GB1210584A - Semiconductor device and method of manufacturing the same - Google Patents
Semiconductor device and method of manufacturing the sameInfo
- Publication number
- GB1210584A GB1210584A GB31279/68A GB3127968A GB1210584A GB 1210584 A GB1210584 A GB 1210584A GB 31279/68 A GB31279/68 A GB 31279/68A GB 3127968 A GB3127968 A GB 3127968A GB 1210584 A GB1210584 A GB 1210584A
- Authority
- GB
- United Kingdom
- Prior art keywords
- bonded
- semi
- plate
- housing
- conductor
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- H10W76/157—
-
- H10W40/10—
-
- H10W70/464—
-
- H10W76/60—
-
- H10W72/07251—
-
- H10W72/20—
Landscapes
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Abstract
1,210,584. Semi-conductor devices. HITACHI Ltd. 1 July, 1968 [7 July, 1967], No. 31279/68. Heading H1K. A planar semi-conductor element 1 having at least two electrodes on one surface is hermetically sealed within a housing comprising a main insulating portion 5, 6 and a metal cover-plate 9, the electrodes on the one surface being face-bonded to conductors on the base 5 of the main portion of the housing and the other surface of the element being bonded to the cover-plate 9 by material 10 having a high thermal conductivity. The metal plate 9 which is thermally coupled to the element 1 through low-melting-point solder or high-thermal-con ductivity resin loaded with metal powder serves to dissipate heat generated with element 1. The element 1 may be coated with a silicon dioxide film 3. In the embodiment illustrated in which the element 1 is a transistor the housing comprises a ceramic base-plate 5 bonded (e.g. by glass) to a ceramic side-wall 6 with lead-in conductors 8 between them. In a second embodiment, Figs. 2 and 3 (not shown) the semi-conductor element has four electrodes on its face-bonded surface. In a third embodiment, Fig. 4 (not shown), two similar semi-conductor elements are mounted within a common housing.
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4333267 | 1967-07-07 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| GB1210584A true GB1210584A (en) | 1970-10-28 |
Family
ID=12660862
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| GB31279/68A Expired GB1210584A (en) | 1967-07-07 | 1968-07-01 | Semiconductor device and method of manufacturing the same |
Country Status (3)
| Country | Link |
|---|---|
| DE (1) | DE6607827U (en) |
| FR (1) | FR1571863A (en) |
| GB (1) | GB1210584A (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4439918A (en) * | 1979-03-12 | 1984-04-03 | Western Electric Co., Inc. | Methods of packaging an electronic device |
| EP1553628A1 (en) * | 2004-01-07 | 2005-07-13 | Thermagon, Inc. | Heat sink and heat spreader assembly |
| CN113054042A (en) * | 2021-03-15 | 2021-06-29 | 河南城建学院 | Optoelectronic semiconductor component with substrate structure |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4538170A (en) * | 1983-01-03 | 1985-08-27 | General Electric Company | Power chip package |
-
1968
- 1968-07-01 GB GB31279/68A patent/GB1210584A/en not_active Expired
- 1968-07-03 FR FR1571863D patent/FR1571863A/fr not_active Expired
- 1968-07-05 DE DE6607827U patent/DE6607827U/en not_active Expired
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4439918A (en) * | 1979-03-12 | 1984-04-03 | Western Electric Co., Inc. | Methods of packaging an electronic device |
| EP1553628A1 (en) * | 2004-01-07 | 2005-07-13 | Thermagon, Inc. | Heat sink and heat spreader assembly |
| CN113054042A (en) * | 2021-03-15 | 2021-06-29 | 河南城建学院 | Optoelectronic semiconductor component with substrate structure |
| CN113054042B (en) * | 2021-03-15 | 2022-07-08 | 河南城建学院 | Optoelectronic semiconductor component with substrate structure |
Also Published As
| Publication number | Publication date |
|---|---|
| DE6607827U (en) | 1971-04-22 |
| FR1571863A (en) | 1969-06-20 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PS | Patent sealed [section 19, patents act 1949] | ||
| PLNP | Patent lapsed through nonpayment of renewal fees |