GB1026114A - Improvements in or relating to electrical circuits formed on insulating carrier wafers - Google Patents
Improvements in or relating to electrical circuits formed on insulating carrier wafersInfo
- Publication number
- GB1026114A GB1026114A GB49363/63A GB4936363A GB1026114A GB 1026114 A GB1026114 A GB 1026114A GB 49363/63 A GB49363/63 A GB 49363/63A GB 4936363 A GB4936363 A GB 4936363A GB 1026114 A GB1026114 A GB 1026114A
- Authority
- GB
- United Kingdom
- Prior art keywords
- layer
- inner layer
- alloy
- layers
- relating
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01C—RESISTORS
- H01C13/00—Resistors not provided for elsewhere
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01C—RESISTORS
- H01C7/00—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D99/00—Subject matter not provided for in other groups of this subclass
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Electromagnetism (AREA)
- Parts Printed On Printed Circuit Boards (AREA)
- Apparatuses And Processes For Manufacturing Resistors (AREA)
Abstract
1,026,114. Printed circuits. SIEMENS & HALSKE A.G. Dee. 13, 1963 [Dec. 18, 1962], No. 49363/63. Heading H1R. In a circuit comprising components mounted on an insulating wafer, conductive paths and/or contacts are formed by a plurality of metal layers, the inner layer which contacts the wafer being made of Cr, Mg or chromiumnickel alloy and the outer layer, which is alloyed to an inner layer, being made of gold. The inner layer has a resistance of between 50 and 500 ohms per square, and the Au layer has a resistance of between 0À05 and 1 ohm par square; preferred values are 100 and 0À2 ohms per square, respectively. As shown, a circuit on an insulating wafer 1 comprises two capacitors of which dielectric layers-4, 5 and electrode layers 6, 7 are visible, resistors 3, a transistor 8, and a power source 9. Conductive paths and a contact 2 are formed by vapourdeposition in vacuo of an inner layer of Cr-Ni alloy, followed, with continuous or discontinuous transition, by deposition of an outer layer of Au; annealing may then be effected. The alloy layer of Cr-Ni with Au should not extend to either surface of the conductor. A plurality of alternate Cr-Ni and Au layers may be used.
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| DES82923A DE1257918B (en) | 1962-12-18 | 1962-12-18 | Integrated circuit |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| GB1026114A true GB1026114A (en) | 1966-04-14 |
Family
ID=7510694
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| GB49363/63A Expired GB1026114A (en) | 1962-12-18 | 1963-12-13 | Improvements in or relating to electrical circuits formed on insulating carrier wafers |
Country Status (3)
| Country | Link |
|---|---|
| CH (1) | CH426966A (en) |
| DE (1) | DE1257918B (en) |
| GB (1) | GB1026114A (en) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| FR2183603B1 (en) * | 1972-05-12 | 1974-08-30 | Cit Alcatel | |
| DE2833919C2 (en) * | 1978-08-02 | 1982-06-09 | Siemens AG, 1000 Berlin und 8000 München | Process for the production of electrical layer circuits on plastic foils |
Family Cites Families (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE1006692B (en) | 1953-10-29 | 1957-04-18 | Siemens Ag | Process for the production of firmly adhering metal coverings on all kinds of documents |
| DE1105014B (en) | 1957-11-11 | 1961-04-20 | Siemens Ag | Method for producing a microwave component designed in the manner of a stripline |
| GB874965A (en) * | 1958-07-09 | 1961-08-16 | G V Planer Ltd | Improvements in or relating to electrical circuits or circuit elements |
-
1962
- 1962-12-18 DE DES82923A patent/DE1257918B/en active Pending
-
1963
- 1963-12-13 GB GB49363/63A patent/GB1026114A/en not_active Expired
- 1963-12-17 CH CH1543363A patent/CH426966A/en unknown
Also Published As
| Publication number | Publication date |
|---|---|
| CH426966A (en) | 1966-12-31 |
| DE1257918B (en) | 1968-01-04 |
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