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GB1312714A - Methods of making multilayer printed circuit assemblies - Google Patents

Methods of making multilayer printed circuit assemblies

Info

Publication number
GB1312714A
GB1312714A GB1694170A GB1312714DA GB1312714A GB 1312714 A GB1312714 A GB 1312714A GB 1694170 A GB1694170 A GB 1694170A GB 1312714D A GB1312714D A GB 1312714DA GB 1312714 A GB1312714 A GB 1312714A
Authority
GB
United Kingdom
Prior art keywords
layers
printed circuit
boards
stack
multilayer printed
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
GB1694170A
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
General Electric Company PLC
Original Assignee
General Electric Company PLC
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by General Electric Company PLC filed Critical General Electric Company PLC
Publication of GB1312714A publication Critical patent/GB1312714A/en
Expired legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B5/00—Layered products characterised by the non- homogeneity or physical structure, i.e. comprising a fibrous, filamentary, particulate or foam layer; Layered products characterised by having a layer differing constitutionally or physically in different parts
    • B32B5/18—Layered products characterised by the non- homogeneity or physical structure, i.e. comprising a fibrous, filamentary, particulate or foam layer; Layered products characterised by having a layer differing constitutionally or physically in different parts characterised by features of a layer of foamed material
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/12—Layered products comprising a layer of synthetic resin next to a fibrous or filamentary layer
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B29/00—Layered products comprising a layer of paper or cardboard
    • B32B29/02—Layered products comprising a layer of paper or cardboard next to a fibrous or filamentary layer
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B5/00—Layered products characterised by the non- homogeneity or physical structure, i.e. comprising a fibrous, filamentary, particulate or foam layer; Layered products characterised by having a layer differing constitutionally or physically in different parts
    • B32B5/22—Layered products characterised by the non- homogeneity or physical structure, i.e. comprising a fibrous, filamentary, particulate or foam layer; Layered products characterised by having a layer differing constitutionally or physically in different parts characterised by the presence of two or more layers which are next to each other and are fibrous, filamentary, formed of particles or foamed
    • B32B5/24—Layered products characterised by the non- homogeneity or physical structure, i.e. comprising a fibrous, filamentary, particulate or foam layer; Layered products characterised by having a layer differing constitutionally or physically in different parts characterised by the presence of two or more layers which are next to each other and are fibrous, filamentary, formed of particles or foamed one layer being a fibrous or filamentary layer
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2266/00—Composition of foam
    • B32B2266/02—Organic
    • B32B2266/0214—Materials belonging to B32B27/00
    • B32B2266/0278—Polyurethane
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2457/00—Electrical equipment
    • B32B2457/08—PCBs, i.e. printed circuit boards
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/06—Lamination
    • H05K2203/068—Features of the lamination press or of the lamination process, e.g. using special separator sheets

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Laminated Bodies (AREA)

Abstract

1312714 Laminated printed circuit assemblies GENERAL ELECTRIC CO Ltd 19 April 1971 [9 April 1970] 16941/70 Heading B5N [Also in Division H1] A method of making a multilayer printed circuit assembly comprises coating at least some of the boards to be assembled with a bonding epoxy resin, positioning the boards to form an open stack, evacuating the stack in an evacuating enclosure and then compressing the stack while evacuated to form the assembly. In the embodiment disclosed printed circuit boards 1 of epoxy-resin impregnated woven glass fibre and intermediate woven glass fibre layers 2 are interspersed with collapsible layers 3 of crimped preformed paper or acrylic sheet or polyurethane foam. Pins 6 act to locate the layers. Layers 1, 2 are all impregnated or coated with the bonding resin. In a further embodiment the collapsible layers 3 are dispensed with. The boards 1 and layers 2 are supported in the vertical plane by pins (as 6).
GB1694170A 1970-04-09 1970-04-09 Methods of making multilayer printed circuit assemblies Expired GB1312714A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
GB1694170 1970-04-09

Publications (1)

Publication Number Publication Date
GB1312714A true GB1312714A (en) 1973-04-04

Family

ID=10086424

Family Applications (1)

Application Number Title Priority Date Filing Date
GB1694170A Expired GB1312714A (en) 1970-04-09 1970-04-09 Methods of making multilayer printed circuit assemblies

Country Status (1)

Country Link
GB (1) GB1312714A (en)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3539989A1 (en) * 1985-11-12 1987-05-14 Lauffer Maschf Press for laminating multilayer circuits
GB2265496A (en) * 1992-03-25 1993-09-29 Dyconex Ag Improvements in or relating to printed circuit board reinforcement
EP0724946A3 (en) * 1986-09-15 1997-04-23 Compositech Ltd Reinforced plastic laminates for use in the production of printed circuit boards and process for making such laminates and resulting products
WO2016133465A1 (en) * 2015-02-17 2016-08-25 Agency For Science, Technology And Research A composite laminate and its usage
DE112009003811B4 (en) * 2008-12-25 2017-04-06 Mitsubishi Electric Corporation Method for producing a printed circuit board

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3539989A1 (en) * 1985-11-12 1987-05-14 Lauffer Maschf Press for laminating multilayer circuits
EP0724946A3 (en) * 1986-09-15 1997-04-23 Compositech Ltd Reinforced plastic laminates for use in the production of printed circuit boards and process for making such laminates and resulting products
GB2265496A (en) * 1992-03-25 1993-09-29 Dyconex Ag Improvements in or relating to printed circuit board reinforcement
GB2265496B (en) * 1992-03-25 1995-05-31 Dyconex Ag Improvements in or relating to printed circuit board reinforcement
DE112009003811B4 (en) * 2008-12-25 2017-04-06 Mitsubishi Electric Corporation Method for producing a printed circuit board
WO2016133465A1 (en) * 2015-02-17 2016-08-25 Agency For Science, Technology And Research A composite laminate and its usage

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Legal Events

Date Code Title Description
PS Patent sealed [section 19, patents act 1949]
PLNP Patent lapsed through nonpayment of renewal fees