GB1380466A - Gate protective device for insulated gate fieldeffect transistors - Google Patents
Gate protective device for insulated gate fieldeffect transistorsInfo
- Publication number
- GB1380466A GB1380466A GB1497872A GB1497872A GB1380466A GB 1380466 A GB1380466 A GB 1380466A GB 1497872 A GB1497872 A GB 1497872A GB 1497872 A GB1497872 A GB 1497872A GB 1380466 A GB1380466 A GB 1380466A
- Authority
- GB
- United Kingdom
- Prior art keywords
- diodes
- gate
- film
- semi
- insulating material
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D86/00—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D86/00—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates
- H10D86/01—Manufacture or treatment
- H10D86/03—Manufacture or treatment wherein the substrate comprises sapphire, e.g. silicon-on-sapphire [SOS]
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D89/00—Aspects of integrated devices not covered by groups H10D84/00 - H10D88/00
- H10D89/60—Integrated devices comprising arrangements for electrical or thermal protection, e.g. protection circuits against electrostatic discharge [ESD]
- H10D89/601—Integrated devices comprising arrangements for electrical or thermal protection, e.g. protection circuits against electrostatic discharge [ESD] for devices having insulated gate electrodes, e.g. for IGFETs or IGBTs
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D89/00—Aspects of integrated devices not covered by groups H10D84/00 - H10D88/00
- H10D89/60—Integrated devices comprising arrangements for electrical or thermal protection, e.g. protection circuits against electrostatic discharge [ESD]
- H10D89/601—Integrated devices comprising arrangements for electrical or thermal protection, e.g. protection circuits against electrostatic discharge [ESD] for devices having insulated gate electrodes, e.g. for IGFETs or IGBTs
- H10D89/611—Integrated devices comprising arrangements for electrical or thermal protection, e.g. protection circuits against electrostatic discharge [ESD] for devices having insulated gate electrodes, e.g. for IGFETs or IGBTs using diodes as protective elements
Landscapes
- Semiconductor Integrated Circuits (AREA)
- Metal-Oxide And Bipolar Metal-Oxide Semiconductor Integrated Circuits (AREA)
- Thin Film Transistor (AREA)
Abstract
1380466 Semi-conductor devices RCA CORPORATION 30 March 1972 [12 July 1971] 14978/72 Heading H1K A gate insulation protection device for an insulated gate field effect transistor 42 comprises a plurality of degenerately doped back to back diodes, 70, formed in a semi-conductor film 50 disposed on insulating material 44. The diodes may be formed from nine degenerately doped regions 72, 74 of alternating conductivity type, forming eight Zener diodes connected in series between the gate electrode 63 and either the source or drain region 64, 66 respectively. The insulating material may be sapphire or spinel, the film 50 being of epitaxially deposited silicon 10,000 thick. The degenerate doping level may be in excess of 5 + 10<SP>19</SP> atoms/cc. An insulating film 78 over the diodes may be thermally grown silicon dioxide, and aluminium conductive tracks used for interconnections. Doping may be by means of boron. In an alternative embodiment, the diodes are similarly formed on an insulating film on a semiconductor substrate in which the I.G.F.E.T. is formed. One connection to the diodes may be by means of a conductive track leading to a diffused region in the substrate.
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US16147871A | 1971-07-12 | 1971-07-12 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| GB1380466A true GB1380466A (en) | 1975-01-15 |
Family
ID=22581334
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| GB1497872A Expired GB1380466A (en) | 1971-07-12 | 1972-03-30 | Gate protective device for insulated gate fieldeffect transistors |
Country Status (10)
| Country | Link |
|---|---|
| JP (1) | JPS5138587B1 (en) |
| AU (1) | AU471347B2 (en) |
| BE (1) | BE781698A (en) |
| CA (1) | CA941515A (en) |
| DE (1) | DE2215850A1 (en) |
| FR (1) | FR2145460B1 (en) |
| GB (1) | GB1380466A (en) |
| IT (1) | IT951315B (en) |
| NL (1) | NL7204607A (en) |
| SE (1) | SE379117B (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0060635A3 (en) * | 1981-02-27 | 1983-08-03 | Hitachi, Ltd. | A semiconductor integrated circuit device including a protection element |
| US5005061A (en) * | 1990-02-05 | 1991-04-02 | Motorola, Inc. | Avalanche stress protected semiconductor device having variable input impedance |
| US5365099A (en) * | 1988-12-02 | 1994-11-15 | Motorola, Inc. | Semiconductor device having high energy sustaining capability and a temperature compensated sustaining voltage |
| DE102013215427B4 (en) | 2012-08-06 | 2023-03-30 | Denso Corporation | diode |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| FR2404922A1 (en) * | 1977-09-30 | 1979-04-27 | Radiotechnique Compelec | PROM cells with diodes and fuses - has PN junction diode and electrically destructible element to re-form broken junction or open new junction |
| JPS5825264A (en) * | 1981-08-07 | 1983-02-15 | Hitachi Ltd | Insulated gate type semiconductor device and manufacture thereof |
| US5025298A (en) * | 1989-08-22 | 1991-06-18 | Motorola, Inc. | Semiconductor structure with closely coupled substrate temperature sense element |
| EP0622850B1 (en) * | 1993-04-30 | 1999-04-21 | International Business Machines Corporation | Process for making an electrostatic discharge protect diode for silicon-on-insulator technology |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3728591A (en) * | 1971-09-03 | 1973-04-17 | Rca Corp | Gate protective device for insulated gate field-effect transistors |
-
1972
- 1972-03-16 CA CA137,313A patent/CA941515A/en not_active Expired
- 1972-03-30 DE DE2215850A patent/DE2215850A1/en active Pending
- 1972-03-30 GB GB1497872A patent/GB1380466A/en not_active Expired
- 1972-04-05 BE BE781698A patent/BE781698A/en unknown
- 1972-04-06 NL NL7204607A patent/NL7204607A/xx not_active Application Discontinuation
- 1972-04-10 AU AU40993/72A patent/AU471347B2/en not_active Expired
- 1972-04-11 SE SE7204661A patent/SE379117B/xx unknown
- 1972-04-11 FR FR7212677A patent/FR2145460B1/fr not_active Expired
- 1972-04-11 IT IT23019/72A patent/IT951315B/en active
- 1972-04-12 JP JP47036813A patent/JPS5138587B1/ja active Pending
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0060635A3 (en) * | 1981-02-27 | 1983-08-03 | Hitachi, Ltd. | A semiconductor integrated circuit device including a protection element |
| US5365099A (en) * | 1988-12-02 | 1994-11-15 | Motorola, Inc. | Semiconductor device having high energy sustaining capability and a temperature compensated sustaining voltage |
| US5631187A (en) * | 1988-12-02 | 1997-05-20 | Motorola, Inc. | Method for making semiconductor device having high energy sustaining capability and a temperature compensated sustaining voltage |
| US5005061A (en) * | 1990-02-05 | 1991-04-02 | Motorola, Inc. | Avalanche stress protected semiconductor device having variable input impedance |
| DE102013215427B4 (en) | 2012-08-06 | 2023-03-30 | Denso Corporation | diode |
Also Published As
| Publication number | Publication date |
|---|---|
| AU471347B2 (en) | 1973-10-18 |
| DE2215850A1 (en) | 1973-02-08 |
| NL7204607A (en) | 1973-01-16 |
| JPS5138587B1 (en) | 1976-10-22 |
| BE781698A (en) | 1972-07-31 |
| IT951315B (en) | 1973-06-30 |
| FR2145460B1 (en) | 1977-01-14 |
| CA941515A (en) | 1974-02-05 |
| SE379117B (en) | 1975-09-22 |
| AU4099372A (en) | 1973-10-18 |
| FR2145460A1 (en) | 1973-02-23 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PS | Patent sealed [section 19, patents act 1949] | ||
| PCNP | Patent ceased through non-payment of renewal fee |