GB1101739A - High molecular weight thermoplastic polyhydroxypolyethers - Google Patents

Abstract

High M.W. polyhydroxypolyether resins having a Durran's melting point >200 DEG C. are obtained by heating, at a temperature not substantially greater than 175 DEG C. a normally solid thermoplastic resin containing substantially equivalent ratios of 1,2-epoxy groups and phenolic hydroxyl groups and having a Durran's m.p. of 50-180 DEG C. until the m.p. is >200 DEG C. The low M.W. resin is prepared by reacting a diepoxide and a diphenol in the presence of a basic organic catalyst in a ratio of 0.95 to 1.05 phenolic hydroxyl groups to one epoxy group at a temperature below the peak exotherm of the reaction. The resinous composition may be in the solid form during the heating step, e.g. as particles suspended in a fluid bed or suspended in a non-solvent. The diepoxide may be the diglycidyl ether of p,p1-dihydroxydiphenylpropane and the diphenol may be bisphenol-A or hydroquinone. The basic organic catalyst may be a tertiary amine, e.g. of formula <FORM:1101739/C3/1> where R1 is H, alkyl, phenyl, alkyl substituted phenyl, H-N-alkyl, alkyl-N-alkyl or alkyl-N-phenyl, R2 is H, alkyl, phenyl or alkyl substituted phenyl, R3 is alkyl and R4 is H, alkyl or vinyl; n is 3, 4 or 5. A non-reactive filler may be added to the resinous composition prior to heat ageing, e.g. aluminium powder, particulate polyethylene and other conventional fillers and pigments.