GB1042331A - Improvements relating to printed electric circuits and to the manufacture of such circuits - Google Patents
Improvements relating to printed electric circuits and to the manufacture of such circuitsInfo
- Publication number
- GB1042331A GB1042331A GB3505961A GB3505961A GB1042331A GB 1042331 A GB1042331 A GB 1042331A GB 3505961 A GB3505961 A GB 3505961A GB 3505961 A GB3505961 A GB 3505961A GB 1042331 A GB1042331 A GB 1042331A
- Authority
- GB
- United Kingdom
- Prior art keywords
- conductors
- plates
- wires
- ladders
- address
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 238000004519 manufacturing process Methods 0.000 title abstract 3
- 239000004020 conductor Substances 0.000 abstract 22
- 238000004804 winding Methods 0.000 abstract 13
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 abstract 4
- 239000010949 copper Substances 0.000 abstract 4
- 239000011810 insulating material Substances 0.000 abstract 4
- 229910052802 copper Inorganic materials 0.000 abstract 3
- 239000011888 foil Substances 0.000 abstract 3
- 230000008020 evaporation Effects 0.000 abstract 2
- 238000001704 evaporation Methods 0.000 abstract 2
- 239000010408 film Substances 0.000 abstract 2
- 239000011521 glass Substances 0.000 abstract 2
- 239000003365 glass fiber Substances 0.000 abstract 2
- 238000009413 insulation Methods 0.000 abstract 2
- 238000012986 modification Methods 0.000 abstract 2
- 230000004048 modification Effects 0.000 abstract 2
- 239000000758 substrate Substances 0.000 abstract 2
- 239000010409 thin film Substances 0.000 abstract 2
- 229910003271 Ni-Fe Inorganic materials 0.000 abstract 1
- 239000000956 alloy Substances 0.000 abstract 1
- 229910045601 alloy Inorganic materials 0.000 abstract 1
- 230000000712 assembly Effects 0.000 abstract 1
- 238000000429 assembly Methods 0.000 abstract 1
- 239000003795 chemical substances by application Substances 0.000 abstract 1
- 239000011889 copper foil Substances 0.000 abstract 1
- 230000008878 coupling Effects 0.000 abstract 1
- 238000010168 coupling process Methods 0.000 abstract 1
- 238000005859 coupling reaction Methods 0.000 abstract 1
- 238000013016 damping Methods 0.000 abstract 1
- 230000000694 effects Effects 0.000 abstract 1
- 238000004070 electrodeposition Methods 0.000 abstract 1
- 239000000839 emulsion Substances 0.000 abstract 1
- 238000005530 etching Methods 0.000 abstract 1
- 239000011152 fibreglass Substances 0.000 abstract 1
- 229920002457 flexible plastic Polymers 0.000 abstract 1
- 230000004927 fusion Effects 0.000 abstract 1
- 230000001939 inductive effect Effects 0.000 abstract 1
- 230000013011 mating Effects 0.000 abstract 1
- 239000002184 metal Substances 0.000 abstract 1
- 229910052751 metal Inorganic materials 0.000 abstract 1
- 238000000034 method Methods 0.000 abstract 1
- 239000002985 plastic film Substances 0.000 abstract 1
- 238000007747 plating Methods 0.000 abstract 1
- 238000007639 printing Methods 0.000 abstract 1
- 239000011253 protective coating Substances 0.000 abstract 1
- 229920005989 resin Polymers 0.000 abstract 1
- 239000011347 resin Substances 0.000 abstract 1
- 238000005096 rolling process Methods 0.000 abstract 1
- 238000012216 screening Methods 0.000 abstract 1
- 229910052709 silver Inorganic materials 0.000 abstract 1
- 239000004332 silver Substances 0.000 abstract 1
- 238000004544 sputter deposition Methods 0.000 abstract 1
- 229920003002 synthetic resin Polymers 0.000 abstract 1
- 239000000057 synthetic resin Substances 0.000 abstract 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/14—Structural association of two or more printed circuits
- H05K1/148—Arrangements of two or more hingeably connected rigid printed circuit boards, i.e. connected by flexible means
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/03—Conductive materials
- H05K2201/0332—Structure of the conductor
- H05K2201/0388—Other aspects of conductors
- H05K2201/0394—Conductor crossing over a hole in the substrate or a gap between two separate substrate parts
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/01—Tools for processing; Objects used during processing
- H05K2203/0195—Tool for a process not provided for in H05K3/00, e.g. tool for handling objects using suction, for deforming objects, for applying local pressure
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/403—Edge contacts; Windows or holes in the substrate having plural connections on the walls thereof
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/4092—Integral conductive tabs, i.e. conductive parts partly detached from the substrate
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Testing Of Short-Circuits, Discontinuities, Leakage, Or Incorrect Line Connections (AREA)
Abstract
1,042,331. Printed circuit assemblies. ELECTRIC & MUSICAL INDUSTRIES Ltd. Sept. 26, 1962 [Sept. 29, 1961; Oct. 26, 1961; March 10, 1962], Nos. 35059/61, 38290/61 and 9328/62. Heading H1R. In a printed circuit, a plurality of conductors adhering to insulating material bridge a gap between two portions of the insulating material to form " ladders " to whose " rungs," which are wholly exposed at the gap, electrical connections can be made. The invention is described with reference to a multi-plane word organized thin film magnetic store comprising printed digit and sense windings and coordinate address windings, the windings in different planes being connected by " ladders " which may be single or multiple, i.e. comprising a number of sets of " rungs " between parallel strips of insulation. As shown, Figs. 1, 3, a thin film magnetic store comprises four planes each carrying a plurality of rows of magnetic elements of Ni-Fe (80-20) alloy deposited on a glass substrate by evaporation, plating, sputtering &c., under the influence of an aligning magnetic field, the elements comprising discrete rectangular dots; alternatively a continuous film may be deposited. Each plane comprises a pair of glass plates 1a, 1b . . . 4a, 4b, upon the inner surfaces and front and rear edges of which are printed address windings 6. Digit input and sense output windings 5 are printed normal to the address windings on insulating plates 7 of, e.g. resin-impregnated fibreglass, in triads, Fig. 1A (not shown), each sense wire 5s lying between two digit wires 5d. Over the side edges of plates 1a . . . 4b are printed conductors 12 in groups of six, one group being allocated to each triad of digit and sense wires. The digit and sense wires are connected by two quadruple " ladders " 13 on one side of the store and by a single quadruple " ladder " 25 on the other side. The " rungs " of the ladders, or the conductors 12, are pre-tinned, and connection is effected by rolling a heated roller bit along the gaps between the insulating strips. The output from the sense windings and the connection of the digit windings are provided by a ladder 14, the insulating strips of which are folded back after connection of the rungs to conductors 12; a second ladder 24, also folded, provides for input to the digit windings and the shorting of the sense windings. The address wires 6 are connected at the rear edge of the store by double ladders 16. Since the address wires form 2-turn windings, the wires 6 at the front edge of the store are displaced by one place as between plates 1a, 1b &c., alternate wires on the plates of each plane being connected together by ladders 32. The remaining wires on the upper plate of each plane are contacted by a riser 18, and the remaining wires on the lower plate of each plane by a riser 26, the risers being formed by ladders folded so that the insulation is at right angles to the rungs. Conductors in register on risers 18, 26 are connected by ladders 8 which form vertical address bus-bars, the remaining conductors on the risers being connected in pairs by ladders 23 through diodes 10 to upper and lower horizontal bus-bars 9a, 9b (9a only shown in Fig. 1). A resistance (not shown) is also connected across each address winding. The risers which are mutually insulated pass through gaps in a copper screen 11, thr gap being broken periodically by lugs 20 to reduce the loss of screening effect. Fig. 20 (not shown) depicts how input and output conductors 133, 134, printed on flexible plastic sheets 136, 137, which are bonded together, pass across holes 139, 140 in the sheets to form tabs which are soldered to the pins of sockets 135 in a support 138 which is mounted on the frame of the store to permit the latter being inserted in a case comprising mating plugs. Modifications.-To avoid printing wires on the edges of the plates, plates 51a, 51b, Fig. 12 (not shown), of glass fibre reinforced synthetic resin are provided with slots 52a, 52b. Address conductors are printed on the plates, crossing slots 52a; a sheet of thin insulating material which does not cover the slots is placed over the address conductors and the digit wires 53d and sense wires 53s printed thereupon to cross slots 52b. Flexible sheets of glass fibre reinforced resin 54a, 54b and 55a, 55b are provided with conductors 56, 57, 58 and 59, 60, 61 which bridge gaps between pairs of sheets to form ladders as shown. Plates 54b, 55b are inserted between plates 51a, 51b, as far as the inner edges of slots 52b and digit and sense wires are soldered to registering conductors 56, 57, 60, 61 by a heated roller in slots 52b. Registering conductors in the ladders are next soldered together, after which sheets 54a, 55a may be folded as required. In Fig. 13 (not shown), digit wires 73d and sense wires 73s in two planes formed by plates 71a, 71b and 72a, 72b, are interconnected by conductors 78 . . . 85 printed in ladder form on insulating plates 74a, 74c ... 77a, 77c. Pairs of adjacent ladders, bonded together if required, are inserted between the plates of each plane and connection is effected between registering conductors through slots (not shown) in the plane plates, the shorting conductor between pairs of digit wires 73d being insulated from the ladder conductors. Registering rungs of the ladders are then connected, after which insulating strips 74c . . . 77c may be removed. Figures 18, 19A, 19B (not shown) depict methods of reducing inductive coupling between digit and sense windings. The copper screens 11 (Fig. 1) may be replaced by a conductive foil 91, Fig. 14 (not shown), adhered to an insulating bar 90 and having lugs 92 projecting upwards and downwards therefrom. An insulating film 93 insulates foil 91 from vertical conductors 94 which are soldered into holes 100 in address conductors 98 to form vertical address bus-bars; address conductors 97, 99 are connected by a ladder through diodes to horizontal bus-bars (not shown), and lugs 92 pass through slots 101 in plates 96. In a further modification, vertical bus-bars are passed through holes in the plane plates adjacent relevant tinned address wires and a current passed through bus-bars sufficient to cause fusion between bus-bars and address wires. The diodes may be connected in the centre of the address loops, a damping resistor in the form of a resistive paste being provided for each half loop. Printed circuit production.-The ladders may be formed by securing copper foil to two portions of insulating material so that it bridges a gap between the two portions, and etching away unwanted portions of copper; the remaining conductors may be thickened by electrodeposition. The foil bridging the gap may be supported by a temporary insulating support coated with a release agent. To produce printed plane plates 1a ... 4b, Fig. 1, a thin conducting, e.g. Cu, sheet 42, Fig. 10 (not shown), comprising skirts 43 is adhered to an insulating substrate 41. The whole of sheet 42 is painted with photo-resist and the assembly rotated about a vertical axis in a warm atmosphere; the edges 44 are thus uniformly coated, excess resist being collected on the skirts 43. The sheet 42 is then photo-etched in known manner, the resultant conductors being electroplated with, e.g. silver. Fig. 16 (not shown) depicts a jig for the production of pairs of plates with accurately registering conductors, comprising a transparent base 114 and three pillars 115 which define the position of two transparent sheets 116, 117. The upper plate negative is firmly bonded to sheet 116; the lower plate negative is releasably adhered to the upper plate negative after their emulsion layers have been optically aligned under a microscope; then sheet 117 is firmly bonded to the lower plate negative. The plates with their attached negatives are broken apart, and prepared laminate plates are aligned between the plates in the jig and exposed from the top and bottom. Fig. 17 (not shown) depicts an evaporation mask of annealed metal having windows, etched from both sides to avoid undercutting, through which the magnetic elements are evaporated; the elements are then given a protective coating of SiO.
Priority Applications (9)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| NL283807D NL283807A (en) | 1961-09-29 | ||
| GB16568/66A GB1042333A (en) | 1961-09-29 | 1961-09-29 | Improvements relating to thin film magnetic storage arrangements |
| GB3505961A GB1042331A (en) | 1961-09-29 | 1961-09-29 | Improvements relating to printed electric circuits and to the manufacture of such circuits |
| GB16571/66A GB1042334A (en) | 1961-09-29 | 1961-09-29 | Improvements relating to thin film magnetic storage arrangements |
| FR910811A FR1352830A (en) | 1961-09-29 | 1962-09-28 | Printed circuit manufacturing process |
| DE19621515646 DE1515646A1 (en) | 1961-09-29 | 1962-09-28 | Printed circuits, particularly for thin film magnetic memories, and processes for their manufacture |
| US226865A US3439109A (en) | 1961-09-29 | 1962-09-28 | Thin film magnetic stores using printed electric circuits |
| DE19621524833 DE1524833A1 (en) | 1961-09-29 | 1962-09-28 | Storage arrangement with magnetic thin-film material |
| US263558A US3460105A (en) | 1961-09-29 | 1963-03-07 | Thin film printed electric circuit |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| GB3505961A GB1042331A (en) | 1961-09-29 | 1961-09-29 | Improvements relating to printed electric circuits and to the manufacture of such circuits |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| GB1042331A true GB1042331A (en) | 1966-09-14 |
Family
ID=10373304
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| GB3505961A Expired GB1042331A (en) | 1961-09-29 | 1961-09-29 | Improvements relating to printed electric circuits and to the manufacture of such circuits |
Country Status (1)
| Country | Link |
|---|---|
| GB (1) | GB1042331A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112703108A (en) * | 2019-08-13 | 2021-04-23 | 法国圣戈班玻璃厂 | Composite glass pane with a double-sided sensor arrangement |
-
1961
- 1961-09-29 GB GB3505961A patent/GB1042331A/en not_active Expired
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112703108A (en) * | 2019-08-13 | 2021-04-23 | 法国圣戈班玻璃厂 | Composite glass pane with a double-sided sensor arrangement |
| CN112703108B (en) * | 2019-08-13 | 2023-09-08 | 法国圣戈班玻璃厂 | Composite glass panel with double-sided sensor arrangement |
| US12327700B2 (en) | 2019-08-13 | 2025-06-10 | Saint-Gobain Glass France | Composite panel with a sensor assembly on both sides |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US3718936A (en) | Electrostatic matrix head construction | |
| US3077511A (en) | Printed circuit unit | |
| US3903594A (en) | Method of making electrographic recording heads employing printed circuit techniques | |
| US2774014A (en) | Modular electronic assembly | |
| US3029495A (en) | Electrical interconnection of miniaturized modules | |
| US3105869A (en) | Electrical connection of microminiature circuit wafers | |
| US2850681A (en) | Subminiature structure for electrical apparatus | |
| JP2632992B2 (en) | Method for producing electronic module circuit tape and tape obtained by this method | |
| US3334325A (en) | Reference plane card connector system | |
| US3460105A (en) | Thin film printed electric circuit | |
| US4401521A (en) | Method for manufacturing a fine-patterned thick film conductor structure | |
| US3711626A (en) | Circuit board | |
| US5877669A (en) | Flyback transformer having a flexible coil winding structure and manufacturing process thereof | |
| US4992059A (en) | Ultra fine line cable and a method for fabricating the same | |
| US3688396A (en) | Circuit board process | |
| GB1042331A (en) | Improvements relating to printed electric circuits and to the manufacture of such circuits | |
| US3697816A (en) | Electric network and method of making same | |
| JPS58184751A (en) | Film support for integrated circuit | |
| US3428954A (en) | Element for resistive permanent memory | |
| US3644661A (en) | Double-sided circuit having terminal-receiving portions | |
| US3626081A (en) | Sandwich-type voltage and ground plane | |
| US3629939A (en) | Multilayer core memory process | |
| US3561113A (en) | Method for making rheostats | |
| US5877668A (en) | Flyback transformer having a flexible coil winding structure and manufacturing process thereof | |
| US20020146547A1 (en) | End electrode structure of surface adhesive over-current protection device and its manufacturing process |