GB1053304A - - Google Patents
Info
- Publication number
- GB1053304A GB1053304A GB1053304DA GB1053304A GB 1053304 A GB1053304 A GB 1053304A GB 1053304D A GB1053304D A GB 1053304DA GB 1053304 A GB1053304 A GB 1053304A
- Authority
- GB
- United Kingdom
- Prior art keywords
- copper
- face
- layer
- acid
- deposited
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/18—Pretreatment of the material to be coated
- C23C18/1851—Pretreatment of the material to be coated of surfaces of non-metallic or semiconducting in organic material
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/1601—Process or apparatus
- C23C18/1633—Process of electroless plating
- C23C18/1646—Characteristics of the product obtained
- C23C18/165—Multilayered product
- C23C18/1653—Two or more layers with at least one layer obtained by electroless plating and one layer obtained by electroplating
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/18—Pretreatment of the material to be coated
- C23C18/1851—Pretreatment of the material to be coated of surfaces of non-metallic or semiconducting in organic material
- C23C18/1872—Pretreatment of the material to be coated of surfaces of non-metallic or semiconducting in organic material by chemical pretreatment
- C23C18/1875—Pretreatment of the material to be coated of surfaces of non-metallic or semiconducting in organic material by chemical pretreatment only one step pretreatment
- C23C18/1879—Use of metal, e.g. activation, sensitisation with noble metals
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D1/00—Electroforming
- C25D1/04—Wires; Strips; Foils
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D7/00—Electroplating characterised by the article coated
- C25D7/001—Magnets
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F10/00—Thin magnetic films, e.g. of one-domain structure
- H01F10/08—Thin magnetic films, e.g. of one-domain structure characterised by magnetic layers
- H01F10/10—Thin magnetic films, e.g. of one-domain structure characterised by magnetic layers characterised by the composition
- H01F10/12—Thin magnetic films, e.g. of one-domain structure characterised by magnetic layers characterised by the composition being metals or alloys
- H01F10/14—Thin magnetic films, e.g. of one-domain structure characterised by magnetic layers characterised by the composition being metals or alloys containing iron or nickel
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F41/00—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties
- H01F41/32—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for applying conductive, insulating or magnetic material on a magnetic film, specially adapted for a thin magnetic film
- H01F41/34—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for applying conductive, insulating or magnetic material on a magnetic film, specially adapted for a thin magnetic film in patterns, e.g. by lithography
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Metallurgy (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Materials Engineering (AREA)
- Organic Chemistry (AREA)
- Mechanical Engineering (AREA)
- General Chemical & Material Sciences (AREA)
- Power Engineering (AREA)
- Electrochemistry (AREA)
- Manufacturing & Machinery (AREA)
- Electroplating Methods And Accessories (AREA)
- Manufacturing Of Magnetic Record Carriers (AREA)
Abstract
1,053,304. Metal support formed by stripping coating. SIEMENS & HALSKE A. G. Jan. 30, 1964 [Feb. 4, 1963; April 25, 1963; Oct. 14, 1963], No.4092/64. Headings C7B and C7F. [Also in Division H1] In manufacturing an assembly comprising a non-ferromagnetic metallic base plate having magnetizable material deposited as a thin layer on discrete areas of one face, e.g. by vapour deposition, cathode sputtering, or electroplating, the base plate is formed by depositing a metallic material onto the surface of a carrier having very smooth surfaces, e.g. a polished plate of glass or synthetic material so that the deposit conforms very closely to the carrier surface and subsequently stripping off the metallic layer so formed, and the magnetizable material is deposited on the face of the layer which contacted the carrier surface. Typically a polished optically flat glass plate is rendered electrically conductive on one face by cleaning in a hot aqueous solution of chromic oxide and sulphuric acid, accompanied by ultrasonics, followed by electroless deposition of copper, gold, or silver, and copper is then electroplated over the conductive layer, e.g. from an acid copper bath containing phenolsulphonic acid and a wetting agent at 40C. An adhesive foil of synthetic resin is then applied to the copper for stripping it from the glass plate and the smooth copper face is then coated with a 81-19% Ni-Fe alloy by electrolytic or vapour deposition. To form a magnetic memory matrix Fig. 4 (not shown), a photo-sensitive varnish is then employed to make a resist mask by photographic exposure and development, and the unprotected areas etched away electrolytically with a solution of hydrochloric and citric acids, whereafter the remaining varnish is removed with trichlorethylene. Silicon oxide is then vapour-deposited over the magnetic alloy and copper areas, and two layers of conductive strips insulated by silicon oxide are applied so that the strips intersect at right angles over the magnetic elements. In alternate methods of forming the smooth metal face, Figs. 5 to 10 (not shown), a cleaned flat glass plate is subjected successively to solutions of acid aqueous stannous chloride and alcoholic alkaline formaldehyde solution and is then chemically silvered all over with an aqueous ammonia solution of silver nitrate and rochelle salt followed by heating. A thin layer of copper is then electrodeposited from an acid copper bath and the margins and edges are then masked with a bath-resistant tape, whereafter more copper is electrodeposited and the metal is cut through along the edges of the masking tape to free two copper bodies having thin layers of smooth silver. The bodies may then be electroplated with gold containing small amounts of cobalt and indium from a cyanide bath and the magnetic material is deposited subsequently on the face adjacent the silver layer. In another modification Figs. 11 to 13 (not shown) of this method, a further inner border of masking tape is applied to ensure a more uniform deposit of copper at the edges. Reference has been directed by the Comptroller to Specification 992, 368.
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| FR961051A FR1380214A (en) | 1964-01-21 | 1964-01-21 | Process for the manufacture of thin magnetizable layers and layers conforming to those thus obtained |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| GB1053304A true GB1053304A (en) |
Family
ID=8821390
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| GB1053304D Active GB1053304A (en) | 1964-01-21 |
Country Status (3)
| Country | Link |
|---|---|
| FR (1) | FR1380214A (en) |
| GB (1) | GB1053304A (en) |
| NL (1) | NL302816A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2008051390A1 (en) * | 2006-10-26 | 2008-05-02 | Carestream Health, Inc. | Metal substrate having electronic devices formed thereon |
| CN103774191A (en) * | 2014-02-24 | 2014-05-07 | 襄垣县韩山度假有限责任公司 | Copper plating method of leaf carving artware |
-
0
- NL NL302816D patent/NL302816A/xx unknown
- GB GB1053304D patent/GB1053304A/en active Active
-
1964
- 1964-01-21 FR FR961051A patent/FR1380214A/en not_active Expired
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2008051390A1 (en) * | 2006-10-26 | 2008-05-02 | Carestream Health, Inc. | Metal substrate having electronic devices formed thereon |
| US7913381B2 (en) | 2006-10-26 | 2011-03-29 | Carestream Health, Inc. | Metal substrate having electronic devices formed thereon |
| US8015702B2 (en) | 2006-10-26 | 2011-09-13 | Carestream Health, Inc. | Metal substrate having electronic devices formed thereon |
| US8132318B2 (en) | 2006-10-26 | 2012-03-13 | Carestream Health, Inc. | Metal substrate having electronic devices formed thereon |
| CN103774191A (en) * | 2014-02-24 | 2014-05-07 | 襄垣县韩山度假有限责任公司 | Copper plating method of leaf carving artware |
Also Published As
| Publication number | Publication date |
|---|---|
| NL302816A (en) | |
| FR1380214A (en) | 1964-11-27 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US3269861A (en) | Method for electroless copper plating | |
| US3116159A (en) | Process of fabricating magnetic data storage devices | |
| US3523824A (en) | Metallization of plastic materials | |
| DK0400349T3 (en) | Deposition of silver layers on non-conductive substrates | |
| US3668003A (en) | Printed circuits | |
| US4042730A (en) | Process for electroless plating using separate sensitization and activation steps | |
| GB1490229A (en) | Method of forming a hydrophobic surface | |
| GB1143899A (en) | Improvements relating to the manufacture of printed circuits | |
| EP0007577B1 (en) | Method of improving the adhesion of electroless metal deposits | |
| US3310432A (en) | Method for applying electrical conductors on a smooth vitreous surface and article | |
| GB1326046A (en) | Method of making a patterned metal film | |
| USRE28042E (en) | Method of making additive printed circuit boards and product thereof | |
| JPS63282289A (en) | Metal lattice for shielding electromagnetic wave | |
| GB1242995A (en) | Electroless nickel plating on a nonconductive substrate | |
| US4486273A (en) | Selective plating of dielectric substrates | |
| JPH01500677A (en) | Chrome mask for electroless nickel or copper plating | |
| US3321328A (en) | Coating of aluminum substrates with a magnetic material | |
| US3878007A (en) | Method of depositing a pattern of metal plated areas on an insulating substrate | |
| GB1053304A (en) | ||
| US3498823A (en) | Electroless tin plating on electroless nickel | |
| GB1065077A (en) | Methods of plating insulating surfaces | |
| JP2003253454A (en) | Method for plating electronic parts, and electronic parts | |
| US3409466A (en) | Process for electrolessly plating lead on copper | |
| US3392053A (en) | Memory fabrication method | |
| GB892451A (en) | Improvements in and relating to the manufacture of printed circuits |