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FR3153491B1 - Printed circuit board manufacturing process - Google Patents

Printed circuit board manufacturing process

Info

Publication number
FR3153491B1
FR3153491B1 FR2310289A FR2310289A FR3153491B1 FR 3153491 B1 FR3153491 B1 FR 3153491B1 FR 2310289 A FR2310289 A FR 2310289A FR 2310289 A FR2310289 A FR 2310289A FR 3153491 B1 FR3153491 B1 FR 3153491B1
Authority
FR
France
Prior art keywords
circuit board
printed circuit
sheet
manufacturing process
epoxy resin
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
FR2310289A
Other languages
French (fr)
Other versions
FR3153491A1 (en
Inventor
Patrice Glaris
Jiating He
Sebastien Germain
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Linxens Holding SAS
Original Assignee
Linxens Holding SAS
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Linxens Holding SAS filed Critical Linxens Holding SAS
Priority to FR2310289A priority Critical patent/FR3153491B1/en
Priority to PCT/EP2024/076969 priority patent/WO2025068311A1/en
Publication of FR3153491A1 publication Critical patent/FR3153491A1/en
Application granted granted Critical
Publication of FR3153491B1 publication Critical patent/FR3153491B1/en
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
    • H05K1/0373—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement containing additives, e.g. fillers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/032—Organic insulating material consisting of one material
    • H05K1/0326—Organic insulating material consisting of one material containing O
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0393—Flexible materials
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
    • H05K2201/0203—Fillers and particles
    • H05K2201/0206—Materials
    • H05K2201/0209—Inorganic, non-metallic particles
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/15—Position of the PCB during processing
    • H05K2203/1545—Continuous processing, i.e. involving rolls moving a band-like or solid carrier along a continuous production path
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Non-Metallic Protective Coatings For Printed Circuits (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Laminated Bodies (AREA)

Abstract

Procédé de fabrication d’un circuit imprimé, comprenant les opérations consistant à :- fournir en continu d’une feuille de matériau électriquement conducteur (1), à- enduire en continu au moins une couche de matériau électriquement isolant (2) sur au moins une zone de la surface de l’une des faces de la feuille de matériau électriquement conducteur (1), ce matériau électriquement isolant (2) comprenant au moins une résine époxy, à- photopolymériser en continu au moins certaines régions de la résine époxy sous rayonnement UV, et à- réaliser au moins un motif par photolithogravure dans la feuille de matériau électriquement conducteur (1), ce motif étant supporté par de la résine époxy photopolymérisée. Fig. 4A method for manufacturing a printed circuit board, comprising the steps of: - continuously feeding a sheet of electrically conductive material (1), - continuously coating at least one layer of electrically insulating material (2) on at least one area of the surface of one face of the sheet of electrically conductive material (1), this electrically insulating material (2) comprising at least one epoxy resin, - continuously photopolymerizing at least certain regions of the epoxy resin under UV radiation, and - producing at least one pattern by photolithography in the sheet of electrically conductive material (1), this pattern being supported by photopolymerized epoxy resin. Fig. 4

FR2310289A 2023-09-27 2023-09-27 Printed circuit board manufacturing process Active FR3153491B1 (en)

Priority Applications (2)

Application Number Priority Date Filing Date Title
FR2310289A FR3153491B1 (en) 2023-09-27 2023-09-27 Printed circuit board manufacturing process
PCT/EP2024/076969 WO2025068311A1 (en) 2023-09-27 2024-09-25 Method for manufacturing printed circuit boards

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
FR2310289 2023-09-27
FR2310289A FR3153491B1 (en) 2023-09-27 2023-09-27 Printed circuit board manufacturing process

Publications (2)

Publication Number Publication Date
FR3153491A1 FR3153491A1 (en) 2025-03-28
FR3153491B1 true FR3153491B1 (en) 2025-12-12

Family

ID=89308077

Family Applications (1)

Application Number Title Priority Date Filing Date
FR2310289A Active FR3153491B1 (en) 2023-09-27 2023-09-27 Printed circuit board manufacturing process

Country Status (2)

Country Link
FR (1) FR3153491B1 (en)
WO (1) WO2025068311A1 (en)

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001302743A (en) * 2000-04-25 2001-10-31 Nippon Kayaku Co Ltd Resin composition, solder-resist resin composition and their curing materials
US6500349B2 (en) * 2000-12-26 2002-12-31 Oak-Mitsui, Inc. Manufacture of printed circuits using single layer processing techniques
JP2010528181A (en) * 2007-05-24 2010-08-19 ビーエーエスエフ ソシエタス・ヨーロピア Method for producing polymer-coated metal foil and method of use thereof

Also Published As

Publication number Publication date
FR3153491A1 (en) 2025-03-28
WO2025068311A1 (en) 2025-04-03

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