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GB1084028A - A method of soldering a semiconductor chip to a backing plate - Google Patents

A method of soldering a semiconductor chip to a backing plate

Info

Publication number
GB1084028A
GB1084028A GB50581/65A GB5058165A GB1084028A GB 1084028 A GB1084028 A GB 1084028A GB 50581/65 A GB50581/65 A GB 50581/65A GB 5058165 A GB5058165 A GB 5058165A GB 1084028 A GB1084028 A GB 1084028A
Authority
GB
United Kingdom
Prior art keywords
solder
hole
chip
soldering
pellet
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
GB50581/65A
Inventor
Leonard Thomas Alexand Beckett
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
STC PLC
Original Assignee
Standard Telephone and Cables PLC
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Standard Telephone and Cables PLC filed Critical Standard Telephone and Cables PLC
Priority to GB50581/65A priority Critical patent/GB1084028A/en
Priority to FR85377A priority patent/FR1503071A/en
Priority to ES0333938A priority patent/ES333938A1/en
Priority to BE690375D priority patent/BE690375A/xx
Priority to NL6616750A priority patent/NL6616750A/xx
Publication of GB1084028A publication Critical patent/GB1084028A/en
Expired legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K1/00—Soldering, e.g. brazing, or unsoldering
    • B23K1/0008—Soldering, e.g. brazing, or unsoldering specially adapted for particular articles or work
    • H10W40/10—
    • H10W72/073—
    • H10W72/07336—
    • H10W72/07353—
    • H10W72/334—
    • H10W72/931—

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Die Bonding (AREA)
  • Lining Or Joining Of Plastics Or The Like (AREA)

Abstract

1,084,028. Soldering. STANDARD TELEPHONES & CABLES Ltd. Nov. 29, 1965, No. 50581/65. Heading B3R. In soldering a semi-conductor chip to a larger backing plate a hole is provided in one face of the latter in which a pellet of solder is inserted, the chip is placed in intimate contact with the plate to cover the pellet and heat is applied to melt the solder which is drawn by capillary action into the chip-plate interface. A small hole 4 is drilled or punched in a heat sink 2, a spherical pellet of solder 3 is forced into the hole and a semi-conductor chip 1 is placed over the hole and heat is applied to melt the solder. The solder flows between the chip and the heat sink surface to stop at the edge of the chip, excess solder remaining in the hole. The hole may be blind or merely an indentation in the surface.
GB50581/65A 1965-11-29 1965-11-29 A method of soldering a semiconductor chip to a backing plate Expired GB1084028A (en)

Priority Applications (5)

Application Number Priority Date Filing Date Title
GB50581/65A GB1084028A (en) 1965-11-29 1965-11-29 A method of soldering a semiconductor chip to a backing plate
FR85377A FR1503071A (en) 1965-11-29 1966-11-29 Tin welding process
ES0333938A ES333938A1 (en) 1965-11-29 1966-11-29 A METHOD OF WELDING A BODY TO A BASE.
BE690375D BE690375A (en) 1965-11-29 1966-11-29
NL6616750A NL6616750A (en) 1965-11-29 1966-11-29

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
GB50581/65A GB1084028A (en) 1965-11-29 1965-11-29 A method of soldering a semiconductor chip to a backing plate

Publications (1)

Publication Number Publication Date
GB1084028A true GB1084028A (en) 1967-09-20

Family

ID=10456473

Family Applications (1)

Application Number Title Priority Date Filing Date
GB50581/65A Expired GB1084028A (en) 1965-11-29 1965-11-29 A method of soldering a semiconductor chip to a backing plate

Country Status (5)

Country Link
BE (1) BE690375A (en)
ES (1) ES333938A1 (en)
FR (1) FR1503071A (en)
GB (1) GB1084028A (en)
NL (1) NL6616750A (en)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2118101A1 (en) * 1970-12-15 1972-07-28 Philips Nv
DE2601765A1 (en) * 1975-01-24 1976-07-29 Senju Metal Industry Co MICROBALL MADE OF SOLDER MATERIAL WITH A METALLIC CORE AND METHOD OF MANUFACTURING THE SAME
FR2625038A1 (en) * 1987-12-22 1989-06-23 Cit Alcatel METHOD AND DEVICE FOR COOLING AN INTEGRATED CIRCUIT HOUSING
CN107598404A (en) * 2016-07-12 2018-01-19 蔡明坤 Method for manufacturing cavity of temperature equalizing device and structure thereof

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2118101A1 (en) * 1970-12-15 1972-07-28 Philips Nv
DE2601765A1 (en) * 1975-01-24 1976-07-29 Senju Metal Industry Co MICROBALL MADE OF SOLDER MATERIAL WITH A METALLIC CORE AND METHOD OF MANUFACTURING THE SAME
FR2625038A1 (en) * 1987-12-22 1989-06-23 Cit Alcatel METHOD AND DEVICE FOR COOLING AN INTEGRATED CIRCUIT HOUSING
EP0321899A1 (en) * 1987-12-22 1989-06-28 Alcatel Cit Method and cooling device for an integrated-circuit housing
US4924352A (en) * 1987-12-22 1990-05-08 Societe Anonyme Dite: Alcatel Cit Method and device for cooling an integrated circuit package
CN107598404A (en) * 2016-07-12 2018-01-19 蔡明坤 Method for manufacturing cavity of temperature equalizing device and structure thereof

Also Published As

Publication number Publication date
ES333938A1 (en) 1967-10-16
NL6616750A (en) 1967-05-30
BE690375A (en) 1967-05-29
FR1503071A (en) 1967-11-24

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