GB1155004A - Resinous Compositions - Google Patents

Abstract

1,155,004. Phenoplast adhesive composition. MONSANTO CO. 13 May, 1966 [13 May, 1965], No. 21407/66. Heading C3R. An aqueous alkaline resin composition comprises (by wt. of resin solids): (a) 100 parts of a thermosetting resin of M.W. 150 to 2000 obtained by reacting 1 mol. phenol, 1À5 to 3À5 mols. formaldehyde and 0 to 0À8 mols. sulphonated phenol in an aqueous alkaline medium; (b) 10 to 60 parts polyhydric aliphatic alcohol of M.W. up to 2000; (c) 0À2 to 3 parts watersoluble thickener of M.W. at least 20,000 being polyvinyl alcohol, an ethylene or propylene oxide polymer, a polyacrylamide, a copolymer of ethylene and maleic acid or anhydride, or a hydroxy- or carboxy-C 1-3 alkyl cellulose or hydroxy C 1-3 alkyl cellulose ether; and (d) 0 to 50 parts urea. Various alkylene and polyalkylene glycols and alkylene triols and tetrols are mentioned to exemplify (b). Alternative and preferred orders for combining the ingredients are specified. Particle board.-The compositions may be used as a binder for particle board made from comminuted cellulosic materials, e.g. wood chips, wood fibres, bagasse and crushed cobs. Specified woods are Douglas fir, fir sub-species, oak, maple, pine, cedar and hemlock. In examples, 5% (by wt. resin solids) of various compositions of the invention is used as binder for wood chips (8 mesh U.S. Sieve). Reference has been directed by the Comptroller to Specification 946,049.