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GB1447058A - Gold electroplating composition and process - Google Patents

Gold electroplating composition and process

Info

Publication number
GB1447058A
GB1447058A GB3786073A GB3786073A GB1447058A GB 1447058 A GB1447058 A GB 1447058A GB 3786073 A GB3786073 A GB 3786073A GB 3786073 A GB3786073 A GB 3786073A GB 1447058 A GB1447058 A GB 1447058A
Authority
GB
United Kingdom
Prior art keywords
gold
metals
electro
bath
alloy
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
GB3786073A
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Oxy Metal Industries Corp
Original Assignee
Oxy Metal Industries Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Oxy Metal Industries Corp filed Critical Oxy Metal Industries Corp
Publication of GB1447058A publication Critical patent/GB1447058A/en
Expired legal-status Critical Current

Links

Classifications

    • CCHEMISTRY; METALLURGY
    • C07ORGANIC CHEMISTRY
    • C07HSUGARS; DERIVATIVES THEREOF; NUCLEOSIDES; NUCLEOTIDES; NUCLEIC ACIDS
    • C07H11/00Compounds containing saccharide radicals esterified by inorganic acids; Metal salts thereof
    • C07H11/04Phosphates; Phosphites; Polyphosphates
    • CCHEMISTRY; METALLURGY
    • C07ORGANIC CHEMISTRY
    • C07FACYCLIC, CARBOCYCLIC OR HETEROCYCLIC COMPOUNDS CONTAINING ELEMENTS OTHER THAN CARBON, HYDROGEN, HALOGEN, OXYGEN, NITROGEN, SULFUR, SELENIUM OR TELLURIUM
    • C07F9/00Compounds containing elements of Groups 5 or 15 of the Periodic Table
    • C07F9/02Phosphorus compounds
    • C07F9/28Phosphorus compounds with one or more P—C bonds
    • C07F9/38Phosphonic acids [RP(=O)(OH)2]; Thiophosphonic acids ; [RP(=X1)(X2H)2(X1, X2 are each independently O, S or Se)]
    • CCHEMISTRY; METALLURGY
    • C25ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25DPROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00Electroplating: Baths therefor
    • C25D3/02Electroplating: Baths therefor from solutions
    • C25D3/48Electroplating: Baths therefor from solutions of gold
    • CCHEMISTRY; METALLURGY
    • C25ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25DPROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00Electroplating: Baths therefor
    • C25D3/02Electroplating: Baths therefor from solutions
    • C25D3/56Electroplating: Baths therefor from solutions of alloys
    • C25D3/62Electroplating: Baths therefor from solutions of alloys containing more than 50% by weight of gold

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Biochemistry (AREA)
  • General Health & Medical Sciences (AREA)
  • Molecular Biology (AREA)
  • Health & Medical Sciences (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Biotechnology (AREA)
  • Genetics & Genomics (AREA)
  • Electroplating And Plating Baths Therefor (AREA)

Abstract

1447058 Electro-deposition of gold and gold alloys OXY METAL FINISHING CORP 9 Aug 1973 [10 Aug 1972] 37860/73 Heading C7B Gold or gold alloy is electro-deposited from a bath comprising a gold sulphite, optionally alloying metal(s) and a water-soluble stable organic compound which will not chemically reduce gold compounds to metallic gold and which includes at least one P atom having up to four bonds identical or different chosen among PR and POR and having connected to the possibly remaining free valencies of said P atom substituents selected among O and OH, the latter being free or in the form of salts of alkali metals, NH<SP>+</SP> 4 , alkaline earth metals or metals which participate in the electro-deposition of the gold, the symbols R being monovalent or divalent, identical or different radicals. Various examples are given of suitable phosphorus compounds. The bath may also contain alkali metal or ammonium sulphite and a chelating agent. Metals which may be present either as brighteners or as alloy constituents include Fe, Co, Ni, Zn, Cd, Sn, Cu, Bi, Ga, In, Pb, Mu, Mo, Ag, Tl, Zr, V, W, As, Sb, Se or a Pt group metal. An alloy deposited from the bath may contain 20% Cd.
GB3786073A 1972-08-10 1973-08-09 Gold electroplating composition and process Expired GB1447058A (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
CH1197572A CH555894A (en) 1972-08-10 1972-08-10 USE OF ORGANOPHOSPHORUS DERIVATIVES IN SULPHIC BATHS FOR THE ELECTRODEPOSITION OF GOLD AND GOLD ALLOYS.
CH1138873 1973-08-06

Publications (1)

Publication Number Publication Date
GB1447058A true GB1447058A (en) 1976-08-25

Family

ID=25708235

Family Applications (1)

Application Number Title Priority Date Filing Date
GB3786073A Expired GB1447058A (en) 1972-08-10 1973-08-09 Gold electroplating composition and process

Country Status (8)

Country Link
US (1) US3904493A (en)
CH (1) CH555894A (en)
DE (1) DE2340462C3 (en)
ES (1) ES417762A1 (en)
FR (1) FR2253106B1 (en)
GB (1) GB1447058A (en)
IT (1) IT994135B (en)
NL (1) NL7311108A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6576114B1 (en) 1995-11-03 2003-06-10 Enthone Inc. Electroplating composition bath
CN113571698A (en) * 2021-09-23 2021-10-29 中南大学 A metal selenide/carbon composite material controlled by carbon dots and its preparation method and application

Families Citing this family (25)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4579720A (en) * 1965-08-24 1986-04-01 Plains Chemical Development Co. Chelation
US4012294A (en) * 1972-08-10 1977-03-15 Oxy Metal Industries Corporation Gold sulfite baths containing organophosphorous compounds
US4029696A (en) * 1976-04-09 1977-06-14 Benckiser-Knapsack Gmbh N-hydroxy alkane amino alkane diphosphonic acids, process of producing same, and compositions for and method of using same
DE2621606C2 (en) * 1976-05-14 1987-04-16 Bayer Ag, 5090 Leverkusen Use of propane-1,3-diphosphonic acids for water conditioning
US4197172A (en) * 1979-04-05 1980-04-08 American Chemical & Refining Company Incorporated Gold plating composition and method
US4212708A (en) * 1979-06-05 1980-07-15 Belikin Alexandr V Gold-plating electrolyte
CH632533A5 (en) * 1979-06-14 1982-10-15 Aliprandini P PROCESS FOR THE GALVANOPLASTIC DEPOSIT OF A GOLD ALLOY.
US4253920A (en) * 1980-03-20 1981-03-03 American Chemical & Refining Company, Incorporated Composition and method for gold plating
US4396471A (en) * 1981-12-14 1983-08-02 American Chemical & Refining Company, Inc. Gold plating bath and method using maleic anhydride polymer chelate
US4670107A (en) * 1986-03-05 1987-06-02 Vanguard Research Associates, Inc. Electrolyte solution and process for high speed gold plating
US4802990A (en) * 1987-07-30 1989-02-07 Inskeep Jr Eugene L Solution and method for dissolving minerals
FI89364C (en) * 1990-12-20 1993-09-27 Leiras Oy Process for the preparation of novel, pharmacologically useful methylene bisphosphonic acid derivatives
US5277790A (en) * 1992-07-10 1994-01-11 Technic Incorporated Non-cyanide electroplating solution for gold or alloys thereof
US6899805B2 (en) * 1998-05-01 2005-05-31 Semitool, Inc. Automated chemical management system executing improved electrolyte analysis method
US6365033B1 (en) 1999-05-03 2002-04-02 Semitoof, Inc. Methods for controlling and/or measuring additive concentration in an electroplating bath
USRE38931E1 (en) * 1998-05-01 2006-01-10 Semitool, Inc. Methods for controlling and/or measuring additive concentration in an electroplating bath
US6814855B2 (en) * 1998-05-01 2004-11-09 Semitool, Inc. Automated chemical management system having improved analysis unit
WO2000005747A2 (en) 1998-06-30 2000-02-03 Semitool, Inc. Metallization structures for microelectronic applications and process for forming the structures
EP1103637A1 (en) * 1999-11-29 2001-05-30 ENTHONE-OMI, Inc. Method of producing AuCuGa alloy coating using electrolysis, and alloys produced by such a method
JP3482402B2 (en) * 2001-06-29 2003-12-22 日本エレクトロプレイテイング・エンジニヤース株式会社 Replacement gold plating solution
US6592736B2 (en) 2001-07-09 2003-07-15 Semitool, Inc. Methods and apparatus for controlling an amount of a chemical constituent of an electrochemical bath
US6991710B2 (en) 2002-02-22 2006-01-31 Semitool, Inc. Apparatus for manually and automatically processing microelectronic workpieces
US20100170855A1 (en) * 2009-01-06 2010-07-08 Hay Daniel N T Modification of precipitate morphology and settling characteristics in acid conditions
US9028787B2 (en) * 2009-09-25 2015-05-12 Cytec Technology Corp. Preventing or reducing scale in wet-process phosphoric acid production
ITFI20130057A1 (en) * 2013-03-18 2014-09-19 Bluclad S R L SOLUTION FOR THE ELECTRODEPTITION OF A GOLDEN LEAGUE AND THE LEAGUE THEREOF DERIVING.

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3057789A (en) * 1959-02-26 1962-10-09 Paul T Smith Gold plating bath and process
US3475292A (en) * 1966-02-10 1969-10-28 Technic Gold plating bath and process
US3672969A (en) * 1970-10-26 1972-06-27 Lea Ronal Inc Electrodeposition of gold and gold alloys
US3666640A (en) * 1971-04-23 1972-05-30 Sel Rex Corp Gold plating bath and process
US3770596A (en) * 1972-07-21 1973-11-06 Auric Corp Gold plating bath for barrel plating operations

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6576114B1 (en) 1995-11-03 2003-06-10 Enthone Inc. Electroplating composition bath
CN113571698A (en) * 2021-09-23 2021-10-29 中南大学 A metal selenide/carbon composite material controlled by carbon dots and its preparation method and application

Also Published As

Publication number Publication date
FR2253106B1 (en) 1976-11-19
CH555894A (en) 1974-11-15
US3904493A (en) 1975-09-09
DE2340462C3 (en) 1978-10-12
DE2340462B2 (en) 1978-02-02
ES417762A1 (en) 1976-06-16
FR2253106A1 (en) 1975-06-27
NL7311108A (en) 1974-02-12
DE2340462A1 (en) 1974-02-28
IT994135B (en) 1975-10-20

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Legal Events

Date Code Title Description
PS Patent sealed [section 19, patents act 1949]
732 Registration of transactions, instruments or events in the register (sect. 32/1977)
PCNP Patent ceased through non-payment of renewal fee