GB1270288A - Header system for a semiconductor device - Google Patents

Abstract

1,270,288. Semi-conductor devices. TEXAS INSTRUMENTS Inc. 11 June, 1969 [25 June, 1968], No. 29558/69. Heading H1K. A header for a semi-conductor device includes a flexible sheet of insulating material bearing conductive tracks for connection to a semiconductor device contained within the header, the other ends of the tracks being connected to leads which extend from the header base. The header comprises a ceramic base 16 through which leads 20-23 protrude, a metal pad 24, connected to one of the leads, 20, to which pad the underside of a semi-conductor chip 13 is attached, the chip including contact pads 30- 32, and a flexible insulating sheet 34 bearing a plurality of tracks 36-38 on its underside, one end of the tracks being for attachment to the contact pads of the chip 13, the other ends of the tracks terminating in apertures 40-42 in the sheet for attachment to the ends of leads 21-23. The various contacts may be made using deposited solder films which melt on heating. A metal cap 15 may be welded to a flange 28 of the header to hermetically seal it. In an alternative construction, the sheet 34 may have no apertures and rest directly on the leads, the track ends being connected thereto. Alternatively the sheet 34 and chip 13 may together be inverted so that the chip lies, contacts downwards, on the track carrying insulating sheet. In this case the pad 24 may be dispensed with and in lieu a further contact made to the chip face. In another embodiment a plurality of chips may be used, the tracks including resistors and capacitors to form a large scale integrated circuit within the header. In a variation of the sheet structure, it may comprise a plurality of insulating sheets with conductive tracks therebetween, contact being made between tracks in adjoining layers by means of apertures in the intervening insulation.