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GB1126370A - Improvements relating to printed circuits - Google Patents

Improvements relating to printed circuits

Info

Publication number
GB1126370A
GB1126370A GB5507465A GB5507465A GB1126370A GB 1126370 A GB1126370 A GB 1126370A GB 5507465 A GB5507465 A GB 5507465A GB 5507465 A GB5507465 A GB 5507465A GB 1126370 A GB1126370 A GB 1126370A
Authority
GB
United Kingdom
Prior art keywords
conductors
projecting portion
layer
printed circuits
insulating layer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
GB5507465A
Inventor
Thomas Horace Appleby
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
British Aircraft Corp Ltd
Original Assignee
British Aircraft Corp Operating Ltd
British Aircraft Corp Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by British Aircraft Corp Operating Ltd, British Aircraft Corp Ltd filed Critical British Aircraft Corp Operating Ltd
Priority to GB5507465A priority Critical patent/GB1126370A/en
Publication of GB1126370A publication Critical patent/GB1126370A/en
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
    • H05K3/4614—Manufacturing multilayer circuits by laminating two or more circuit boards the electrical connections between the circuit boards being made during lamination
    • H05K3/4617—Manufacturing multilayer circuits by laminating two or more circuit boards the electrical connections between the circuit boards being made during lamination characterized by laminating only or mainly similar single-sided circuit boards
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits
    • H05K3/4647—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits by applying an insulating layer around previously made via studs
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0332—Structure of the conductor
    • H05K2201/0335—Layered conductors or foils
    • H05K2201/0355—Metal foils
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/03—Metal processing
    • H05K2203/0369—Etching selective parts of a metal substrate through part of its thickness, e.g. using etch resist
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/06—Lamination
    • H05K2203/063—Lamination of preperforated insulating layer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
    • H05K2203/0703—Plating
    • H05K2203/0733—Method for plating stud vias, i.e. massive vias formed by plating the bottom of a hole without plating on the walls
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/328—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by welding
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits
    • H05K3/4652—Adding a circuit layer by laminating a metal foil or a preformed metal foil pattern

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)

Abstract

1,126,370. Printed circuits. BRITISH AIRCRAFT CORP. (OPERATING) Ltd. 21 March. 1967 [29 Dec., 1965], No. 55074/65. Heading H1R. In a multilayer or double-sided printed circuit, connection is made between conductors 4a. 4b which are separated by an insulating layer 56, by forming a hole in layer 56 where such connection is required, and forming the lower conductor 4a with a projecting portion 7 substantially the thickness of the layer 56; the layers are then assembled, and a welding electrode 8 is applied to the free surface of upper conductor 4b above the projecting portion 7 to form a welded joint 9. Conductors 4a, 4b are originally formed by photo-etching or electron beam scribing, and projecting portion 7 is preferably formed by selective etching, although an additive technique may alternatively be used. The multilayer circuit is built up progressively, welded joints being made where required at each level (Fig. 4, not shown). Fig. 1 (not shown) discloses a method of pinchwelding registering conductors within a hole in an intermediate insulating layer.
GB5507465A 1965-12-29 1965-12-29 Improvements relating to printed circuits Expired GB1126370A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
GB5507465A GB1126370A (en) 1965-12-29 1965-12-29 Improvements relating to printed circuits

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
GB5507465A GB1126370A (en) 1965-12-29 1965-12-29 Improvements relating to printed circuits

Publications (1)

Publication Number Publication Date
GB1126370A true GB1126370A (en) 1968-09-05

Family

ID=10472873

Family Applications (1)

Application Number Title Priority Date Filing Date
GB5507465A Expired GB1126370A (en) 1965-12-29 1965-12-29 Improvements relating to printed circuits

Country Status (1)

Country Link
GB (1) GB1126370A (en)

Cited By (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2204940A1 (en) * 1972-10-27 1974-05-24 Thomson Csf
EP0608726A1 (en) * 1993-01-26 1994-08-03 Dyconex Patente Ag Process for plating through-connections between conducting foils
EP0533198A3 (en) * 1991-09-19 1995-11-02 Nitto Denko Corp Flexible printed substrate
EP0626124A4 (en) * 1992-02-14 1995-11-15 Rock Lp High density conductive networks and method and apparatus for making same.
US5584120A (en) * 1992-02-14 1996-12-17 Research Organization For Circuit Knowledge Method of manufacturing printed circuits
GB2307797A (en) * 1995-11-30 1997-06-04 Daewoo Electronics Co Ltd Flexible coil structure
EP1026929A3 (en) * 1999-02-05 2002-06-12 Sony Chemicals Corporation Elemental piece of flexible printed wiring board and flexible printed wiring board
EP1094693A3 (en) * 1999-10-18 2003-08-27 Sony Chemicals Corporation Multilayer flexible wiring boards and processes for manufacturing multilayer flexible wiring boards
EP1337136A3 (en) * 2002-02-18 2005-07-27 North Corporation Connecting member between wiring films, manufacturing method thereof, and manufacturing method of multilayer wiring substrate
EP1093329A3 (en) * 1999-10-12 2006-01-18 North Corporation Wiring circuit substrate and manufacturing method therefor
US9365947B2 (en) 2013-10-04 2016-06-14 Invensas Corporation Method for preparing low cost substrates

Cited By (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2204940A1 (en) * 1972-10-27 1974-05-24 Thomson Csf
EP0533198A3 (en) * 1991-09-19 1995-11-02 Nitto Denko Corp Flexible printed substrate
EP0626124A4 (en) * 1992-02-14 1995-11-15 Rock Lp High density conductive networks and method and apparatus for making same.
US5584120A (en) * 1992-02-14 1996-12-17 Research Organization For Circuit Knowledge Method of manufacturing printed circuits
EP0608726A1 (en) * 1993-01-26 1994-08-03 Dyconex Patente Ag Process for plating through-connections between conducting foils
US5457881A (en) * 1993-01-26 1995-10-17 Dyconex Patente Ag Method for the through plating of conductor foils
GB2307797B (en) * 1995-11-30 2000-08-16 Daewoo Electronics Co Ltd A process for manufacturing a flexible coil winding structure of a flyback transformer
US5877669A (en) * 1995-11-30 1999-03-02 Daewoo Electronics Co., Ltd. Flyback transformer having a flexible coil winding structure and manufacturing process thereof
GB2307797A (en) * 1995-11-30 1997-06-04 Daewoo Electronics Co Ltd Flexible coil structure
EP1026929A3 (en) * 1999-02-05 2002-06-12 Sony Chemicals Corporation Elemental piece of flexible printed wiring board and flexible printed wiring board
US6717064B1 (en) 1999-02-05 2004-04-06 Sony Chemicals Corp. Substrate piece and flexible substrate
EP1093329A3 (en) * 1999-10-12 2006-01-18 North Corporation Wiring circuit substrate and manufacturing method therefor
US7096578B2 (en) 1999-10-12 2006-08-29 Tessera Interconnect Materials, Inc. Manufacturing method for wiring circuit substrate
US7546681B2 (en) 1999-10-12 2009-06-16 Tessera Interconnect Materials, Inc. Manufacturing method for wiring circuit substrate
US7721422B2 (en) 1999-10-12 2010-05-25 Tessera Interconnect Materials, Inc. Methods of making microelectronic assemblies
EP1094693A3 (en) * 1999-10-18 2003-08-27 Sony Chemicals Corporation Multilayer flexible wiring boards and processes for manufacturing multilayer flexible wiring boards
EP1337136A3 (en) * 2002-02-18 2005-07-27 North Corporation Connecting member between wiring films, manufacturing method thereof, and manufacturing method of multilayer wiring substrate
US9365947B2 (en) 2013-10-04 2016-06-14 Invensas Corporation Method for preparing low cost substrates
US10283484B2 (en) 2013-10-04 2019-05-07 Invensas Corporation Low cost substrates

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