GB1299811A - Semiconductor integrated circuit device - Google Patents
Semiconductor integrated circuit deviceInfo
- Publication number
- GB1299811A GB1299811A GB01810/71A GB1181071A GB1299811A GB 1299811 A GB1299811 A GB 1299811A GB 01810/71 A GB01810/71 A GB 01810/71A GB 1181071 A GB1181071 A GB 1181071A GB 1299811 A GB1299811 A GB 1299811A
- Authority
- GB
- United Kingdom
- Prior art keywords
- integrated circuit
- atmosphere
- semi
- drain regions
- heating
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D84/00—Integrated devices formed in or on semiconductor substrates that comprise only semiconducting layers, e.g. on Si wafers or on GaAs-on-Si wafers
- H10D84/40—Integrated devices formed in or on semiconductor substrates that comprise only semiconducting layers, e.g. on Si wafers or on GaAs-on-Si wafers characterised by the integration of at least one component covered by groups H10D12/00 or H10D30/00 with at least one component covered by groups H10D10/00 or H10D18/00, e.g. integration of IGFETs with BJTs
- H10D84/401—Combinations of FETs or IGBTs with BJTs
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D84/00—Integrated devices formed in or on semiconductor substrates that comprise only semiconducting layers, e.g. on Si wafers or on GaAs-on-Si wafers
- H10D84/01—Manufacture or treatment
- H10D84/0123—Integrating together multiple components covered by H10D12/00 or H10D30/00, e.g. integrating multiple IGBTs
- H10D84/0126—Integrating together multiple components covered by H10D12/00 or H10D30/00, e.g. integrating multiple IGBTs the components including insulated gates, e.g. IGFETs
- H10D84/0165—Integrating together multiple components covered by H10D12/00 or H10D30/00, e.g. integrating multiple IGBTs the components including insulated gates, e.g. IGFETs the components including complementary IGFETs, e.g. CMOS devices
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D84/00—Integrated devices formed in or on semiconductor substrates that comprise only semiconducting layers, e.g. on Si wafers or on GaAs-on-Si wafers
- H10D84/01—Manufacture or treatment
- H10D84/02—Manufacture or treatment characterised by using material-based technologies
- H10D84/03—Manufacture or treatment characterised by using material-based technologies using Group IV technology, e.g. silicon technology or silicon-carbide [SiC] technology
- H10D84/038—Manufacture or treatment characterised by using material-based technologies using Group IV technology, e.g. silicon technology or silicon-carbide [SiC] technology using silicon technology, e.g. SiGe
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D99/00—Subject matter not provided for in other groups of this subclass
-
- H10P14/6306—
-
- H10P14/6322—
-
- H10P14/6529—
Landscapes
- Insulated Gate Type Field-Effect Transistor (AREA)
- Metal-Oxide And Bipolar Metal-Oxide Semiconductor Integrated Circuits (AREA)
- Bipolar Transistors (AREA)
- Formation Of Insulating Films (AREA)
Abstract
1299811 Semi-conductor devices RCA CORPORATION 28 April 1871 [4 May 1970] 11810/71 Heading H1K An integrated circuit includes an I.G.F.E.T., the gate insulation of which is formed by heating the device in a wet oxidizing atmosphere containing a hydrogen halide. In the embodiment, two complementary I.G.F.E.T.s 18, 20 are produced with a bipolar transistor 22, the source and drain regions 36, 38 of I.G.F.E.T. 18 being diffused simultaneously with the base region 26 of the transistor, and the source and drain regions 48, 50 of I.G.F.E.T. 20 being formed simultaneously with the emitter 28 and collector contact 30 diffusions. The gate insulations 44, 56 are formed by heating the device to a temperature of 875 C. in an atmosphere of water vapour and gaseous hydrogen chloride derived by evaporation of an azeotropic mixture of water and hydrochloric acid. The halide reacts with the dopant impurities in the forming oxide layers, the impurities being derived from the semi-conductor body, to form volatile chlorides thereof. The body is then annealed in a non- oxidizing atmosphere at a temperature of between 900-1200 C., but preferably below 1000 C. The annealing atmosphere may be hydrogen, helium or forming gas. The elements of the integrated circuit may be isolated within an epitaxial layer 16 by diffused zones 35 of the opposite conductivity type.
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US3413770A | 1970-05-04 | 1970-05-04 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| GB1299811A true GB1299811A (en) | 1972-12-13 |
Family
ID=21874544
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| GB01810/71A Expired GB1299811A (en) | 1970-05-04 | 1971-04-28 | Semiconductor integrated circuit device |
Country Status (7)
| Country | Link |
|---|---|
| JP (1) | JPS4913909B1 (en) |
| BE (1) | BE766651A (en) |
| CA (1) | CA921617A (en) |
| DE (1) | DE2120832C3 (en) |
| FR (1) | FR2088302B1 (en) |
| GB (1) | GB1299811A (en) |
| MY (1) | MY7400018A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS501665A (en) * | 1973-05-07 | 1975-01-09 |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| IN145547B (en) * | 1976-01-12 | 1978-11-04 | Rca Corp | |
| JPS5299538U (en) * | 1976-01-26 | 1977-07-27 | ||
| DE3005384C2 (en) * | 1979-02-15 | 1994-10-27 | Texas Instruments Inc | Method of manufacturing a monolithic semiconductor integrated circuit |
| JPS6118348U (en) * | 1984-07-04 | 1986-02-03 | シャープ株式会社 | oil burning appliances |
Family Cites Families (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| NL109817C (en) * | 1955-12-02 | |||
| BE562973A (en) * | 1956-12-06 | 1900-01-01 | ||
| US3556879A (en) * | 1968-03-20 | 1971-01-19 | Rca Corp | Method of treating semiconductor devices |
-
1970
- 1970-12-26 JP JP45125074A patent/JPS4913909B1/ja active Pending
-
1971
- 1971-03-30 CA CA109180A patent/CA921617A/en not_active Expired
- 1971-04-28 GB GB01810/71A patent/GB1299811A/en not_active Expired
- 1971-04-28 DE DE2120832A patent/DE2120832C3/en not_active Expired
- 1971-04-30 FR FR7115623A patent/FR2088302B1/fr not_active Expired
- 1971-05-03 BE BE766651A patent/BE766651A/en unknown
-
1974
- 1974-12-30 MY MY18/74A patent/MY7400018A/en unknown
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS501665A (en) * | 1973-05-07 | 1975-01-09 |
Also Published As
| Publication number | Publication date |
|---|---|
| CA921617A (en) | 1973-02-20 |
| MY7400018A (en) | 1974-12-31 |
| FR2088302A1 (en) | 1972-01-07 |
| FR2088302B1 (en) | 1976-12-03 |
| DE2120832B2 (en) | 1978-11-30 |
| DE2120832C3 (en) | 1982-06-03 |
| JPS4913909B1 (en) | 1974-04-03 |
| BE766651A (en) | 1971-10-01 |
| DE2120832A1 (en) | 1971-11-25 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PS | Patent sealed [section 19, patents act 1949] | ||
| PE20 | Patent expired after termination of 20 years |