GB1081509A - Transistor - Google Patents
TransistorInfo
- Publication number
- GB1081509A GB1081509A GB15560/66A GB1556066A GB1081509A GB 1081509 A GB1081509 A GB 1081509A GB 15560/66 A GB15560/66 A GB 15560/66A GB 1556066 A GB1556066 A GB 1556066A GB 1081509 A GB1081509 A GB 1081509A
- Authority
- GB
- United Kingdom
- Prior art keywords
- base
- emitter
- wafer
- regions
- april
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- H10W20/40—
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D99/00—Subject matter not provided for in other groups of this subclass
-
- H10P95/00—
Landscapes
- Bipolar Transistors (AREA)
Abstract
1,081,509. Semi-conductor devices. ITT INDUSTRIES Inc. April 7, 1966 [April 7, 1965], No. 15560/66. Heading H1K. As shown, Fig. 1, a planar transistor comprises a square die 1 with a square base region 2 and an emitter region (enclosed by line 5) which includes two series of fingers extending at right-angles, the fingers of each series being of successively decreasing lengths. A plurality of such transistors are produced in a wafer of N-type silicon comprising a high resistivity epitaxial layer formed on a low resistivity substrate, by diffusing in boron and phosphorus, using silicon dioxide masks, to form the base and emitter regions. Emitter and base electrodes 3, 4 are formed by exposing the base and emitter regions, evaporating a layer of aluminium on to the surface, masking and etching and then alloying the electrodes to the silicon. The wafer is then diced and emitter and base leads are connected to areas 3a, 4a by compression bonding balls formed on the ends of the leads. During production strip like regions may be diffused into the wafer between the devices, Fig. 2 (not shown), to allow measurements to be made, and to aid mask alignment. Reference has been directed by the Comptroller to Specification 993,388.
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| DEST023639 | 1965-04-07 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| GB1081509A true GB1081509A (en) | 1967-08-31 |
Family
ID=7459815
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| GB15560/66A Expired GB1081509A (en) | 1965-04-07 | 1966-04-07 | Transistor |
Country Status (1)
| Country | Link |
|---|---|
| GB (1) | GB1081509A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE2822166A1 (en) * | 1977-05-25 | 1978-11-30 | Philips Nv | SEMI-CONDUCTOR ARRANGEMENT |
| CN103872105A (en) * | 2014-04-04 | 2014-06-18 | 石家庄天林石无二电子有限公司 | Reinforced bipolar transistor resistant to radiation and method for preparing reinforced bipolar transistor resistant to radiation |
-
1966
- 1966-04-07 GB GB15560/66A patent/GB1081509A/en not_active Expired
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE2822166A1 (en) * | 1977-05-25 | 1978-11-30 | Philips Nv | SEMI-CONDUCTOR ARRANGEMENT |
| CN103872105A (en) * | 2014-04-04 | 2014-06-18 | 石家庄天林石无二电子有限公司 | Reinforced bipolar transistor resistant to radiation and method for preparing reinforced bipolar transistor resistant to radiation |
| CN103872105B (en) * | 2014-04-04 | 2016-09-14 | 石家庄天林石无二电子有限公司 | A kind of preparation method of radiation hardened bipolar transistor |
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