GB1544056A - Electrical device and method of making same - Google Patents
Electrical device and method of making sameInfo
- Publication number
- GB1544056A GB1544056A GB41144/77A GB4114477A GB1544056A GB 1544056 A GB1544056 A GB 1544056A GB 41144/77 A GB41144/77 A GB 41144/77A GB 4114477 A GB4114477 A GB 4114477A GB 1544056 A GB1544056 A GB 1544056A
- Authority
- GB
- United Kingdom
- Prior art keywords
- electrical device
- making same
- making
- same
- electrical
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J183/00—Adhesives based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon, with or without sulfur, nitrogen, oxygen, or carbon only; Adhesives based on derivatives of such polymers
- C09J183/04—Polysiloxanes
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/02—Elements
- C08K3/08—Metals
-
- H10W70/68—
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2666/00—Composition of polymers characterized by a further compound in the blend, being organic macromolecular compounds, natural resins, waxes or and bituminous materials, non-macromolecular organic substances, inorganic substances or characterized by their function in the composition
- C08L2666/54—Inorganic substances
-
- H10W72/073—
-
- H10W72/07337—
-
- H10W72/354—
Landscapes
- Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Organic Chemistry (AREA)
- Health & Medical Sciences (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Die Bonding (AREA)
- Compositions Of Macromolecular Compounds (AREA)
- Adhesives Or Adhesive Processes (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US72922776A | 1976-10-04 | 1976-10-04 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| GB1544056A true GB1544056A (en) | 1979-04-11 |
Family
ID=24930108
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| GB41144/77A Expired GB1544056A (en) | 1976-10-04 | 1977-10-04 | Electrical device and method of making same |
Country Status (4)
| Country | Link |
|---|---|
| JP (1) | JPS5345972A (en) |
| DE (1) | DE2743773A1 (en) |
| GB (1) | GB1544056A (en) |
| NL (1) | NL7710794A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP1101810A3 (en) * | 1999-11-15 | 2002-05-02 | Dow Corning Toray Silicone Co., Ltd. | Silicone-based bonding sheet and semiconductor device |
| WO2004092294A1 (en) * | 2003-04-15 | 2004-10-28 | Koninklijke Philips Electronics N.V. | Thermally resistant adhesive |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE3001613C2 (en) * | 1980-01-17 | 1986-04-03 | Siemens AG, 1000 Berlin und 8000 München | Attachment of a silicon semiconductor body containing a monolithically integrated semiconductor circuit to a support using a corresponding method for this purpose |
| JPS6066843A (en) * | 1983-09-22 | 1985-04-17 | Hitachi Ltd | Integrated circuit package |
| JP4482283B2 (en) * | 2002-03-20 | 2010-06-16 | 新日本製鐵株式会社 | Manufacturing method of high temperature operating electrical equipment |
| JP4813827B2 (en) * | 2005-06-15 | 2011-11-09 | 株式会社アルバック | Conductive adhesive having silica skeleton and method for producing the same |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5158868A (en) * | 1974-11-20 | 1976-05-22 | Hitachi Ltd | HANDOTA ISOCHI |
-
1977
- 1977-09-29 DE DE19772743773 patent/DE2743773A1/en not_active Ceased
- 1977-10-03 NL NL7710794A patent/NL7710794A/en not_active Application Discontinuation
- 1977-10-04 GB GB41144/77A patent/GB1544056A/en not_active Expired
- 1977-10-04 JP JP11871477A patent/JPS5345972A/en active Pending
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP1101810A3 (en) * | 1999-11-15 | 2002-05-02 | Dow Corning Toray Silicone Co., Ltd. | Silicone-based bonding sheet and semiconductor device |
| WO2004092294A1 (en) * | 2003-04-15 | 2004-10-28 | Koninklijke Philips Electronics N.V. | Thermally resistant adhesive |
| US7238305B2 (en) | 2003-04-15 | 2007-07-03 | Koninklijke Philips Electronics N.V. | Thermally resistant adhesive |
| CN100537691C (en) * | 2003-04-15 | 2009-09-09 | 皇家飞利浦电子股份有限公司 | heat resistant adhesive |
Also Published As
| Publication number | Publication date |
|---|---|
| NL7710794A (en) | 1978-04-06 |
| JPS5345972A (en) | 1978-04-25 |
| DE2743773A1 (en) | 1978-04-06 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PS | Patent sealed [section 19, patents act 1949] | ||
| PCNP | Patent ceased through non-payment of renewal fee |