GB1330081A - Semiconductor components - Google Patents
Semiconductor componentsInfo
- Publication number
- GB1330081A GB1330081A GB1000172A GB1000172A GB1330081A GB 1330081 A GB1330081 A GB 1330081A GB 1000172 A GB1000172 A GB 1000172A GB 1000172 A GB1000172 A GB 1000172A GB 1330081 A GB1330081 A GB 1330081A
- Authority
- GB
- United Kingdom
- Prior art keywords
- discs
- semi
- flanges
- urged together
- ring
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- H10W40/10—
-
- H10W76/138—
Landscapes
- Die Bonding (AREA)
Abstract
1330081 Semi-conductor devices SIEMENS AG 3 March 1972 [15 April 1971] 10001/72 Heading H1K Two rigid cover discs 1, 2 on opposite sides of a semi-conductor element 3 are urged together so that axially inwardly directed annular projections 5, 7 near their respective edges, e.g. situated on relatively thin radially outwardly projecting flanges 4, 6, are pressed into an elastic insulating ring 8 to seal the enclosure around the element 3. In the embodiment shown the discs 1, 2 are urged together by annular elastic claws 9, preferably integral with the ring 8. Alternative means for urging the discs 1, 2 together include a heat-shrunk plastics tube or co-acting screw-threaded caps engaging the flanges 4, 6. The discs 1, 2 may be of Cu or Cu and Mo, and may be Ni-coated where they contact the silvered electrodes of the element 3. The contacts may be soldered or maintained by pressure alone. Cooling bodies may be attached to the discs 1, 2.
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| DE19712118356 DE2118356A1 (en) | 1971-04-15 | 1971-04-15 | Disc-shaped semiconductor component |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| GB1330081A true GB1330081A (en) | 1973-09-12 |
Family
ID=5804825
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| GB1000172A Expired GB1330081A (en) | 1971-04-15 | 1972-03-03 | Semiconductor components |
Country Status (6)
| Country | Link |
|---|---|
| DE (1) | DE2118356A1 (en) |
| FR (1) | FR2133561B1 (en) |
| GB (1) | GB1330081A (en) |
| IT (1) | IT957175B (en) |
| NL (1) | NL7202856A (en) |
| SE (1) | SE383583B (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE102011017563B4 (en) * | 2010-04-27 | 2015-10-22 | Mitsubishi Electric Corp. | Pressure contact semiconductor device |
Families Citing this family (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE2654532C3 (en) * | 1976-12-02 | 1982-03-11 | Licentia Patent-Verwaltungs-Gmbh, 6000 Frankfurt | Disc-shaped semiconductor cell |
| FR2440077A1 (en) * | 1978-10-23 | 1980-05-23 | Transformation En Cie Indle | Semiconductor power module casing - with metal discs pressed against O=ring by insulating lipped clamp ring |
| DE3221794A1 (en) * | 1982-06-09 | 1983-12-15 | Brown, Boveri & Cie Ag, 6800 Mannheim | DISC-SHAPED SEMICONDUCTOR CELL FOR PRESSURE-CONTACTABLE POWER SEMICONDUCTOR COMPONENTS |
| US4829364A (en) * | 1985-11-29 | 1989-05-09 | Mitsubishi Denki Kabushiki Kaisha | Semiconductor device |
| USRE34696E (en) * | 1985-11-29 | 1994-08-16 | Mitsubishi Denki Kabushiki | Semiconductor device housing with electrodes in press contact with the opposite sides of chip |
| DE102015113111B4 (en) * | 2015-08-10 | 2020-01-30 | Infineon Technologies Ag | Power semiconductor module with improved sealing |
Family Cites Families (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| SE316534B (en) * | 1965-07-09 | 1969-10-27 | Asea Ab | |
| US3476986A (en) * | 1966-09-17 | 1969-11-04 | Nippon Electric Co | Pressure contact semiconductor devices |
| GB1189062A (en) * | 1967-03-23 | 1970-04-22 | Motorola Inc | Semiconductor Rectifier Assembly |
| GB1219570A (en) * | 1967-08-04 | 1971-01-20 | Lucas Industries Ltd | Diode units |
| CH494471A (en) * | 1967-11-09 | 1970-07-31 | Ckd Praha | Semiconductor component |
-
1971
- 1971-04-15 DE DE19712118356 patent/DE2118356A1/en active Pending
- 1971-12-28 FR FR7146963A patent/FR2133561B1/fr not_active Expired
-
1972
- 1972-03-03 GB GB1000172A patent/GB1330081A/en not_active Expired
- 1972-03-03 NL NL7202856A patent/NL7202856A/xx unknown
- 1972-04-12 IT IT7212/72A patent/IT957175B/en active
- 1972-04-13 SE SE7204808A patent/SE383583B/en unknown
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE102011017563B4 (en) * | 2010-04-27 | 2015-10-22 | Mitsubishi Electric Corp. | Pressure contact semiconductor device |
Also Published As
| Publication number | Publication date |
|---|---|
| FR2133561B1 (en) | 1977-03-18 |
| IT957175B (en) | 1973-10-10 |
| DE2118356A1 (en) | 1972-10-26 |
| NL7202856A (en) | 1972-10-17 |
| SE383583B (en) | 1976-03-15 |
| FR2133561A1 (en) | 1972-12-01 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PS | Patent sealed [section 19, patents act 1949] | ||
| PCNP | Patent ceased through non-payment of renewal fee |