[go: up one dir, main page]

GB1053304A - - Google Patents

Info

Publication number
GB1053304A
GB1053304A GB1053304DA GB1053304A GB 1053304 A GB1053304 A GB 1053304A GB 1053304D A GB1053304D A GB 1053304DA GB 1053304 A GB1053304 A GB 1053304A
Authority
GB
United Kingdom
Prior art keywords
copper
face
layer
acid
deposited
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Publication of GB1053304A publication Critical patent/GB1053304A/en
Active legal-status Critical Current

Links

Classifications

    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/18Pretreatment of the material to be coated
    • C23C18/1851Pretreatment of the material to be coated of surfaces of non-metallic or semiconducting in organic material
    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/1601Process or apparatus
    • C23C18/1633Process of electroless plating
    • C23C18/1646Characteristics of the product obtained
    • C23C18/165Multilayered product
    • C23C18/1653Two or more layers with at least one layer obtained by electroless plating and one layer obtained by electroplating
    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/18Pretreatment of the material to be coated
    • C23C18/1851Pretreatment of the material to be coated of surfaces of non-metallic or semiconducting in organic material
    • C23C18/1872Pretreatment of the material to be coated of surfaces of non-metallic or semiconducting in organic material by chemical pretreatment
    • C23C18/1875Pretreatment of the material to be coated of surfaces of non-metallic or semiconducting in organic material by chemical pretreatment only one step pretreatment
    • C23C18/1879Use of metal, e.g. activation, sensitisation with noble metals
    • CCHEMISTRY; METALLURGY
    • C25ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25DPROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D1/00Electroforming
    • C25D1/04Wires; Strips; Foils
    • CCHEMISTRY; METALLURGY
    • C25ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25DPROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D7/00Electroplating characterised by the article coated
    • C25D7/001Magnets
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01FMAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F10/00Thin magnetic films, e.g. of one-domain structure
    • H01F10/08Thin magnetic films, e.g. of one-domain structure characterised by magnetic layers
    • H01F10/10Thin magnetic films, e.g. of one-domain structure characterised by magnetic layers characterised by the composition
    • H01F10/12Thin magnetic films, e.g. of one-domain structure characterised by magnetic layers characterised by the composition being metals or alloys
    • H01F10/14Thin magnetic films, e.g. of one-domain structure characterised by magnetic layers characterised by the composition being metals or alloys containing iron or nickel
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01FMAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F41/00Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties
    • H01F41/32Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for applying conductive, insulating or magnetic material on a magnetic film, specially adapted for a thin magnetic film
    • H01F41/34Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for applying conductive, insulating or magnetic material on a magnetic film, specially adapted for a thin magnetic film in patterns, e.g. by lithography

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Metallurgy (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Materials Engineering (AREA)
  • Organic Chemistry (AREA)
  • Mechanical Engineering (AREA)
  • General Chemical & Material Sciences (AREA)
  • Power Engineering (AREA)
  • Electrochemistry (AREA)
  • Manufacturing & Machinery (AREA)
  • Electroplating Methods And Accessories (AREA)
  • Manufacturing Of Magnetic Record Carriers (AREA)

Abstract

1,053,304. Metal support formed by stripping coating. SIEMENS & HALSKE A. G. Jan. 30, 1964 [Feb. 4, 1963; April 25, 1963; Oct. 14, 1963], No.4092/64. Headings C7B and C7F. [Also in Division H1] In manufacturing an assembly comprising a non-ferromagnetic metallic base plate having magnetizable material deposited as a thin layer on discrete areas of one face, e.g. by vapour deposition, cathode sputtering, or electroplating, the base plate is formed by depositing a metallic material onto the surface of a carrier having very smooth surfaces, e.g. a polished plate of glass or synthetic material so that the deposit conforms very closely to the carrier surface and subsequently stripping off the metallic layer so formed, and the magnetizable material is deposited on the face of the layer which contacted the carrier surface. Typically a polished optically flat glass plate is rendered electrically conductive on one face by cleaning in a hot aqueous solution of chromic oxide and sulphuric acid, accompanied by ultrasonics, followed by electroless deposition of copper, gold, or silver, and copper is then electroplated over the conductive layer, e.g. from an acid copper bath containing phenolsulphonic acid and a wetting agent at 40‹C. An adhesive foil of synthetic resin is then applied to the copper for stripping it from the glass plate and the smooth copper face is then coated with a 81-19% Ni-Fe alloy by electrolytic or vapour deposition. To form a magnetic memory matrix Fig. 4 (not shown), a photo-sensitive varnish is then employed to make a resist mask by photographic exposure and development, and the unprotected areas etched away electrolytically with a solution of hydrochloric and citric acids, whereafter the remaining varnish is removed with trichlorethylene. Silicon oxide is then vapour-deposited over the magnetic alloy and copper areas, and two layers of conductive strips insulated by silicon oxide are applied so that the strips intersect at right angles over the magnetic elements. In alternate methods of forming the smooth metal face, Figs. 5 to 10 (not shown), a cleaned flat glass plate is subjected successively to solutions of acid aqueous stannous chloride and alcoholic alkaline formaldehyde solution and is then chemically silvered all over with an aqueous ammonia solution of silver nitrate and rochelle salt followed by heating. A thin layer of copper is then electrodeposited from an acid copper bath and the margins and edges are then masked with a bath-resistant tape, whereafter more copper is electrodeposited and the metal is cut through along the edges of the masking tape to free two copper bodies having thin layers of smooth silver. The bodies may then be electroplated with gold containing small amounts of cobalt and indium from a cyanide bath and the magnetic material is deposited subsequently on the face adjacent the silver layer. In another modification Figs. 11 to 13 (not shown) of this method, a further inner border of masking tape is applied to ensure a more uniform deposit of copper at the edges. Reference has been directed by the Comptroller to Specification 992, 368.
GB1053304D 1964-01-21 Active GB1053304A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
FR961051A FR1380214A (en) 1964-01-21 1964-01-21 Process for the manufacture of thin magnetizable layers and layers conforming to those thus obtained

Publications (1)

Publication Number Publication Date
GB1053304A true GB1053304A (en)

Family

ID=8821390

Family Applications (1)

Application Number Title Priority Date Filing Date
GB1053304D Active GB1053304A (en) 1964-01-21

Country Status (3)

Country Link
FR (1) FR1380214A (en)
GB (1) GB1053304A (en)
NL (1) NL302816A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2008051390A1 (en) * 2006-10-26 2008-05-02 Carestream Health, Inc. Metal substrate having electronic devices formed thereon
CN103774191A (en) * 2014-02-24 2014-05-07 襄垣县韩山度假有限责任公司 Copper plating method of leaf carving artware

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2008051390A1 (en) * 2006-10-26 2008-05-02 Carestream Health, Inc. Metal substrate having electronic devices formed thereon
US7913381B2 (en) 2006-10-26 2011-03-29 Carestream Health, Inc. Metal substrate having electronic devices formed thereon
US8015702B2 (en) 2006-10-26 2011-09-13 Carestream Health, Inc. Metal substrate having electronic devices formed thereon
US8132318B2 (en) 2006-10-26 2012-03-13 Carestream Health, Inc. Metal substrate having electronic devices formed thereon
CN103774191A (en) * 2014-02-24 2014-05-07 襄垣县韩山度假有限责任公司 Copper plating method of leaf carving artware

Also Published As

Publication number Publication date
NL302816A (en)
FR1380214A (en) 1964-11-27

Similar Documents

Publication Publication Date Title
US3269861A (en) Method for electroless copper plating
US3116159A (en) Process of fabricating magnetic data storage devices
US3523824A (en) Metallization of plastic materials
DK0400349T3 (en) Deposition of silver layers on non-conductive substrates
US3668003A (en) Printed circuits
US4042730A (en) Process for electroless plating using separate sensitization and activation steps
GB1490229A (en) Method of forming a hydrophobic surface
GB1143899A (en) Improvements relating to the manufacture of printed circuits
EP0007577B1 (en) Method of improving the adhesion of electroless metal deposits
US3310432A (en) Method for applying electrical conductors on a smooth vitreous surface and article
GB1326046A (en) Method of making a patterned metal film
USRE28042E (en) Method of making additive printed circuit boards and product thereof
JPS63282289A (en) Metal lattice for shielding electromagnetic wave
GB1242995A (en) Electroless nickel plating on a nonconductive substrate
US4486273A (en) Selective plating of dielectric substrates
JPH01500677A (en) Chrome mask for electroless nickel or copper plating
US3321328A (en) Coating of aluminum substrates with a magnetic material
US3878007A (en) Method of depositing a pattern of metal plated areas on an insulating substrate
GB1053304A (en)
US3498823A (en) Electroless tin plating on electroless nickel
GB1065077A (en) Methods of plating insulating surfaces
JP2003253454A (en) Method for plating electronic parts, and electronic parts
US3409466A (en) Process for electrolessly plating lead on copper
US3392053A (en) Memory fabrication method
GB892451A (en) Improvements in and relating to the manufacture of printed circuits