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GB1051150A - - Google Patents

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Publication number
GB1051150A
GB1051150A GB1051150DA GB1051150A GB 1051150 A GB1051150 A GB 1051150A GB 1051150D A GB1051150D A GB 1051150DA GB 1051150 A GB1051150 A GB 1051150A
Authority
GB
United Kingdom
Prior art keywords
alkali metal
copper
mucapto
nov
compounds
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
Publication of GB1051150A publication Critical patent/GB1051150A/en
Active legal-status Critical Current

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Classifications

    • CCHEMISTRY; METALLURGY
    • C07ORGANIC CHEMISTRY
    • C07DHETEROCYCLIC COMPOUNDS
    • C07D233/00Heterocyclic compounds containing 1,3-diazole or hydrogenated 1,3-diazole rings, not condensed with other rings
    • C07D233/04Heterocyclic compounds containing 1,3-diazole or hydrogenated 1,3-diazole rings, not condensed with other rings having one double bond between ring members or between a ring member and a non-ring member
    • C07D233/28Heterocyclic compounds containing 1,3-diazole or hydrogenated 1,3-diazole rings, not condensed with other rings having one double bond between ring members or between a ring member and a non-ring member with hetero atoms or with carbon atoms having three bonds to hetero atoms with at the most one bond to halogen, e.g. ester or nitrile radicals, directly attached to ring carbon atoms
    • C07D233/30Oxygen or sulfur atoms
    • C07D233/42Sulfur atoms
    • CCHEMISTRY; METALLURGY
    • C25ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25DPROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00Electroplating: Baths therefor
    • C25D3/02Electroplating: Baths therefor from solutions
    • C25D3/38Electroplating: Baths therefor from solutions of copper

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  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Electroplating And Plating Baths Therefor (AREA)

Abstract

1,051,150. Copper plating baths. W. CANNING & CO. Ltd. Nov. 13, 1963 [Nov. 14, 1962], No. 43034/62. Heading C7B. A copper plating bath contains a copper complex M 6 Cu(P 2 0 7 ) 2 , M = alkali metal, together with an alkali metal pyrophosphate and a mucaptopyrimidine or mucapto-iminazole. Derivatives of the mucapto-compounds may be used, especially alkyl-and hydroxy-compounds. Optional additions include, alkali metal and ammonium salts of organic acids e. g. oxalic, citric, and tartaric acid. In examples, metals coated are zinc die casting alloy, brass, and steel precoated from a copper cyanide bath or a pyro-phosphate bath.
GB1051150D Active GB1051150A (en)

Publications (1)

Publication Number Publication Date
GB1051150A true GB1051150A (en)

Family

ID=1756211

Family Applications (1)

Application Number Title Priority Date Filing Date
GB1051150D Active GB1051150A (en)

Country Status (1)

Country Link
GB (1) GB1051150A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5607570A (en) * 1994-10-31 1997-03-04 Rohbani; Elias Electroplating solution

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5607570A (en) * 1994-10-31 1997-03-04 Rohbani; Elias Electroplating solution

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