GB1359551A - Resistance welding - Google Patents
Resistance weldingInfo
- Publication number
- GB1359551A GB1359551A GB494771A GB494771A GB1359551A GB 1359551 A GB1359551 A GB 1359551A GB 494771 A GB494771 A GB 494771A GB 494771 A GB494771 A GB 494771A GB 1359551 A GB1359551 A GB 1359551A
- Authority
- GB
- United Kingdom
- Prior art keywords
- electrodes
- welding
- workpieces
- collars
- feb
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 238000003466 welding Methods 0.000 title abstract 8
- 238000010438 heat treatment Methods 0.000 abstract 2
- 239000000463 material Substances 0.000 abstract 2
- 239000002184 metal Substances 0.000 abstract 2
- 238000000034 method Methods 0.000 abstract 2
- 239000004033 plastic Substances 0.000 abstract 2
- 229920003023 plastic Polymers 0.000 abstract 2
- 229920001169 thermoplastic Polymers 0.000 abstract 2
- 239000004416 thermosoftening plastic Substances 0.000 abstract 2
- 229910000831 Steel Inorganic materials 0.000 abstract 1
- 239000004020 conductor Substances 0.000 abstract 1
- 230000007246 mechanism Effects 0.000 abstract 1
- 239000010959 steel Substances 0.000 abstract 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/4038—Through-connections; Vertical interconnect access [VIA] connections
- H05K3/4084—Through-connections; Vertical interconnect access [VIA] connections by deforming at least one of the conductive layers
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K11/00—Resistance welding; Severing by resistance heating
- B23K11/16—Resistance welding; Severing by resistance heating taking account of the properties of the material to be welded
- B23K11/163—Welding of coated materials
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0393—Flexible materials
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/01—Dielectrics
- H05K2201/0104—Properties and characteristics in general
- H05K2201/0129—Thermoplastic polymer, e.g. auto-adhesive layer; Shaping of thermoplastic polymer
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/01—Tools for processing; Objects used during processing
- H05K2203/0195—Tool for a process not provided for in H05K3/00, e.g. tool for handling objects using suction, for deforming objects, for applying local pressure
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/02—Details related to mechanical or acoustic processing, e.g. drilling, punching, cutting, using ultrasound
- H05K2203/0285—Using ultrasound, e.g. for cleaning, soldering or wet treatment
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/11—Treatments characterised by their effect, e.g. heating, cooling, roughening
- H05K2203/1189—Pressing leads, bumps or a die through an insulating layer
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/15—Position of the PCB during processing
- H05K2203/1572—Processing both sides of a PCB by the same process; Providing a similar arrangement of components on both sides; Making interlayer connections from two sides
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/28—Applying non-metallic protective coatings
- H05K3/281—Applying non-metallic protective coatings by means of a preformed insulating foil
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/328—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by welding
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/36—Assembling printed circuits with other printed circuits
- H05K3/361—Assembling flexible printed circuits with other printed circuits
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Lining Or Joining Of Plastics Or The Like (AREA)
Abstract
1359551 Welding by pressure WELDING INSTITUTE 15 Feb 1972 [18 Feb 1971] 4947/71 Heading B3R In a method of welding together metal workpieces at least one of which has a thermoplastic insulating covering the workpieces are superimposed between a pair of electrodes and subjected to heating and vibration of at least one of the electrodes to melt and displace the thermoplastic covering material and a spot welding current is then applied to weld the contacting metal parts together. The method may be applied to the welding of flat tape conductors or other plastic coated workpieces such as wires or sheet steel. In apparatus for carrying out the invention spot welding electrodes 16a, 16b are provided with heating coils 18 and are adapted to be vibrated by means of electric motors 24 having eccentric drive mechanisms 26 connected to collars 27 on the electrodes. Welding current leads 28 are connected via blocks 30 to blade springs 32 which in turn supply current to the collars 27. Pneumatic cylinder 22 acts to apply pressure to the electrodes. The vibrations applied may range in frequency from 50 Hz to kHz and where the vibations are in the ultrasonic range they may serve as the source of heat for the plastics covering material. The electrodes may be cleaned by being brought together periodically while vibrating and under a low pressure.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| GB494771A GB1359551A (en) | 1972-02-15 | 1972-02-15 | Resistance welding |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| GB494771A GB1359551A (en) | 1972-02-15 | 1972-02-15 | Resistance welding |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| GB1359551A true GB1359551A (en) | 1974-07-10 |
Family
ID=9786878
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| GB494771A Expired GB1359551A (en) | 1972-02-15 | 1972-02-15 | Resistance welding |
Country Status (1)
| Country | Link |
|---|---|
| GB (1) | GB1359551A (en) |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO1997008925A1 (en) * | 1995-08-30 | 1997-03-06 | Siemens Aktiengesellschaft | Method of establishing a connection between at least two electrical conductors, one of which is mounted on a supporting substrate |
| WO1997042727A1 (en) * | 1996-05-06 | 1997-11-13 | Siemens Aktiengesellschaft | Process for producing a multilayered composite structure with electroconductive connections |
| WO2013020636A1 (en) * | 2011-08-06 | 2013-02-14 | Volkswagen Aktiengesellschaft | Joining sheet metal-type components having an intermediate layer made of thermoplastic synthetic material |
| CN111230278A (en) * | 2020-02-26 | 2020-06-05 | 中国科学院上海光学精密机械研究所 | A kind of ultrasonic-assisted adhesive spot welding method |
| EP3575028A4 (en) * | 2017-01-30 | 2020-09-02 | Art-Hikari Co., Ltd. | Method for processing insulator and foreign object, and device for same |
-
1972
- 1972-02-15 GB GB494771A patent/GB1359551A/en not_active Expired
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO1997008925A1 (en) * | 1995-08-30 | 1997-03-06 | Siemens Aktiengesellschaft | Method of establishing a connection between at least two electrical conductors, one of which is mounted on a supporting substrate |
| WO1997042727A1 (en) * | 1996-05-06 | 1997-11-13 | Siemens Aktiengesellschaft | Process for producing a multilayered composite structure with electroconductive connections |
| WO2013020636A1 (en) * | 2011-08-06 | 2013-02-14 | Volkswagen Aktiengesellschaft | Joining sheet metal-type components having an intermediate layer made of thermoplastic synthetic material |
| CN103702792A (en) * | 2011-08-06 | 2014-04-02 | 大众汽车有限公司 | Joining sheet metal-type components having an intermediate layer made of thermoplastic synthetic material |
| EP3575028A4 (en) * | 2017-01-30 | 2020-09-02 | Art-Hikari Co., Ltd. | Method for processing insulator and foreign object, and device for same |
| CN111230278A (en) * | 2020-02-26 | 2020-06-05 | 中国科学院上海光学精密机械研究所 | A kind of ultrasonic-assisted adhesive spot welding method |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PS | Patent sealed | ||
| PLNP | Patent lapsed through nonpayment of renewal fees |