[go: up one dir, main page]

GB1350070A - Relectrolytic deposition of metals - Google Patents

Relectrolytic deposition of metals

Info

Publication number
GB1350070A
GB1350070A GB1350070DA GB1350070A GB 1350070 A GB1350070 A GB 1350070A GB 1350070D A GB1350070D A GB 1350070DA GB 1350070 A GB1350070 A GB 1350070A
Authority
GB
United Kingdom
Prior art keywords
springs
metal
block
deposited
liquid
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fujitsu Services Ltd
Original Assignee
Fujitsu Services Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fujitsu Services Ltd filed Critical Fujitsu Services Ltd
Publication of GB1350070A publication Critical patent/GB1350070A/en
Expired legal-status Critical Current

Links

Classifications

    • CCHEMISTRY; METALLURGY
    • C25ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25DPROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/02Electroplating of selected surface areas

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Electroplating And Plating Baths Therefor (AREA)
  • Electrolytic Production Of Metals (AREA)
  • Electroplating Methods And Accessories (AREA)

Abstract

1350070 Electroplating the ends of electrical contact springs INTERNATIONAL COMPUTERS Ltd 10 June 1971 [23 Sept 1970] 45195/70 Heading C7B In electroplating the ends of electrical contact springs 7 mounted in a block 6 of resilient insulating material, the springs are contacted at one end by a plating electrolyte 13 with an anode 12 immersed therein and cathodic contact is made with the other ends of the springs by an electrically conductive liquid 10 with a cathode 9 immersed therein. The block 6 carrying the springs 7 is mounted in an aperture 5 in a wall 2 which separates the electrolyte 13 and the liquid 10 within a tank 1. The tank 1 and wall 2 are of, or covered with, insulating material. The springs 7 are of Be-Cu. The liquid 10 is a solution of Na 2 CO 3 , Na 3 PO 4 , NaOH and surface active agent and is at a#H of 12À5, specific gravity of 1À2 and temperature of 50‹C. The plating electrolyte 13 contains the metal to be electrodeposited, e.g. Cu is deposited from CuSO 4 . The electrodeposition is at 200 amps/sq ft and the metal is deposited over the spring ends as domes. More than one layer of metal may be electrodeposited, e.g. (a) Cu followed by Au or (b) Ni followed by Ag. The electrodes are of C, Pt or platinized Ti. Alternatively the anode may be of the metal to be deposited. After plating the contact springs at one end, the block may be reversed in the aperture 5 to plate the opposite ends of the springs.
GB1350070D 1970-09-23 1970-09-23 Relectrolytic deposition of metals Expired GB1350070A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
GB4519570 1970-09-23

Publications (1)

Publication Number Publication Date
GB1350070A true GB1350070A (en) 1974-04-18

Family

ID=10436251

Family Applications (1)

Application Number Title Priority Date Filing Date
GB1350070D Expired GB1350070A (en) 1970-09-23 1970-09-23 Relectrolytic deposition of metals

Country Status (2)

Country Link
FR (1) FR2107903A1 (en)
GB (1) GB1350070A (en)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4042480A (en) * 1973-10-04 1977-08-16 Noz Francis X Apparatus for selectively applying a metal coating to the metallic parts of elements which pass through an insulator
DE3114181A1 (en) * 1980-05-07 1982-01-28 The Perkin-Elmer Corp., 06856 Norwalk, Conn. TOUCH-FREE TECHNOLOGY FOR GALVANIC X-RAY RAY LITHOGRAPHY
WO2000059008A3 (en) * 1999-03-30 2001-02-15 Nutool Inc Method and apparatus for forming an electrical contact with a semiconductor substrate
US7427337B2 (en) 1998-12-01 2008-09-23 Novellus Systems, Inc. System for electropolishing and electrochemical mechanical polishing

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN115261943A (en) * 2022-06-13 2022-11-01 福建闽威科技股份有限公司 High thickness-diameter ratio copper deposition electroplating process

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4042480A (en) * 1973-10-04 1977-08-16 Noz Francis X Apparatus for selectively applying a metal coating to the metallic parts of elements which pass through an insulator
DE3114181A1 (en) * 1980-05-07 1982-01-28 The Perkin-Elmer Corp., 06856 Norwalk, Conn. TOUCH-FREE TECHNOLOGY FOR GALVANIC X-RAY RAY LITHOGRAPHY
US7427337B2 (en) 1998-12-01 2008-09-23 Novellus Systems, Inc. System for electropolishing and electrochemical mechanical polishing
WO2000059008A3 (en) * 1999-03-30 2001-02-15 Nutool Inc Method and apparatus for forming an electrical contact with a semiconductor substrate
US6251235B1 (en) 1999-03-30 2001-06-26 Nutool, Inc. Apparatus for forming an electrical contact with a semiconductor substrate
US6958114B2 (en) 1999-03-30 2005-10-25 Asm Nutool, Inc. Method and apparatus for forming an electrical contact with a semiconductor substrate
US7309407B2 (en) 1999-03-30 2007-12-18 Novellus Systems, Inc. Method and apparatus for forming an electrical contact with a semiconductor substrate

Also Published As

Publication number Publication date
FR2107903A1 (en) 1972-05-12

Similar Documents

Publication Publication Date Title
ES8103785A1 (en) A METHOD FOR SELECTIVELY ELECTROPLACING REGIONS OF THE SURFACE OF A CATHODE
KR840003702A (en) Electrode coated with lead or lead alloy and its preparation
US3732157A (en) Electrolytic cell including titanium hydride cathodes and noble-metal coated titanium hydride anodes
ES8205881A1 (en) Electrode
GB1422466A (en) Method of plating holes
KR840005496A (en) Cathode having high durability and low hydrogen overvoltage and method of manufacturing the same
KR880005290A (en) Commercial nickel-phosphorus electroplating
GB1350070A (en) Relectrolytic deposition of metals
US2590584A (en) Sea-water battery
US3790454A (en) Electrodeposition of sponge nickel
GB1125493A (en) Improvements in or relating to anode assemblies of electrolytic cells
Grigger et al. Lead dioxide anode for commercial use
US3793165A (en) Method of electrodeposition using catalyzed hydrogen
GB1483126A (en) Electrolytic treatment of dilute cyanide solution and cell therefor
US3036141A (en) Magnesium galvanic cell
US3462309A (en) Magnesium anode primary cell
GB1335221A (en) Support assemblies for electrolytic deposition on contact elements
US2865973A (en) Storage battery plates
Hydes Electrodeposited ruthenium as an electrical contact material
GB1501893A (en) Continuous electrolytic colouring of a preanodised aluminium foil or strip
US3444003A (en) Multilayer catalytic electrode having a layer of noble metal and lead and a surface layer free of lead and method of constructing same
Gardam Polarisation in the electrodeposition of metals
CN220224399U (en) Integrated electroplating equipment for deplating and electroplating
US2043823A (en) Anode
FR2360692A1 (en) DIAPHRAGM ELECTROLYTIC CELLS

Legal Events

Date Code Title Description
PS Patent sealed
PCNP Patent ceased through non-payment of renewal fee