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GB1380466A - Gate protective device for insulated gate fieldeffect transistors - Google Patents

Gate protective device for insulated gate fieldeffect transistors

Info

Publication number
GB1380466A
GB1380466A GB1497872A GB1497872A GB1380466A GB 1380466 A GB1380466 A GB 1380466A GB 1497872 A GB1497872 A GB 1497872A GB 1497872 A GB1497872 A GB 1497872A GB 1380466 A GB1380466 A GB 1380466A
Authority
GB
United Kingdom
Prior art keywords
diodes
gate
film
semi
insulating material
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
GB1497872A
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
RCA Corp
Original Assignee
RCA Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by RCA Corp filed Critical RCA Corp
Publication of GB1380466A publication Critical patent/GB1380466A/en
Expired legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10DINORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D86/00Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10DINORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D86/00Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates
    • H10D86/01Manufacture or treatment
    • H10D86/03Manufacture or treatment wherein the substrate comprises sapphire, e.g. silicon-on-sapphire [SOS]
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10DINORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D89/00Aspects of integrated devices not covered by groups H10D84/00 - H10D88/00
    • H10D89/60Integrated devices comprising arrangements for electrical or thermal protection, e.g. protection circuits against electrostatic discharge [ESD]
    • H10D89/601Integrated devices comprising arrangements for electrical or thermal protection, e.g. protection circuits against electrostatic discharge [ESD] for devices having insulated gate electrodes, e.g. for IGFETs or IGBTs
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10DINORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D89/00Aspects of integrated devices not covered by groups H10D84/00 - H10D88/00
    • H10D89/60Integrated devices comprising arrangements for electrical or thermal protection, e.g. protection circuits against electrostatic discharge [ESD]
    • H10D89/601Integrated devices comprising arrangements for electrical or thermal protection, e.g. protection circuits against electrostatic discharge [ESD] for devices having insulated gate electrodes, e.g. for IGFETs or IGBTs
    • H10D89/611Integrated devices comprising arrangements for electrical or thermal protection, e.g. protection circuits against electrostatic discharge [ESD] for devices having insulated gate electrodes, e.g. for IGFETs or IGBTs using diodes as protective elements

Landscapes

  • Semiconductor Integrated Circuits (AREA)
  • Metal-Oxide And Bipolar Metal-Oxide Semiconductor Integrated Circuits (AREA)
  • Thin Film Transistor (AREA)

Abstract

1380466 Semi-conductor devices RCA CORPORATION 30 March 1972 [12 July 1971] 14978/72 Heading H1K A gate insulation protection device for an insulated gate field effect transistor 42 comprises a plurality of degenerately doped back to back diodes, 70, formed in a semi-conductor film 50 disposed on insulating material 44. The diodes may be formed from nine degenerately doped regions 72, 74 of alternating conductivity type, forming eight Zener diodes connected in series between the gate electrode 63 and either the source or drain region 64, 66 respectively. The insulating material may be sapphire or spinel, the film 50 being of epitaxially deposited silicon 10,000Š thick. The degenerate doping level may be in excess of 5 + 10<SP>19</SP> atoms/cc. An insulating film 78 over the diodes may be thermally grown silicon dioxide, and aluminium conductive tracks used for interconnections. Doping may be by means of boron. In an alternative embodiment, the diodes are similarly formed on an insulating film on a semiconductor substrate in which the I.G.F.E.T. is formed. One connection to the diodes may be by means of a conductive track leading to a diffused region in the substrate.
GB1497872A 1971-07-12 1972-03-30 Gate protective device for insulated gate fieldeffect transistors Expired GB1380466A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US16147871A 1971-07-12 1971-07-12

Publications (1)

Publication Number Publication Date
GB1380466A true GB1380466A (en) 1975-01-15

Family

ID=22581334

Family Applications (1)

Application Number Title Priority Date Filing Date
GB1497872A Expired GB1380466A (en) 1971-07-12 1972-03-30 Gate protective device for insulated gate fieldeffect transistors

Country Status (10)

Country Link
JP (1) JPS5138587B1 (en)
AU (1) AU471347B2 (en)
BE (1) BE781698A (en)
CA (1) CA941515A (en)
DE (1) DE2215850A1 (en)
FR (1) FR2145460B1 (en)
GB (1) GB1380466A (en)
IT (1) IT951315B (en)
NL (1) NL7204607A (en)
SE (1) SE379117B (en)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0060635A3 (en) * 1981-02-27 1983-08-03 Hitachi, Ltd. A semiconductor integrated circuit device including a protection element
US5005061A (en) * 1990-02-05 1991-04-02 Motorola, Inc. Avalanche stress protected semiconductor device having variable input impedance
US5365099A (en) * 1988-12-02 1994-11-15 Motorola, Inc. Semiconductor device having high energy sustaining capability and a temperature compensated sustaining voltage
DE102013215427B4 (en) 2012-08-06 2023-03-30 Denso Corporation diode

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2404922A1 (en) * 1977-09-30 1979-04-27 Radiotechnique Compelec PROM cells with diodes and fuses - has PN junction diode and electrically destructible element to re-form broken junction or open new junction
JPS5825264A (en) * 1981-08-07 1983-02-15 Hitachi Ltd Insulated gate type semiconductor device and manufacture thereof
US5025298A (en) * 1989-08-22 1991-06-18 Motorola, Inc. Semiconductor structure with closely coupled substrate temperature sense element
EP0622850B1 (en) * 1993-04-30 1999-04-21 International Business Machines Corporation Process for making an electrostatic discharge protect diode for silicon-on-insulator technology

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3728591A (en) * 1971-09-03 1973-04-17 Rca Corp Gate protective device for insulated gate field-effect transistors

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0060635A3 (en) * 1981-02-27 1983-08-03 Hitachi, Ltd. A semiconductor integrated circuit device including a protection element
US5365099A (en) * 1988-12-02 1994-11-15 Motorola, Inc. Semiconductor device having high energy sustaining capability and a temperature compensated sustaining voltage
US5631187A (en) * 1988-12-02 1997-05-20 Motorola, Inc. Method for making semiconductor device having high energy sustaining capability and a temperature compensated sustaining voltage
US5005061A (en) * 1990-02-05 1991-04-02 Motorola, Inc. Avalanche stress protected semiconductor device having variable input impedance
DE102013215427B4 (en) 2012-08-06 2023-03-30 Denso Corporation diode

Also Published As

Publication number Publication date
AU471347B2 (en) 1973-10-18
DE2215850A1 (en) 1973-02-08
NL7204607A (en) 1973-01-16
JPS5138587B1 (en) 1976-10-22
BE781698A (en) 1972-07-31
IT951315B (en) 1973-06-30
FR2145460B1 (en) 1977-01-14
CA941515A (en) 1974-02-05
SE379117B (en) 1975-09-22
AU4099372A (en) 1973-10-18
FR2145460A1 (en) 1973-02-23

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Legal Events

Date Code Title Description
PS Patent sealed [section 19, patents act 1949]
PCNP Patent ceased through non-payment of renewal fee