent cobalt, commonly 50 to 80 weight percent.
Similarly, when the cobalt content of the alloy is between 40 and 50 weight percent, it is the largest single component of the alloy.
As diseussed previously, various factors will affect the thickness of the coating initially applied by coagulation. For a given thickness of coagulated coating, it will be appreciated that the time required for providing a desired depth of diffusion coating will vary depending on the substrate being coated and the coating being applied.
In the preferred use of the process as in others, the areas to be coated are preferably cleaned by conventional processes such as pickling, grit blasting with suitable particulate abrasive, e.g., aluminum oxide particles of about 140325 mesh (U.S.
Standard) preferably about 220 mesh using a pressure in the range of 40-80 psi. This cleaning is preferably performed not longer than 30 minutes prior to exposure of the part to the coating bath.
Areas not requiring coating may be left uncoated by leaving these portions out of the coating bath during deposition whenever this is feasible. In the alternative, these portions may be masked to prevent coating although exposed to coating bath.
Any suitable masking material may be used.
For such a process, a suitable masking material is one that will remain in place during the coagulation process, will prevent surface contact of the masked area by the bath during the processing and which will not significantly interfere with the chemical composition of the bath. Examples of a suitable insulative masking material are rubber, wax, plastics material, a removable sleeve of metal, etc.
The particulate metal to be deposited and subsequently diffused into the substrate advisedly has an average particle diameter in the range of 0.05 to 20, preferably 4 to 9 microns in the case of aluminum.
Preferably, the median particle size range is (50 wt. percent is greater than and 50 wt.
percent is less than) 6 to 30 microns in the case of aluminum. For even and homogeneous deposits, it is advisable that 0 percent of the particles exceed 74 microns in particle size with not more than 5 percent having a particle size above 44 microns.
However, small quantities of undesirably large particles may be removed by sieving or by gravitational settling from the coagulation bath.
The particulate metal used in this process is one that when diffused into the surface of the substrate provides a change in surface characteristics that increases the high temperature corrosion resistance of the surface treated. The preferred metallic particles are aluminum particles, aluminum alloy particles e.g., 60 wt. percent Al-40 wt. percent Pt. 50 wt. percent Al-SO wt.
percent Pd, 99 wt. percent Al-l wt. percent
Y, a particulate mixture of aluminum and at least one other metal or metal oxide, e.g., platinum, palladium, chromium Cr2O3, cobalt or rare earth metals, and a mixture of aluminum particles and the particles of at least one alloy, e.g., 75 wt. percent Al+25 wt. percent (63 wt. percent Co-23 wt.
percent Cr--13 wt. percent Al-0.65 wt.
percent Y) alloy, 50 wt. percent Al+50 wt.
percent (69 wt. percent Al-30 wt. percent
Co-l wt. percent Y) alloy. While a single coagulation providing a coating containing all of the particulate metal to be deposited is ordinarily preferred, it is within the scope of the invention to carry out successive coagulation steps of different particulate materials.
A typical composition of the aluminum powder or flake used is as follows:
Weight
Percent
Aluminum 97.0 min.
A1203 2.0 max.
Fe 0.25 max.
Si 0.15 max.
Other metallics, each 0.03 max.
Other metallics, each 0.15 max.
The weight ratio of aluminum to other metal or metals in the particulate metal in those embodiments wherein at least one other metal is employed either in separate particulate form or in the form of particulate alloy is preferably in the range of 200:1 to 1:3.
Immediately following coating by coagulation, the coated part should be rinsed with water to remove loose adhering bath materials. After removing the masking material, if any, the parts are then oven dried advisedly at a temperature of 160"F to 1800F for 5 minutes or more to eliminate any residual water from the coating followed by a bake at 3500F metal temperature for 10 minutes to cure the filmformer. Of course, where the part will not be handled extensively prior to further processing, the curing step may be omitted.
Following oven drying, the coated parts are heat treated in an ambient inert to the particles deposited. In one embodiment, the heat diffusion step is carried out in a vacuum of about,l0-4 mm Hg or greater, i.e., a lower pressure, preferably at a pressure not in excess of 5x 10-5 mm Hg. In another embodiment, the heat diffusion is carried out in a hydrogen atmosphere having a dew point below about -75"F. In firing, the coated article is supported on a support that does not undergo chemical reaction in the firing process, e.g., aluminum oxide.
When the process is carried out in vacuum, the following procedure can be used. The coated part is charged to the heating zone. The vacuum is established and the heating zone is heated to a metal temperature of 8000 to 1 1000F and held at that temperature until the initial vacuum is restored and the organic portion of the coating has essentially decomposed and the vapors therefrom are removed from the heating zone before heating the part to diffusion temperature. Diffusion is carried out by heating the article to a metal temperature between 13000 and 22000 F., commonly between 1500"F and 1900"F e.g.
by heating the heating zone to a temperature at least 500 F above the melting point of aluminum and below 2200"F until the desired diffusion of metal from the deposit into the alloy substrate is achieved.
Diffused coating thickness can be determined on parts by microscopic inspection of cross sectional test samples.
The average depth will ordinarily be in the range of 2 to 7, preferably 3 to 7 more preferably 3 to 4 mils.
By way of further example, a typical heat treatment cycle for low carbon steel of a thickness ranging from about 0.035--0.125 inches comprises heating to a metal temperature of 900--1l000F for 5 to 15 minutes followed by heating to a metal temperature of 1400--1600"F for a period of 5 to 15 minutes to produce a diffusion coating with an average thickness of about 3 mils. Of course, depending on such factors as the type of material being coated, the coating material being applied, the temperature at which diffusion is carried out, the thickness of the material and the thickness of the desired diffusion coating, heat treatments of I hour or more and even 8 hours or more may be desirable.
A second preferred use of the process of this invention is in a process for coating a substrate with inorganic particulate solids such as ceramic frit or other refractory material. That process comprises:
(A) providing the substrate with a dry
coagulating compound, e.g., a salt,
surface;
(B) codepositing by coagulation on the
substrate a coating having a particulate
solids to organic film-forming material
weight ratio in excess of 2.5:1
preferably from 5:1 to 20::1, from an
aqueous dispersion comprising a
vaporizable and chemically ionizable
organic film-former which
(i) has at least 12 carbon atoms per
molecule
(ii) is at least partially ionized-such that
it is substantially soluble in said
aqueous bath, and
(iii) coagulates and deposits in the
presence of said coagulating
compound and inorganic particulate solids selected from ceramic frit and metal and having an average major dimension between 2 and 70 microns, preferably from 2 to 25 microns.
In accordance with this process, the following limitations on bath parameters are desirable:
(1) The concentration of organic
film-forming material in the bath is
preferably within the range of 0.02
to 2, preferably 0.5 to 2, parts by
weight of organic film-forming
material to 100 parts by weight of
coating bath.
(2) The weight to weight ratio of
particulate material in said bath to
organic film-forming material in
the bath is preferably within the
range of 2.5 to 35 to 1, preferably
3.5 to 20 to 1.
(3) The concentration of depositables
in the bath is preferably within the
range of 1.7 to 30, preferably 5 to
25, parts by weight total
depositables per 100 parts by
weight of bath.
When the particulate material is ceramic frit, the organic film-forming materials must be materials that will vaporize during the firing cycle through which the particulate frit is converted to a continuous film. This vaporization generally should take place at temperatures below 15000 F, preferably between 900 and 1100"F, most preferably below 1000"F.
The invention will be more fully understood after reading the specific examples which follow. However, it should be understood that the examples are merely intended to be illustrative of certain embodiments of the invention. In the
Examples the organic film-forming materials employed contain at least 50% by weight of an ionisable organic film-former which contains at least 12 carbon atoms.
Example 1
Coagulation deposition of a paint is carried out with the materials and method hereinafter set forth:
Preparation of Coating Bath
A linseed oil coupled with maleic anhydride, diluted with water and solubilized with diisopropanol amine was prepared as follows: (A) 6,197 parts-Linseed oil and (B) 1,484 parts-maleic anhydride were
reacted in an agitation tank for 3
hours at 2320C and then cooked at 157"C.
(C) 1,309 parts-Vinyl toluene containing 35
parts tertiary butyl peroxide was
added to (B) and the mixture
reacted at 2180C for 1 hour. The
mixture was cooled to 157"C.
(D) 3,875 parts-Oil soluble phenolic resin
was added to (C) and the mixture
reacted for 1 hour at 1760C. The
mixture was cooled to 930C and (E) 3,000 parts-Deionized water was
added (F) 2,060 parts-Diisopropanol anine was
added to (E) at 75--90"C to
neutralize the resin.
(G) 17,179 parts-Deionized water was
added to further dilute the vehicle.
Based on the resin solids of the
vehicle 2% by weight carbon black
and 8% by weight corrosion
inhibiting pigments were added.
The resultant bath had a pH of 8.5.
Coagulation Process
The bath prepared as above is placed in a
metal or plastics container and agitated to
provide uniform suspension of the paint
pigments. The bath temperature is
maintained at about 40 to 125"F, most
preferably between 65" to 750 F.
An article of 1010 steel is alkali cleaned in
a 2 oz/gal solution of Stuaffer 128NP cleaner
for 5 minutes at 160"F to 170"F, removed,
tap water rinsed, hot air dried and permitted
to cool to room temperature. The article is
immersed in a 10 " by weight nickel
chloride hexahydrate in methanol solution,
withdrawn at a rate of 12 inches per minute
and heated in a convection oven for 5
minutes at 160"F, removed and permitted to
cool to room temperature. The article is
then immersed in the coating bath for one
minute, removed and tap water rinsed and
the resultant film cured at 3600F for 25
minutes which resulted in a smooth, glossy,
adherent 0.6 mil coating.Additional articles
were coated and salt spray tested according
to ASTM Test method No. B117-64. The
coating exhibited excellent corrosion
protection after 240 hours exposure. In
addition good adhesion, cross hatch and
other good physical properties were
obtained.
Example 2
A coagulation coating bath consisting
of an aminoepoxy resin was prepared as
follows:
(A) 488 parts-Epikote 1001, and
(B) 105 parts-Diethanolamine and
(C) 250 parts-Isopropyl alcohol were
reacted under reflux for 3 hours at 80"C to give an amino-epoxy resin.
(D) 100 parts-Epoxy resin powder
(Epikote 1004), and
(E) 3 parts-Butvar D 510 leveiing agent, a
product of Monsanto Co. (the
word "Butvar" is a Registered
Trade Mark) and
(F) 40 parts-Rutile type titanium oxide and
(G) 5 parts-Dicyandiamide were melted
and kneaded together to produce a
solidified mixture which was
pulverized into a powder having a
maximum particle diameter of 100
microns and an average particle
diameter of 40 microns.
(H) 6.2 parts-Glacial acetic acid and (I) 500 parts-Deionized water are added to (J) 143 parts-of the resin of (C) and the
mixture agitated in a dissolver.
(K) 634 parts-Powder (G) is added to the
resulting mixture from (J),
dispersed in a homogenizer for 30
minutes and then diluted with
deionized water to give a coating
bath of 12% solids. Glacial acetic
acid is then added to adjust the pH
to 4.4-4.5 The coating bath from (K) is placed into a plastics container and agitated to maintain uniform suspension of the pigment.
An article of 1010 steel is alkali cleaned and rinsed and dried as in Example 1. The article is then immersed in a 2.6 by weight sodium hydroxide in methanol solution, withdrawn at a rate of 12 inches per minute and heated and cooled as in Example 1. The article is then immersed in the coating bath for 1 minute, withdrawn, rinsed and baked for 25 minutes at 360"F which resulted in a 0.7 mil coating.
Example 3
A coating bath consisting of 20% bath
solids, in which 89.9 ,' by weight of the
solids is metallic aluminum powder and 11.1 ,^ by weight of a polycarboxylated
acrylic acid resin is prepared as follows:
(A) 111 grams-Acrylic acid resin' in butyl
Cellosolve which contains 77.8
grams of resin solids is reacted
with 2.5 grams of sodium
hydroxide (62.2 milliliters 1
normal sodium hydroxide).
'This resin is prepared from the following
materials in the following manner:
(a) To a reaction vessel is charged 900
parts by weight Cellosolve and the same is
heated to 1400C.
(b) While maintaining this temperature,
there is added dropwise over a 3.5 hour
period a mixture of
Parts by
weight
Methacrylic acid 226 2-ethyl hexyl acrylate 630
Styrene 1034
Hydroxy ethyl methacrylate 210
Azobisisobutyronitrile 21
(c) After addition is complete, the
temperature of 140"C is held for 0.5 hour
and the resin recovered. The resin has an
acid value of about 71 and an XY Gardener
Holdt viscosity at 50 " solids in butyl
Cellosolve.
(B) 624 grams-Reynolds 400 atomized
aluminum powder (406 micron
APD) and (C) 435 grams-Deionized water are added
to (A) and the mixture is blended
for 2 hours under high shear
agitation to give.
(D) 1170 grams-60% (by weight) bath.
(E) 2330 grams-Deionized water is slowly
added to (D) to give (F) 3500 grams-Coating bath.
The above bath from(F) is placed under agitation to ensure uniform suspension of the metal powder.
An article of 1010 steel or Tinamel (Titanium strengthened low carbon steel) is processed the same way as in Example I using a 10";, (by weight) nickel chloride hexahydrate in ethanol solution for application of coagulant by immersion. The part is immersed in the coating bath for 1 minute. withdrawn, rinsed with tap water and the aluminum coated article is baked for 1/2 hour at 1800F. The article with its smooth, adherent 4.05.0 mil coating is placed into a furnace whose atmosphere is essentially inert to the metal particles. The coated article is heat treated at a metal temperature of 900"F for 5 minutes to vaporize the resin and is then heat treated at a metal temperature of 15000F for 5-10 minutes.The result is a highly oxidation and corrosion resistant coating essentially of iron aluminide.
Example 4
A coating bath consisting of 48% by weight bath solids, of which 4.8% by weight is an acrylic acid resin and 95.2% by weight is a ceramic enamel frit is prepared as follows: (A) 447 grams-Sodium hydroxide
presolubilized acrylic acid resin
prepared in Example 3 which
contains 174 grams of resin solids
is mixed under agitation with (B) 4941 grams-Ceramic mill slip of Ferro
Frit #234 which contains 3459
grams pigment solids, 4% of which
is retained in a USA Standard
Sieve No. 400 until a homogenous
blend results to give (C) 5388 grams-Viscous slurry containing 64.4In solids by weight.
(D) 1136 grams-Hydroxy propyl methyl
cellulose aqueous dispersion
containing 11.4 grams of the
thickener is blended into (C) to
give (E) 6524 grams-Bath which is diluted
with (F) 1046 grams-Deionized water to give (G) 7570 grams-Coating Bath at 48% solids
by weight.
Bath (G) is placed into a stainless container and agitated to maintain uniform suspension of the pigment.
An article of Tinamel is aluminum oxide blasted (200 Mesh) at 100 psi. The article is immersed into a 20% by weight nickel chloride hexahydrate in ethanol solution, removed at a controlled rate as in Example 1 and the coagulant dried at 1600F for 5 minutes and cooled to room temperature for 5 minutes. The pretreated article is immersed into bath (G) for 1 minute.
withdrawn and the coated article tap water rinsed, dried at 360"F for 30 minutes. An 8-10 mil coating is formed on the article which is then fired at 1600F for 6 minutes which results in a 3.()-5.0 mil oxidation and corrosion resistant glass coating.
Example 5
A paint comprising approximately 159, by weight of the bath solids in which approximately 80 Z" by weight of the solids consists of an amine solubilized polybutadiene resin and approximately 200/o by weight pigment was prepared as follows: (A) 1514 grams-Polybutadiene paint2
containing approximately 908
grams resins solids and 227 grams
pigments is solubilized with 38.8
grams of diethylamine under high
shear stirring.
(B) 6056 grams-Deionized water is slowly
worked into (A) to give (C) 7570 grams-Coating bath at 15 ,-,, solids.
The bath (C) was placed into a container and agitated as in Example 1. An article of low carbon steel is processed in the same manner as in Example 1 except the coagulant solution is a 5 /r, by weight cupric chloride dihydrate in ethanol. The coated article is tap water rinsed and cured at 360"F for 25 minutes which resulted in a smooth, adherent 0.4 mil coating.
Example 6
The coating bath of Example I is used to
apply a 0.6-0.7 mil opaque decorative
coating on the glass article. The article is
etched by mild blasting using finely divided powdered glass beads, and is immersed into
a 10% by weight aqueous solution of
aluminum chloride and the coagulant dried
at 160"F for 5 minutes and allowed to cool
at room temperature for 5 minutes. The
glass article is immersed for I minute into
bath (G) of Example 1. The article is
withdrawn and the film is baked at 3600F 2A water dispersable paint PPG-1260, comprising 1.4 polybutadiene, developed by
PPG Industries.
for 30 minutes which gives a 0.60.7 mil adherent, decorative coating.
Example 7
The same procedure for application of the coagulant of Example 6 is used to coat a plastics article, and a decorative paint film is applied by immersing the article in bath (G) of Example 1.
Example 8
The same procedure in Example 6 is used to apply the coagulant of Example 3 onto a glass article and an aluminum coating is applied by immersing the article into bath (F) of Example 3.
Example 9
The coating bath is the same as in
Example 3 except the metal article to be coated is a nickel base alloy (58 ,' Ni, 9% Cr, 10% Co, 10It, 600/ Al, 2% Mo, 4% Ta, l0o Ti) containing approximately 59 weight percent nickel. The coagulant is a 10% by weight solution of cobaltous chloride hexahydrate in n-propanol. The article prior to application of cobaltous chloride was aluminum oxide grit blasted at 80 psi.
Immersion time in bath (F) of Example 3 is 1 minute. The coated particle was tap water rinsed, and dried at 1800F for 1/2 hour. The coated article is heat treated in vacuum for 4 hours at a metal temperature of 1900"F.
The surface modification or coating of nickel aluminide is capable of providing oxidation protection for the article at high temperatures.
Example 10
A process for the application of a water impermeable coating on porous articles such as wood (laminated or unlaminated) is accomplished by immersing said article into the coagulant of Example 1, withdrawing the article and drying the coagulant at 160"F for 5 minutes. After the article is cool, it is immersed into bath (G) of
Example 1 for 2 minutes, withdrawn, tap water rinsed, and baked at 1800F for 1/2 hour. Example 11
The coating bath (F) of Example 3 is used to apply a coating of aluminum on a glass article. The article is lightly blasted with 200 mesh (U.S. Standard) aluminum oxide, and immersed into a l00,'o' by weight aqueous solution of hydrofluoric acid, withdrawn and the formed salt dried.After immersing the article in the coating bath for 1 minute, it is withdrawn, rinsed and baked for 30 minutes at 3600 F. An adherent 2.5 mil coating resulted.
Example 12
The coating bath (G) of Example 1 was used to apply protective coating to a steel metal article. The article was cleaned as in
Example 1 and immersed into a 10% by weight nickel chloride, 3.5 ", by weight hydrochloric acid in methanol solution. The article was coated in bath (G), Example 1, rinsed and baked at 3600 F. An adherent, smooth 1.0 mil coating resulted.
Example 13
The coating bath (G) of Example I was
used to apply a protective coating on a steel
article. The article was cleaned as in
Example 1, except the article was immersed
into a 50 by weight hydrochloric acid in ethanol solution. After the article was withdrawn, and dried, it was immersed for 1
minute into the coating bath. The article
was withdrawn, rinsed and baked at 360"F which resulted in an adherent, smooth 0.5
mil coating.
Example 14
The same procedure for coating a glass
article was used to apply an aluminum
powder coating as in Example 11, except the
coagulant was an aqueous 10% by weight
hydrofluoric acid, 5 Ó by weight cobaltous
nitrate solution. The coating which resulted
was Q0 mils.
Example 15
An acrylic polymer as prepared in
Example 3 was solubilized by reacting the
total acid number with an equivalent
amount of sodium hydroxide. A steel article
is cleaned by the procedure in Example 1
and immersed into a 10% by weight nickel
chloride in ethanol solution, withdrawn and
dried. The article was immersed into the
resin coating bath for 1 minute, withdrawn,
and the coated article baked for 25 minutes
at 360"F. A glossy, adherent, smooth 0.8 mil
coating resulted.
Example 16
The coating bath in Example 5 is used to apply a paint film on a 1010 steel article, previously zinc phosphate coated by Parker
Chemical Company's Bonderite 411/P-85 phosphating process (the word "Bonderite"
is a Registered Trade Mark). The article is
immersed into a 15% by weight nickel
chloride in ethanol solution and withdrawn at a controlled rate, dried and cooled as in
Example 1. After immersion of the article into bath (C) of Example 5 for 1 minute, it is withdrawn, tap water rinsed and the resultant film cured. The coating which resulted was 0.7-0.8 mil thick, smooth, adherent and provided excellent salt corrosion protection when tested as in
Example 1.
Example 17
The coating bath in Example 5 was used to apply a paint film on 1010 steel article except the article was grit blasted with 200 mesh (U.S. Standard) aluminum oxide powder prior to immersion into the salt solution of Example 5. In this case the paint film was applied by flowing the bath at a controlled rate over the surface of the article for a period of I minute. The resultant film after rinsing and curing was continuous, adherent and 0.7 to 0.75 mils.
thick.
Example 18
A coating was applied on a steel article using the coating bath (C) in Example 5 except the coagulating salt was applied by blasting the surface of the article with a mixture composed of 2.5 E by weight nickel chloride in a 200 mesh (U.S. Standard) aluminum oxide powder at a pressure of 6O80 psi. The powder mixture was uniformly blended prior to blasting using a high speed blender. The article was dried at 160"F and cooled to room temperature.
Immersing the part into the coating bath for
1 minute followed by a tap water rinse and curing of the film resulted in a continuous 0.5 mil coating.
WHAT WE CLAIM IS:
1. A process for coating a substrate comprising:
(A) providing the substrate with a
surface coating or layer of a dry
coagulating compound: and
(B) contacting the coated substrate
with an aqueous bath comprising
organic film-forming material, at
least fifty weight percent of which is
an ionizable, organic film-former
which
(i) has at least 12 carbon atoms per
molecule
(ii) is at least partially ionized such that
it is substantially soluble in said
aqueous bath; and
(iii) coagulates and deposits in the
presence of said coagulating
compound.
2. A process as claimed in Claim 1 in which the coagulating compound is an acid salt, a basic salt or a strong base.
3. A process as claimed in Claim 1 or
Claim 2 in which the coagulating compound has a pH in aqueous solution of less than 7.0 and the organic film-former is a synthetic polycarboxylic acid resin which is at least partially neutralized with a water soluble base.
4. A process as claimed in Claim 3 in which the polycarboxylic acid resin has (i) an electrical equivalent weight of from 1,000 to 20,000, and (ii) an acid number from 30 to 300.
5. A process as claimed in Claim 3 or
Claim 4 wherein said coagulating compound is a salt.
6. A process as claimed in Claim 5 in which the salt is a salt of a First Transition
Series metal.
7. A process as claimed in Claim 5 or
Claim 6 in which the salt has a pH in aqueous solution of from 3.5 to 4.5.
8. A process as claimed in any one of
Claims 5-7 in which the salt is nickel chloride, cupric chloride, cobaltous chloride, cupric nitrate, nickel nitrate, cupric sulfate or zinc chloride.
9. A process as claimed in any one of
Claims 5-8 in which the substrate is a metal substrate and the salt is formed by treating the substrate with an acid.
10. A process as claimed in any one of
Claims 5-8 in which the substrate is a metallic substrate and the salt is formed bv treating the substrate with a solution containing both a dissolved salt and an acid which reacts with the substrate to form a salt.
11. A process as claimed in any one of
Claims 5-10 in which the substrate is a metallic substrate and the coagulating compound is a metal salt.
12. A process as claimed in any one of
Claims 1-8 in which the coagulating compound is applied to the substrate in dry form.
13. A process as claimed in Claim I or
Claim 2 in which the coagulating compound has a pH in aqueous solution greater than 7.0 and the organic film-former is a basic monomer or resin having one or more nitrogen atoms in its molecular structure and is at least partially neutralized by a water soluble acid compound.
14. A process as claimed in Claim 13 in which the coagulating compound is a base having a pH in aqueous solution greater than 10.0, a basic salt or a mixture thereof.
15. A process as claimed in Claim 14 in which the basic salt is a carbonate, silicate, oxalate, salicylate or formate of an alkali metal.
16. A process as claimed in Claim 14 in which said base is alkali metal hydroxide.
17. A process as claimed in any one of
Claims 13-16 in which the coagulating compound is applied to the substrate in dry form.
18. A process as claimed in any one of the preceding claims in which the concentration of organic film-forming material in the bath is maintained in the range of from 0.2 to 40 weight percent.
19. A process as claimed in any one of the preceding claims in which the substrate is a metal, wood, ceramic, paper, fabric, plastics or glass substrate.
20. A process as claimed in any one of the preceding claims in which the substrate
**WARNING** end of DESC field may overlap start of CLMS **.
Claims (40)
1 minute followed by a tap water rinse and curing of the film resulted in a continuous 0.5 mil coating.
WHAT WE CLAIM IS:
1. A process for coating a substrate comprising:
(A) providing the substrate with a
surface coating or layer of a dry
coagulating compound: and
(B) contacting the coated substrate
with an aqueous bath comprising
organic film-forming material, at
least fifty weight percent of which is
an ionizable, organic film-former
which
(i) has at least 12 carbon atoms per
molecule
(ii) is at least partially ionized such that
it is substantially soluble in said
aqueous bath; and
(iii) coagulates and deposits in the
presence of said coagulating
compound.
2. A process as claimed in Claim 1 in which the coagulating compound is an acid salt, a basic salt or a strong base.
3. A process as claimed in Claim 1 or
Claim 2 in which the coagulating compound has a pH in aqueous solution of less than 7.0 and the organic film-former is a synthetic polycarboxylic acid resin which is at least partially neutralized with a water soluble base.
4. A process as claimed in Claim 3 in which the polycarboxylic acid resin has (i) an electrical equivalent weight of from 1,000 to 20,000, and (ii) an acid number from 30 to 300.
5. A process as claimed in Claim 3 or
Claim 4 wherein said coagulating compound is a salt.
6. A process as claimed in Claim 5 in which the salt is a salt of a First Transition
Series metal.
7. A process as claimed in Claim 5 or
Claim 6 in which the salt has a pH in aqueous solution of from 3.5 to 4.5.
8. A process as claimed in any one of
Claims 5-7 in which the salt is nickel chloride, cupric chloride, cobaltous chloride, cupric nitrate, nickel nitrate, cupric sulfate or zinc chloride.
9. A process as claimed in any one of
Claims 5-8 in which the substrate is a metal substrate and the salt is formed by treating the substrate with an acid.
10. A process as claimed in any one of
Claims 5-8 in which the substrate is a metallic substrate and the salt is formed bv treating the substrate with a solution containing both a dissolved salt and an acid which reacts with the substrate to form a salt.
11. A process as claimed in any one of
Claims 5-10 in which the substrate is a metallic substrate and the coagulating compound is a metal salt.
12. A process as claimed in any one of
Claims 1-8 in which the coagulating compound is applied to the substrate in dry form.
13. A process as claimed in Claim I or
Claim 2 in which the coagulating compound has a pH in aqueous solution greater than 7.0 and the organic film-former is a basic monomer or resin having one or more nitrogen atoms in its molecular structure and is at least partially neutralized by a water soluble acid compound.
14. A process as claimed in Claim 13 in which the coagulating compound is a base having a pH in aqueous solution greater than 10.0, a basic salt or a mixture thereof.
15. A process as claimed in Claim 14 in which the basic salt is a carbonate, silicate, oxalate, salicylate or formate of an alkali metal.
16. A process as claimed in Claim 14 in which said base is alkali metal hydroxide.
17. A process as claimed in any one of
Claims 13-16 in which the coagulating compound is applied to the substrate in dry form.
18. A process as claimed in any one of the preceding claims in which the concentration of organic film-forming material in the bath is maintained in the range of from 0.2 to 40 weight percent.
19. A process as claimed in any one of the preceding claims in which the substrate is a metal, wood, ceramic, paper, fabric, plastics or glass substrate.
20. A process as claimed in any one of the preceding claims in which the substrate
being coated has been pretreated with a zinc phosphate coating.
21. A process as claimed in any one of the preceding claims in which the bath includes particulate material which is codeposited with said organic film-forming material.
22. A process as claimed in Claim 21 in which the particulate material comprises metal particles or ceramic frit.
23. A process as claimed in Claim 21 or
Claim 22 in which the weight ratio of particulate material to organic film-former in the bath is from 1:9 to 30:1.
24. A process as claimed in Claim 24 in which the said ratio is from 1:1 to 20:1.
25. A process as claimed in any one of
Claims 22-24 in which the weight ratio of particulate material to organic film-former in the bath is at least 2.5:1.
26. A process as claimed in Claim 25 in which the said ratio is at least 5:1.
27. A process as claimed in any one of
Claims 21-26 in which the particulate material has an average major dimension of from 2 to 70 microns.
28. A process as claimed in Claim 27 in which the particulate material has an average major dimension of from 2 to 25 microns.
29. A process as claimed in any one of
Claims 21-28 in which the bath contains from 2 to 25 parts by weight of total depositables per 100 parts by weight of the bath.
30. A process as claimed in any one of
Claims 21-29 in which the substrate is a metal or ceramic substrate and is heated after the organic film-forming material and the particulate material are codeposited, to a temperature to vaporize the organic filmforming material.
31. A process as claimed in Claim 30 in which the particulate material is ceramic frit and the substrate is heated after vaporization of the organic film-forming material to a temperature for a time sufficient to convert the ceramic frit to a continuous film on the surface of the substrate.
32. A process as claimed in Claim 30 in which said particulate material is metal particles and said substrate is a metal substrate and which comprises heating the substrate after the organic film-forming material and the metal particles are codeposited thereon, in an atmosphere essentially inert to the metal particles and the coating to a decomposition temperature above the temperature required to decompose the organic film-forming material in the coating and below the diffusion temperature for the particles, maintaining said decomposition temperature until said coating is essentially decomposed and gaseous products thereof are formed in the heating zone, essentially evacuating said gaseous products from said heating zone, maintaining said substrate in said heating zone in an atmosphere essentially inert to the metal particles and raising the temperature of said heating zone to the diffusion temperature of the metal particles, and maintaining said diffusion temperature and said atmosphere for a time necessary to effect the desired diffusion coating.
33. A process as claimed in Claim 32 in which:
(I) said metal particles have an average
diameter of from 0.5 to 20 microns and are
(A) aluminium comprising particles
wherein the weight ratio of
aluminium to other metal is from
200:1 to 1:3 and are selected from
(1) aluminium alloy particles,
(2) a mixture of aluminium particles
and particles of at least one other
metal
(3) a mixture of aluminium particles
and particles of at least one metal
oxide, or
(4) a mixture of aluminium particles
and particles of at least one alloy;
or
(B) aluminium particles: (II) the metal particle to organic film
forming material weight ratio is in
excess of 3:1,
(III) the weight ratio of metal particles in
said bath to organic film-forming
material in the bath is maintained
above 3::1,
(IV) the concentration of organic film
forming material in the bath is
maintained at from 0.2 to 7 weight
percent;
(V) the total weight of non-volatile solids
in the bath is maintained below 35
weight percent of said bath; and
(VI) the heating zone is heated to a
diffusion temperature at least 500
above the melting point of aluminium
and below 22000 F, and said diffusion
temperature and said inert atmosphere
are maintained for a time in excess of I
hour.
34. A process as claimed in Claim 33 in which the coating has an average thickness in the range of from 3 to 7 mils.
35. A process as claimed in Claim 34 in which the diffusion temperature is from 1300"F to 22000F.
36. A process as claimed in Claim 35 in which the diffusion temperature is from 1500"F to 1900"F.
37. A process as claimed in any one of
Claims 33-36 in which the weight ratio of metal particles in the bath to organic filmforming material in the bath is maintained in the range from 5:1 to 20:1.
38. A process as claimed in any one of
Claims 33-37 in which the concentration of organic film-forming material in the bath is maintained in the range of from 0.2 to 2 weight percent.
39. A process as claimed in Claim I substantially as hereinbefore described with reference to the Examples.
40. Coated substrates when obtained by a process as claimed in any one of the preceding claims.
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US65880976A | 1976-02-17 | 1976-02-17 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| GB1562016A true GB1562016A (en) | 1980-03-05 |
Family
ID=24642795
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| GB679077A Expired GB1562016A (en) | 1976-02-17 | 1977-02-17 | Coagulation coating process |
Country Status (12)
| Country | Link |
|---|---|
| JP (1) | JPS5298753A (en) |
| AR (1) | AR229077A1 (en) |
| AU (1) | AU516824B2 (en) |
| BE (1) | BE851466A (en) |
| BR (1) | BR7700971A (en) |
| CA (1) | CA1095787A (en) |
| DE (2) | DE2759361C3 (en) |
| ES (2) | ES456018A1 (en) |
| FR (1) | FR2341630A1 (en) |
| GB (1) | GB1562016A (en) |
| IT (1) | IT1086662B (en) |
| SE (2) | SE435584B (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US8404312B2 (en) | 2006-06-28 | 2013-03-26 | Valspar Sourcing, Inc. | Method and system for edge-coating wood substrates |
| CN113201319A (en) * | 2015-11-20 | 2021-08-03 | 瀚森公司 | Chemical product for surface protection |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4163702A (en) * | 1978-03-29 | 1979-08-07 | General Electric Company | Process for rendering surfaces permanently water wettable and novel product thus-produced |
| GB8508461D0 (en) * | 1985-04-01 | 1985-05-09 | Nicholson J W | Coating processes |
Family Cites Families (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US2956937A (en) * | 1958-04-09 | 1960-10-18 | Westinghouse Electric Corp | Electrophoretic insulating coating |
| GB1378520A (en) * | 1971-05-10 | 1974-12-27 | Atomic Energy Authority Uk | Metallising pastes |
| CA1001910A (en) * | 1972-06-14 | 1976-12-21 | Lester Steinbrecher | Process for coating metals |
| JPS5144540B2 (en) * | 1973-11-08 | 1976-11-29 | ||
| JPS512637A (en) * | 1974-06-27 | 1976-01-10 | Ota Toshuki | TOSOHOHO |
-
1977
- 1977-02-08 AU AU22058/77A patent/AU516824B2/en not_active Expired
- 1977-02-09 IT IT4798077A patent/IT1086662B/en active
- 1977-02-10 CA CA271,777A patent/CA1095787A/en not_active Expired
- 1977-02-15 SE SE7701645A patent/SE435584B/en not_active IP Right Cessation
- 1977-02-16 BR BR7700971A patent/BR7700971A/en unknown
- 1977-02-16 DE DE19772759361 patent/DE2759361C3/en not_active Expired
- 1977-02-16 BE BE174958A patent/BE851466A/en not_active IP Right Cessation
- 1977-02-16 DE DE19772706613 patent/DE2706613C3/en not_active Expired
- 1977-02-17 AR AR26658377A patent/AR229077A1/en active
- 1977-02-17 GB GB679077A patent/GB1562016A/en not_active Expired
- 1977-02-17 FR FR7704537A patent/FR2341630A1/en active Granted
- 1977-02-17 JP JP1558977A patent/JPS5298753A/en active Granted
- 1977-02-17 ES ES456018A patent/ES456018A1/en not_active Expired
-
1978
- 1978-03-01 ES ES467469A patent/ES467469A1/en not_active Expired
-
1982
- 1982-07-22 SE SE8204420A patent/SE453161B/en not_active IP Right Cessation
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US8404312B2 (en) | 2006-06-28 | 2013-03-26 | Valspar Sourcing, Inc. | Method and system for edge-coating wood substrates |
| CN113201319A (en) * | 2015-11-20 | 2021-08-03 | 瀚森公司 | Chemical product for surface protection |
Also Published As
| Publication number | Publication date |
|---|---|
| BE851466A (en) | 1977-06-16 |
| AR229077A1 (en) | 1983-06-15 |
| FR2341630B1 (en) | 1980-06-13 |
| SE453161B (en) | 1988-01-18 |
| AU516824B2 (en) | 1981-06-25 |
| SE7701645L (en) | 1977-08-18 |
| BR7700971A (en) | 1977-10-25 |
| SE8204420L (en) | 1982-07-22 |
| DE2706613C3 (en) | 1980-04-10 |
| DE2759361C3 (en) | 1981-10-01 |
| ES467469A1 (en) | 1978-12-16 |
| JPS6141633B2 (en) | 1986-09-16 |
| DE2706613A1 (en) | 1977-08-18 |
| CA1095787A (en) | 1981-02-17 |
| DE2759361B1 (en) | 1980-09-25 |
| IT1086662B (en) | 1985-05-28 |
| FR2341630A1 (en) | 1977-09-16 |
| SE8204420D0 (en) | 1982-07-22 |
| DE2706613B2 (en) | 1979-07-26 |
| JPS5298753A (en) | 1977-08-18 |
| ES456018A1 (en) | 1978-06-16 |
| AU2205877A (en) | 1978-08-17 |
| SE435584B (en) | 1984-10-08 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PS | Patent sealed | ||
| 746 | Register noted 'licences of right' (sect. 46/1977) | ||
| PCNP | Patent ceased through non-payment of renewal fee |