GB1098182A - Electrolyte or electroless plating process - Google Patents
Electrolyte or electroless plating processInfo
- Publication number
- GB1098182A GB1098182A GB5104163A GB5104163A GB1098182A GB 1098182 A GB1098182 A GB 1098182A GB 5104163 A GB5104163 A GB 5104163A GB 5104163 A GB5104163 A GB 5104163A GB 1098182 A GB1098182 A GB 1098182A
- Authority
- GB
- United Kingdom
- Prior art keywords
- mask
- workpiece
- copper
- metal
- backing
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 238000007772 electroless plating Methods 0.000 title abstract 2
- 239000003792 electrolyte Substances 0.000 title abstract 2
- 238000000034 method Methods 0.000 title abstract 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 abstract 7
- 229910052802 copper Inorganic materials 0.000 abstract 7
- 239000010949 copper Substances 0.000 abstract 7
- 229910052751 metal Inorganic materials 0.000 abstract 7
- 239000002184 metal Substances 0.000 abstract 7
- 239000011248 coating agent Substances 0.000 abstract 3
- 238000000576 coating method Methods 0.000 abstract 3
- 239000004033 plastic Substances 0.000 abstract 3
- 229920003023 plastic Polymers 0.000 abstract 3
- 229910021578 Iron(III) chloride Inorganic materials 0.000 abstract 2
- 238000000151 deposition Methods 0.000 abstract 2
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 abstract 2
- 239000010931 gold Substances 0.000 abstract 2
- 229910052737 gold Inorganic materials 0.000 abstract 2
- 239000012212 insulator Substances 0.000 abstract 2
- RBTARNINKXHZNM-UHFFFAOYSA-K iron trichloride Chemical compound Cl[Fe](Cl)Cl RBTARNINKXHZNM-UHFFFAOYSA-K 0.000 abstract 2
- 238000007747 plating Methods 0.000 abstract 2
- 238000005406 washing Methods 0.000 abstract 2
- TXUICONDJPYNPY-UHFFFAOYSA-N (1,10,13-trimethyl-3-oxo-4,5,6,7,8,9,11,12,14,15,16,17-dodecahydrocyclopenta[a]phenanthren-17-yl) heptanoate Chemical compound C1CC2CC(=O)C=C(C)C2(C)C2C1C1CCC(OC(=O)CCCCCC)C1(C)CC2 TXUICONDJPYNPY-UHFFFAOYSA-N 0.000 abstract 1
- 239000004160 Ammonium persulphate Substances 0.000 abstract 1
- 239000004677 Nylon Substances 0.000 abstract 1
- 239000004372 Polyvinyl alcohol Substances 0.000 abstract 1
- QAOWNCQODCNURD-UHFFFAOYSA-L Sulfate Chemical compound [O-]S([O-])(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-L 0.000 abstract 1
- 229910021626 Tin(II) chloride Inorganic materials 0.000 abstract 1
- 239000002253 acid Substances 0.000 abstract 1
- 238000007792 addition Methods 0.000 abstract 1
- 235000011126 aluminium potassium sulphate Nutrition 0.000 abstract 1
- ROOXNKNUYICQNP-UHFFFAOYSA-N ammonium persulfate Chemical compound [NH4+].[NH4+].[O-]S(=O)(=O)OOS([O-])(=O)=O ROOXNKNUYICQNP-UHFFFAOYSA-N 0.000 abstract 1
- 235000019395 ammonium persulphate Nutrition 0.000 abstract 1
- 239000003990 capacitor Substances 0.000 abstract 1
- 230000000295 complement effect Effects 0.000 abstract 1
- 239000004020 conductor Substances 0.000 abstract 1
- 230000008021 deposition Effects 0.000 abstract 1
- SOCTUWSJJQCPFX-UHFFFAOYSA-N dichromate(2-) Chemical compound [O-][Cr](=O)(=O)O[Cr]([O-])(=O)=O SOCTUWSJJQCPFX-UHFFFAOYSA-N 0.000 abstract 1
- 238000007598 dipping method Methods 0.000 abstract 1
- 238000009713 electroplating Methods 0.000 abstract 1
- 239000003822 epoxy resin Substances 0.000 abstract 1
- 239000003365 glass fiber Substances 0.000 abstract 1
- 238000004519 manufacturing process Methods 0.000 abstract 1
- 230000000873 masking effect Effects 0.000 abstract 1
- 229920001778 nylon Polymers 0.000 abstract 1
- PIBWKRNGBLPSSY-UHFFFAOYSA-L palladium(II) chloride Chemical compound Cl[Pd]Cl PIBWKRNGBLPSSY-UHFFFAOYSA-L 0.000 abstract 1
- 239000002985 plastic film Substances 0.000 abstract 1
- 229920000647 polyepoxide Polymers 0.000 abstract 1
- 229920002451 polyvinyl alcohol Polymers 0.000 abstract 1
- GRLPQNLYRHEGIJ-UHFFFAOYSA-J potassium aluminium sulfate Chemical compound [Al+3].[K+].[O-]S([O-])(=O)=O.[O-]S([O-])(=O)=O GRLPQNLYRHEGIJ-UHFFFAOYSA-J 0.000 abstract 1
- 229920005989 resin Polymers 0.000 abstract 1
- 239000011347 resin Substances 0.000 abstract 1
- 239000001119 stannous chloride Substances 0.000 abstract 1
- 235000011150 stannous chloride Nutrition 0.000 abstract 1
- 229910021653 sulphate ion Inorganic materials 0.000 abstract 1
- 229910001174 tin-lead alloy Inorganic materials 0.000 abstract 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
- H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
- H05K3/07—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process being removed electrolytically
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/1601—Process or apparatus
- C23C18/1603—Process or apparatus coating on selected surface areas
- C23C18/1605—Process or apparatus coating on selected surface areas by masking
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/02—Electroplating of selected surface areas
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25F—PROCESSES FOR THE ELECTROLYTIC REMOVAL OF MATERIALS FROM OBJECTS; APPARATUS THEREFOR
- C25F3/00—Electrolytic etching or polishing
- C25F3/02—Etching
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25F—PROCESSES FOR THE ELECTROLYTIC REMOVAL OF MATERIALS FROM OBJECTS; APPARATUS THEREFOR
- C25F3/00—Electrolytic etching or polishing
- C25F3/02—Etching
- C25F3/14—Etching locally
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25F—PROCESSES FOR THE ELECTROLYTIC REMOVAL OF MATERIALS FROM OBJECTS; APPARATUS THEREFOR
- C25F7/00—Constructional parts, or assemblies thereof, of cells for electrolytic removal of material from objects; Servicing or operating
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0002—Apparatus or processes for manufacturing printed circuits for manufacturing artworks for printed circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/24—Reinforcing the conductive pattern
- H05K3/241—Reinforcing the conductive pattern characterised by the electroplating method; means therefor, e.g. baths or apparatus
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/24—Reinforcing the conductive pattern
- H05K3/243—Reinforcing the conductive pattern characterised by selective plating, e.g. for finish plating of pads
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/03—Conductive materials
- H05K2201/0332—Structure of the conductor
- H05K2201/0364—Conductor shape
- H05K2201/0367—Metallic bump or raised conductor not used as solder bump
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
- H05K2201/09736—Varying thickness of a single conductor; Conductors in the same plane having different thicknesses
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
- H05K2201/098—Special shape of the cross-section of conductors, e.g. very thick plated conductors
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/01—Tools for processing; Objects used during processing
- H05K2203/0104—Tools for processing; Objects used during processing for patterning or coating
- H05K2203/0117—Pattern shaped electrode used for patterning, e.g. plating or etching
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/05—Patterning and lithography; Masks; Details of resist
- H05K2203/0548—Masks
- H05K2203/0557—Non-printed masks
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/15—Position of the PCB during processing
- H05K2203/1545—Continuous processing, i.e. involving rolls moving a band-like or solid carrier along a continuous production path
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/108—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by semi-additive methods; masks therefor
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/4007—Surface contacts, e.g. bumps
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits
- H05K3/4647—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits by applying an insulating layer around previously made via studs
Landscapes
- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Electrochemistry (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- General Chemical & Material Sciences (AREA)
- Mechanical Engineering (AREA)
- Electroplating Methods And Accessories (AREA)
- Manufacturing Of Printed Wiring (AREA)
Abstract
Metal is deposited locally on a workpiece by electrolytic or electroless action by using an insulating mask having one or more openings in <PICT:1098182/C6-C7/1> contact with the workpiece and a porous backing member engaging the surface of the mask remote from the workpiece, a solution for effecting the deposition being present in the backing member and one or more of the openings in the mask. The mask may be formed by a photographic technique using a photo-sensitive resist or sensitized polyvinyl alcohol or nylon and may be adhered to a porous metallic backing. Alternatively a plastics sheet may be coated on to the backing and the masking openings formed in the sheet by mechanical scribing or by an electron or laser beam, or a punched plastic sheet may be secured to the metal backing. The workpiece and mask may be pressed together by flexible pressure bags. In one arrangement, a workpiece sandwiched between two masks is placed inside a bag 46 of rubber or plastic secured to a frame 45 and supported within a pressure applying vessel 40 which also contains a heater 50 and ultrasonic generators 48, 49. If desired the surface of the support member adjacent the mask may be channelled and connected to a supply pipe to allow for forced circulation of an electro-plating electrolyte to which additions may be made externally of the plating chamber. By passing successively different plating and intermediate washing solutions, successive different metal deposits may be provided, e.g. copper followed by gold. In another arrangement the workpiece and mask are held by a pressure bag against a rigid grid on the far side of which is disposed a soluble metal anode. The anode may be bagged or surrounded by a wad of glass fibre in a plastics net. For electro-depositing copper on a copper coated insulator an acid sulphate solution containing potash alum may be used. The copper coating in the unplated area may be removed by treating with acidified dichromate or ferric chloride solution. If the electrodeposited metal is tin-lead alloy from a fluoborate bath or gold the unplated copper coating may be removed with ammonium persulphate or ferric chloride solution respectively. Electroless plating with copper may be effected directly on to an insulating workpiece which has been sensitized by dipping successively in stannous chloride and palladium chloride solutions followed by washing. For printed circuit production conductors of different cross-sections may be deposited by employing a mask having openings of complementary profile. The spaces between the deposited metal may be filled with epoxy resin, cured, ground and polished to provide conducting pins flush with the resin surface and a uniform metal coating may be applied thereover. By so treating both faces of a workpiece a coil or multiple plate capacitor may be formed or connections extending through an insulator produced. In an arrangement for forming an electro-plated printed circuit, a copper coated insulating strip is fed around a porous cylinder bearing an insulating mask and partially immersed in an electrolytic bath, an endless moving belt conveyer holding the copper surface of the strip, to which cathodic connection is made by a roller, against the mask.
Priority Applications (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| GB5104163A GB1098182A (en) | 1963-12-27 | 1963-12-27 | Electrolyte or electroless plating process |
| DE19641521306 DE1521306B2 (en) | 1963-12-27 | 1964-12-19 | METHOD FOR ELECTROLYTIC OR CHEMICAL APPLICATION OF ELECTRIC CABLE LINES |
| NL6415051A NL6415051A (en) | 1963-12-27 | 1964-12-23 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| GB5104163A GB1098182A (en) | 1963-12-27 | 1963-12-27 | Electrolyte or electroless plating process |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| GB1098182A true GB1098182A (en) | 1968-01-10 |
Family
ID=10458406
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| GB5104163A Expired GB1098182A (en) | 1963-12-27 | 1963-12-27 | Electrolyte or electroless plating process |
Country Status (3)
| Country | Link |
|---|---|
| DE (1) | DE1521306B2 (en) |
| GB (1) | GB1098182A (en) |
| NL (1) | NL6415051A (en) |
Cited By (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3819502A (en) * | 1971-05-25 | 1974-06-25 | Meco Metal Finishing Eng Nv | Line- and spotplating machine |
| US4007097A (en) * | 1973-10-04 | 1977-02-08 | Galentan A.G. | Process for selectively applying a metal coating to the metallic parts of elements which pass through an insulator |
| US4014773A (en) * | 1974-07-31 | 1977-03-29 | Daiichi Denshi Kogyo Kabushiki Kaisha | Apparatus for electrolytic treatment |
| US4358349A (en) * | 1979-05-24 | 1982-11-09 | Matsushita Electric Works, Ltd. | Method of forming electrical wiring path on insulative substrate |
| US4374004A (en) * | 1981-06-29 | 1983-02-15 | Northern Telecom Limited | Method and apparatus for surface-treating predetermined areas of a surface of a body |
| US4605483A (en) * | 1984-11-06 | 1986-08-12 | Michaelson Henry W | Electrode for electro-plating non-continuously conductive surfaces |
| EP0166105A3 (en) * | 1984-06-27 | 1987-07-15 | Nippon Mektron, Ltd. | Flexible board and process for making it |
| US7790009B2 (en) | 2001-06-15 | 2010-09-07 | Replisaurus Technologies Ab | Method and electrode for defining and replicating structures in conducting materials |
| CN102400115A (en) * | 2011-10-20 | 2012-04-04 | 复旦大学 | A method for preparing a flexible copper electrode pattern with a micron-scale line width |
| EP3461934A1 (en) * | 2017-09-28 | 2019-04-03 | Toyota Jidosha Kabushiki Kaisha | Film forming method for metal film and film forming apparatus for metal film |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5267961A (en) * | 1975-12-03 | 1977-06-06 | Mitsubishi Electric Corp | Electrode formation of semiconductor unit |
-
1963
- 1963-12-27 GB GB5104163A patent/GB1098182A/en not_active Expired
-
1964
- 1964-12-19 DE DE19641521306 patent/DE1521306B2/en active Pending
- 1964-12-23 NL NL6415051A patent/NL6415051A/xx unknown
Cited By (13)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3819502A (en) * | 1971-05-25 | 1974-06-25 | Meco Metal Finishing Eng Nv | Line- and spotplating machine |
| US4007097A (en) * | 1973-10-04 | 1977-02-08 | Galentan A.G. | Process for selectively applying a metal coating to the metallic parts of elements which pass through an insulator |
| US4014773A (en) * | 1974-07-31 | 1977-03-29 | Daiichi Denshi Kogyo Kabushiki Kaisha | Apparatus for electrolytic treatment |
| US4358349A (en) * | 1979-05-24 | 1982-11-09 | Matsushita Electric Works, Ltd. | Method of forming electrical wiring path on insulative substrate |
| US4374004A (en) * | 1981-06-29 | 1983-02-15 | Northern Telecom Limited | Method and apparatus for surface-treating predetermined areas of a surface of a body |
| EP0166105A3 (en) * | 1984-06-27 | 1987-07-15 | Nippon Mektron, Ltd. | Flexible board and process for making it |
| US4605483A (en) * | 1984-11-06 | 1986-08-12 | Michaelson Henry W | Electrode for electro-plating non-continuously conductive surfaces |
| US7790009B2 (en) | 2001-06-15 | 2010-09-07 | Replisaurus Technologies Ab | Method and electrode for defining and replicating structures in conducting materials |
| CN102400115A (en) * | 2011-10-20 | 2012-04-04 | 复旦大学 | A method for preparing a flexible copper electrode pattern with a micron-scale line width |
| CN102400115B (en) * | 2011-10-20 | 2014-04-02 | 复旦大学 | Preparation method of flexible copper electrode pattern in micron level wire width |
| EP3461934A1 (en) * | 2017-09-28 | 2019-04-03 | Toyota Jidosha Kabushiki Kaisha | Film forming method for metal film and film forming apparatus for metal film |
| CN109576746A (en) * | 2017-09-28 | 2019-04-05 | 丰田自动车株式会社 | The film build method of metal envelope and the film formation device of metal envelope |
| US11035049B2 (en) | 2017-09-28 | 2021-06-15 | Toyota Jidosha Kabushiki Kaisha | Film forming method for metal film and film forming apparatus for metal film |
Also Published As
| Publication number | Publication date |
|---|---|
| DE1521306B2 (en) | 1971-05-06 |
| NL6415051A (en) | 1965-06-28 |
| DE1521306A1 (en) | 1969-11-06 |
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