GB1247378A - Semiconductor devices - Google Patents

Abstract

1,247,378. Semi-conductor devices. PHILIPS ELECTRONIC & ASSOCIATED INDUSTRIES Ltd. 25 Nov., 1968 [28 Nov., 1967], No. 55813/68. Heading H1K. An air-tight container for a semi-conductor device comprises a flat, electrically insulating, thermally conducting support 3, e.g. of beryllium oxide, bonded to a heat-dissipating header 1, e.g. of Cu, which has means such as a threaded stem 13 to permit connection to a further heat sink, discrete local metallized regions such as 6, 8 on the support 3 extending both inside and outside a ceramic ring 17, e.g. of alumina, bonded to the support, and a lid 19 completing the container. Within the container the metallized regions are connected to the electrodes on the semi-conductor, either directly as 6 or through a conductor 14 as 8. Flat terminal conductors 11, 12 are soldered to the respective metallized regions 8, 6 outside the ring 17. The device shown is a Si transistor having two terminals connected to the emitter region. The metallizations 6, 8, of which there are four, comprise Ni- and/or Au-plated Mo/Mn, and the terminal conductors 11, 12 are of Ni- or Au-plated Cu soldered to the metallized regions by Cu/Ag. Au or Au/Sb solder is used to fix the silicon body 18 to the metallized regions. The alumina ring 17 is attached to the support 3 using fused glass 9. The lid 19 may be of alumina or Fe/Co/Ni coated with Au/Sn on its lower face and Au on its upper face. The entire container may be covered with a lacquer or a thermo-hardening cast-on coating. Other devices referred to are diodes, 3-terminal transistors and devices having five or more terminals. Ge and GaAs are also mentioned.