GB1018623A - Improvements in or relating to electronic assemblies - Google Patents

Abstract

1,018,623. Circuit assemblies. GENERAL ELECTRIC CO. Ltd., and P. A. BARNET. Feb. 15, 1963 [Feb. 16, 1962], No. 6060/62. Heading H1R. In an assembly of circuit modules 2, Fig. I, which may be of the kind described in Specification 1,018,621, the modules are mounted in rows on a plate 1, passages being left between the rows for a coolant such as air. The air may pass unrestrictedly through a channel, as through channel 3, or it may be diverted, as by an obstruction 9 in channel 8, towards modules generating a comparatively large amount of heat. Where modules generate little heat, the quantity of air in a channel, such as 5, may be limited by an obstruction 6 having narrow bore orifices. The channels may be arranged in meander-shaped series fashion. Fig. 3 shows module mounting plates 23-30 defining channels 32-38. To provide additional cooling in region 39, air is diverted from channels 33, 34, 36, 37 into channels 35 by means of obstructions 40, each with a narrow bore, and orifices 41 in plates 25-28. Beyond region 39, the air is returned to its original channels by means of an obstruction 42 and orifices 43. Additional cooling of a particular module may be effected by the provision of cooling fins which may be disposed in one or more channels. Moreover, a cold plate having tubes through which coolant is passed may be interposed between two adjacent module mounting plates. In order to pass cooling liquid through the assembly channels, the latter may be lined with impermeable material such as varnish, synthetic rubber, or adhesive-backed plastic; or plastic pipes or sleeves may be provided in the channels.