GB1350070A - Relectrolytic deposition of metals - Google Patents
Relectrolytic deposition of metalsInfo
- Publication number
- GB1350070A GB1350070A GB1350070DA GB1350070A GB 1350070 A GB1350070 A GB 1350070A GB 1350070D A GB1350070D A GB 1350070DA GB 1350070 A GB1350070 A GB 1350070A
- Authority
- GB
- United Kingdom
- Prior art keywords
- springs
- metal
- block
- deposited
- liquid
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 239000002184 metal Substances 0.000 title abstract 5
- 229910052751 metal Inorganic materials 0.000 title abstract 5
- 230000008021 deposition Effects 0.000 title 1
- 150000002739 metals Chemical group 0.000 title 1
- HEMHJVSKTPXQMS-UHFFFAOYSA-M Sodium hydroxide Chemical compound [OH-].[Na+] HEMHJVSKTPXQMS-UHFFFAOYSA-M 0.000 abstract 3
- 239000003792 electrolyte Substances 0.000 abstract 3
- 239000007788 liquid Substances 0.000 abstract 3
- 238000007747 plating Methods 0.000 abstract 3
- 238000009713 electroplating Methods 0.000 abstract 2
- 239000011810 insulating material Substances 0.000 abstract 2
- 238000004070 electrodeposition Methods 0.000 abstract 1
- 230000005484 gravity Effects 0.000 abstract 1
- 239000004094 surface-active agent Substances 0.000 abstract 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/02—Electroplating of selected surface areas
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Electrochemistry (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Electroplating And Plating Baths Therefor (AREA)
- Electrolytic Production Of Metals (AREA)
- Electroplating Methods And Accessories (AREA)
Abstract
1350070 Electroplating the ends of electrical contact springs INTERNATIONAL COMPUTERS Ltd 10 June 1971 [23 Sept 1970] 45195/70 Heading C7B In electroplating the ends of electrical contact springs 7 mounted in a block 6 of resilient insulating material, the springs are contacted at one end by a plating electrolyte 13 with an anode 12 immersed therein and cathodic contact is made with the other ends of the springs by an electrically conductive liquid 10 with a cathode 9 immersed therein. The block 6 carrying the springs 7 is mounted in an aperture 5 in a wall 2 which separates the electrolyte 13 and the liquid 10 within a tank 1. The tank 1 and wall 2 are of, or covered with, insulating material. The springs 7 are of Be-Cu. The liquid 10 is a solution of Na 2 CO 3 , Na 3 PO 4 , NaOH and surface active agent and is at a#H of 12À5, specific gravity of 1À2 and temperature of 50‹C. The plating electrolyte 13 contains the metal to be electrodeposited, e.g. Cu is deposited from CuSO 4 . The electrodeposition is at 200 amps/sq ft and the metal is deposited over the spring ends as domes. More than one layer of metal may be electrodeposited, e.g. (a) Cu followed by Au or (b) Ni followed by Ag. The electrodes are of C, Pt or platinized Ti. Alternatively the anode may be of the metal to be deposited. After plating the contact springs at one end, the block may be reversed in the aperture 5 to plate the opposite ends of the springs.
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| GB4519570 | 1970-09-23 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| GB1350070A true GB1350070A (en) | 1974-04-18 |
Family
ID=10436251
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| GB1350070D Expired GB1350070A (en) | 1970-09-23 | 1970-09-23 | Relectrolytic deposition of metals |
Country Status (2)
| Country | Link |
|---|---|
| FR (1) | FR2107903A1 (en) |
| GB (1) | GB1350070A (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4042480A (en) * | 1973-10-04 | 1977-08-16 | Noz Francis X | Apparatus for selectively applying a metal coating to the metallic parts of elements which pass through an insulator |
| DE3114181A1 (en) * | 1980-05-07 | 1982-01-28 | The Perkin-Elmer Corp., 06856 Norwalk, Conn. | TOUCH-FREE TECHNOLOGY FOR GALVANIC X-RAY RAY LITHOGRAPHY |
| WO2000059008A3 (en) * | 1999-03-30 | 2001-02-15 | Nutool Inc | Method and apparatus for forming an electrical contact with a semiconductor substrate |
| US7427337B2 (en) | 1998-12-01 | 2008-09-23 | Novellus Systems, Inc. | System for electropolishing and electrochemical mechanical polishing |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN115261943A (en) * | 2022-06-13 | 2022-11-01 | 福建闽威科技股份有限公司 | High thickness-diameter ratio copper deposition electroplating process |
-
1970
- 1970-09-23 GB GB1350070D patent/GB1350070A/en not_active Expired
-
1971
- 1971-09-22 FR FR7134103A patent/FR2107903A1/fr not_active Withdrawn
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4042480A (en) * | 1973-10-04 | 1977-08-16 | Noz Francis X | Apparatus for selectively applying a metal coating to the metallic parts of elements which pass through an insulator |
| DE3114181A1 (en) * | 1980-05-07 | 1982-01-28 | The Perkin-Elmer Corp., 06856 Norwalk, Conn. | TOUCH-FREE TECHNOLOGY FOR GALVANIC X-RAY RAY LITHOGRAPHY |
| US7427337B2 (en) | 1998-12-01 | 2008-09-23 | Novellus Systems, Inc. | System for electropolishing and electrochemical mechanical polishing |
| WO2000059008A3 (en) * | 1999-03-30 | 2001-02-15 | Nutool Inc | Method and apparatus for forming an electrical contact with a semiconductor substrate |
| US6251235B1 (en) | 1999-03-30 | 2001-06-26 | Nutool, Inc. | Apparatus for forming an electrical contact with a semiconductor substrate |
| US6958114B2 (en) | 1999-03-30 | 2005-10-25 | Asm Nutool, Inc. | Method and apparatus for forming an electrical contact with a semiconductor substrate |
| US7309407B2 (en) | 1999-03-30 | 2007-12-18 | Novellus Systems, Inc. | Method and apparatus for forming an electrical contact with a semiconductor substrate |
Also Published As
| Publication number | Publication date |
|---|---|
| FR2107903A1 (en) | 1972-05-12 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PS | Patent sealed | ||
| PCNP | Patent ceased through non-payment of renewal fee |