GB1164591A - mprovements in Metallization of Insulating Substrates - Google Patents
mprovements in Metallization of Insulating SubstratesInfo
- Publication number
- GB1164591A GB1164591A GB40968A GB40968A GB1164591A GB 1164591 A GB1164591 A GB 1164591A GB 40968 A GB40968 A GB 40968A GB 40968 A GB40968 A GB 40968A GB 1164591 A GB1164591 A GB 1164591A
- Authority
- GB
- United Kingdom
- Prior art keywords
- substrate
- filler
- deposition
- metal
- mask
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 239000000758 substrate Substances 0.000 title abstract 9
- 238000001465 metallisation Methods 0.000 title 1
- 230000008021 deposition Effects 0.000 abstract 7
- 239000002184 metal Substances 0.000 abstract 5
- 229910052751 metal Inorganic materials 0.000 abstract 5
- 239000000945 filler Substances 0.000 abstract 4
- 239000011347 resin Substances 0.000 abstract 4
- 229920005989 resin Polymers 0.000 abstract 4
- 230000003197 catalytic effect Effects 0.000 abstract 3
- 239000011248 coating agent Substances 0.000 abstract 3
- 238000000576 coating method Methods 0.000 abstract 3
- 230000015572 biosynthetic process Effects 0.000 abstract 2
- 238000005530 etching Methods 0.000 abstract 2
- 239000000853 adhesive Substances 0.000 abstract 1
- 230000001070 adhesive effect Effects 0.000 abstract 1
- 125000002091 cationic group Chemical group 0.000 abstract 1
- 238000005553 drilling Methods 0.000 abstract 1
- 239000011888 foil Substances 0.000 abstract 1
- 229910052737 gold Inorganic materials 0.000 abstract 1
- 238000004519 manufacturing process Methods 0.000 abstract 1
- 238000000034 method Methods 0.000 abstract 1
- 229910052763 palladium Inorganic materials 0.000 abstract 1
- 239000002245 particle Substances 0.000 abstract 1
- JRKICGRDRMAZLK-UHFFFAOYSA-L persulfate group Chemical group S(=O)(=O)([O-])OOS(=O)(=O)[O-] JRKICGRDRMAZLK-UHFFFAOYSA-L 0.000 abstract 1
- 229910052709 silver Inorganic materials 0.000 abstract 1
- 239000007787 solid Substances 0.000 abstract 1
- 238000005507 spraying Methods 0.000 abstract 1
- 239000000080 wetting agent Substances 0.000 abstract 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/42—Plated through-holes or plated via connections
- H05K3/422—Plated through-holes or plated via connections characterised by electroless plating method; pretreatment therefor
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/18—Pretreatment of the material to be coated
- C23C18/20—Pretreatment of the material to be coated of organic surfaces, e.g. resins
- C23C18/2006—Pretreatment of the material to be coated of organic surfaces, e.g. resins by other methods than those of C23C18/22 - C23C18/30
- C23C18/2046—Pretreatment of the material to be coated of organic surfaces, e.g. resins by other methods than those of C23C18/22 - C23C18/30 by chemical pretreatment
- C23C18/2073—Multistep pretreatment
- C23C18/2086—Multistep pretreatment with use of organic or inorganic compounds other than metals, first
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0313—Organic insulating material
- H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
- H05K1/0373—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement containing additives, e.g. fillers
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
- H05K2201/0203—Fillers and particles
- H05K2201/0206—Materials
- H05K2201/0209—Inorganic, non-metallic particles
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
- H05K2201/0203—Fillers and particles
- H05K2201/0206—Materials
- H05K2201/0236—Plating catalyst as filler in insulating material
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/12—Using specific substances
- H05K2203/122—Organic non-polymeric compounds, e.g. oil, wax or thiol
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/18—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
- H05K3/181—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
- H05K3/386—Improvement of the adhesion between the insulating substrate and the metal by the use of an organic polymeric bonding layer, e.g. adhesive
- H05K3/387—Improvement of the adhesion between the insulating substrate and the metal by the use of an organic polymeric bonding layer, e.g. adhesive for electroless plating
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/42—Plated through-holes or plated via connections
- H05K3/425—Plated through-holes or plated via connections characterised by the sequence of steps for plating the through-holes or via connections in relation to the conductive pattern
- H05K3/427—Plated through-holes or plated via connections characterised by the sequence of steps for plating the through-holes or via connections in relation to the conductive pattern initial plating of through-holes in metal-clad substrates
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Chemical Kinetics & Catalysis (AREA)
- General Chemical & Material Sciences (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Inorganic Chemistry (AREA)
- Manufacturing & Machinery (AREA)
- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
- Non-Metallic Protective Coatings For Printed Circuits (AREA)
Abstract
1,164,591. Printed circuits. PHOTOCIRCUITS CORP. 3 Jan., 1968, No. 409/68. Heading H1R. [Also in Divisions C1, C3 and C7] Printed circuits are obtained from blanks plated by electroless deposition of metal on a substrate wherein the substrates have been rendered catalytic to such deposition by incorporating a filler comprising inert, solid finely divided particles coated with a cationic wetting agent and a Group IB or VIII metal, e.g. Pd, Au or Ag. The filler may be incorporated by mixing with the other components of the substrate, e.g.resin, prior to formation thereof, or by impregnating after formation or by coating with an ink or an adhesive including the filler, on one or both sides of the substrate. The catalytic filler may not be uniformly dispersed in or on the substrate; thus the external or internal surfaces or the sides of holes drilled through the substrate may or may not be catalytic. The substrates may be separately coated by vapour deposition or electroless deposition with a metal film or foil prior to electroless deposition according to the invention. A further electrolytic deposition may be carried out after the electroless deposition. The production of single and multi-layer printed circuit wiring boards is described including the use of resin masks and subsequent etching by spraying with or immersing in the etchant, e.g. FeCl 3 or NH 4 persulphate. A series of drawings are provided illustrating these techniques, a typical example comprising (a) initially metal coating, (b) covering with a resin mask, (c) drilling a hole through the substrate, (d) further coating those areas not covered by the mask and the sides of the hole, (e) dissolving the resin mask, and (f) etching away the initial layer of metal covered by the mask.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| GB40968A GB1164591A (en) | 1968-01-03 | 1968-01-03 | mprovements in Metallization of Insulating Substrates |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| GB40968A GB1164591A (en) | 1968-01-03 | 1968-01-03 | mprovements in Metallization of Insulating Substrates |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| GB1164591A true GB1164591A (en) | 1969-09-17 |
Family
ID=9703871
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| GB40968A Expired GB1164591A (en) | 1968-01-03 | 1968-01-03 | mprovements in Metallization of Insulating Substrates |
Country Status (1)
| Country | Link |
|---|---|
| GB (1) | GB1164591A (en) |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| GB2000197A (en) * | 1977-06-24 | 1979-01-04 | Preh Gmbh W | Method of producing a solderable conductive layer on a substrate |
| US4281038A (en) | 1978-12-16 | 1981-07-28 | Preh, Elektrofeinmechanische Werke, Jakob Preh Nachf Gmbh & Co. | Non-conductive substrate for a printed circuit and method of manufacture |
| US4685210A (en) * | 1985-03-13 | 1987-08-11 | The Boeing Company | Multi-layer circuit board bonding method utilizing noble metal coated surfaces |
| CN110785018A (en) * | 2018-07-31 | 2020-02-11 | 精工爱普生株式会社 | Wiring board and manufacturing method of wiring board |
| EP3539362A4 (en) * | 2016-11-12 | 2020-07-15 | Catlam LLC | WAFER INTEGRATION IN AN INTEGRATED CIRCUIT WITH CATALYTIC COATING OR ADHESIVE |
-
1968
- 1968-01-03 GB GB40968A patent/GB1164591A/en not_active Expired
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| GB2000197A (en) * | 1977-06-24 | 1979-01-04 | Preh Gmbh W | Method of producing a solderable conductive layer on a substrate |
| GB2000197B (en) * | 1977-06-24 | 1982-03-17 | Preh Elektrofeinmechanische Werke Jakob Preh Nachf Gmbh Co | Method of producing a solderable conductive layer on a substrate |
| US4281038A (en) | 1978-12-16 | 1981-07-28 | Preh, Elektrofeinmechanische Werke, Jakob Preh Nachf Gmbh & Co. | Non-conductive substrate for a printed circuit and method of manufacture |
| US4685210A (en) * | 1985-03-13 | 1987-08-11 | The Boeing Company | Multi-layer circuit board bonding method utilizing noble metal coated surfaces |
| EP3539362A4 (en) * | 2016-11-12 | 2020-07-15 | Catlam LLC | WAFER INTEGRATION IN AN INTEGRATED CIRCUIT WITH CATALYTIC COATING OR ADHESIVE |
| CN110785018A (en) * | 2018-07-31 | 2020-02-11 | 精工爱普生株式会社 | Wiring board and manufacturing method of wiring board |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PS | Patent sealed | ||
| PCNP | Patent ceased through non-payment of renewal fee |