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FR3039025B1 - WELDING PROCESS WITH MATERIAL SUPPLY AND ELECTRONIC POWER MODULE MADE THEREBY - Google Patents

WELDING PROCESS WITH MATERIAL SUPPLY AND ELECTRONIC POWER MODULE MADE THEREBY Download PDF

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Publication number
FR3039025B1
FR3039025B1 FR1556690A FR1556690A FR3039025B1 FR 3039025 B1 FR3039025 B1 FR 3039025B1 FR 1556690 A FR1556690 A FR 1556690A FR 1556690 A FR1556690 A FR 1556690A FR 3039025 B1 FR3039025 B1 FR 3039025B1
Authority
FR
France
Prior art keywords
power module
welding process
material supply
electronic power
module made
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
FR1556690A
Other languages
French (fr)
Other versions
FR3039025A1 (en
Inventor
Ky Lim Tan
Jean-Michel Morelle
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Valeo Equipements Electriques Moteur SAS
Original Assignee
Valeo Equipements Electriques Moteur SAS
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Valeo Equipements Electriques Moteur SAS filed Critical Valeo Equipements Electriques Moteur SAS
Priority to FR1556690A priority Critical patent/FR3039025B1/en
Priority to EP16750967.8A priority patent/EP3323144A1/en
Priority to PCT/FR2016/051833 priority patent/WO2017009586A1/en
Publication of FR3039025A1 publication Critical patent/FR3039025A1/en
Application granted granted Critical
Publication of FR3039025B1 publication Critical patent/FR3039025B1/en
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • H10W70/417—
    • H10W70/481—
    • H10W40/255—
    • H10W72/01323—
    • H10W72/01336—
    • H10W72/07141—
    • H10W72/07178—
    • H10W72/073—
    • H10W72/07331—
    • H10W72/07332—
    • H10W72/07333—
    • H10W72/07554—
    • H10W72/325—
    • H10W72/352—
    • H10W72/884—
    • H10W72/952—
    • H10W74/00—
    • H10W90/734—
    • H10W90/736—
    • H10W90/756—
FR1556690A 2015-07-16 2015-07-16 WELDING PROCESS WITH MATERIAL SUPPLY AND ELECTRONIC POWER MODULE MADE THEREBY Active FR3039025B1 (en)

Priority Applications (3)

Application Number Priority Date Filing Date Title
FR1556690A FR3039025B1 (en) 2015-07-16 2015-07-16 WELDING PROCESS WITH MATERIAL SUPPLY AND ELECTRONIC POWER MODULE MADE THEREBY
EP16750967.8A EP3323144A1 (en) 2015-07-16 2016-07-18 Brazing process involving sintering a conductive powder by ultrasonic thermocompression and electronic power module produced by this process
PCT/FR2016/051833 WO2017009586A1 (en) 2015-07-16 2016-07-18 Brazing process involving sintering a conductive powder by ultrasonic thermocompression and electronic power module produced by this process

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
FR1556690A FR3039025B1 (en) 2015-07-16 2015-07-16 WELDING PROCESS WITH MATERIAL SUPPLY AND ELECTRONIC POWER MODULE MADE THEREBY
FR1556690 2015-07-16

Publications (2)

Publication Number Publication Date
FR3039025A1 FR3039025A1 (en) 2017-01-20
FR3039025B1 true FR3039025B1 (en) 2018-03-09

Family

ID=54291459

Family Applications (1)

Application Number Title Priority Date Filing Date
FR1556690A Active FR3039025B1 (en) 2015-07-16 2015-07-16 WELDING PROCESS WITH MATERIAL SUPPLY AND ELECTRONIC POWER MODULE MADE THEREBY

Country Status (3)

Country Link
EP (1) EP3323144A1 (en)
FR (1) FR3039025B1 (en)
WO (1) WO2017009586A1 (en)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN109759742B (en) * 2019-03-13 2024-03-26 重庆理工大学 Solder for soldering flux-free and soldering method

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000306957A (en) * 1999-04-21 2000-11-02 Tdk Corp Ultrasonic bonding mounting method and ultrasonic bonding apparatus
JP4362742B2 (en) * 2005-09-22 2009-11-11 ニホンハンダ株式会社 Method for solidifying paste-like metal particle composition, method for joining metal members, and method for producing printed wiring board
JP4638382B2 (en) * 2006-06-05 2011-02-23 田中貴金属工業株式会社 Joining method
JP4247801B2 (en) * 2006-11-24 2009-04-02 ニホンハンダ株式会社 Paste-like metal particle composition and joining method
JP5012239B2 (en) * 2007-06-13 2012-08-29 株式会社デンソー Joining method and joined body
US8513534B2 (en) * 2008-03-31 2013-08-20 Hitachi, Ltd. Semiconductor device and bonding material
DE102008050798A1 (en) * 2008-10-08 2010-04-15 Infineon Technologies Ag Method for positioning and fixing e.g. semiconductor chip, on e.g. direct copper Bonding substrate, involves pressing components together such that electrical connection and mechanical fixing of components are obtained
WO2013185839A1 (en) * 2012-06-15 2013-12-19 Osram Opto Semiconductors Gmbh Method for producing an optoelectronic semiconductor device comprising a connecting layer sintered under the action of heat, pressure and ultrasound
DE102013208387A1 (en) * 2013-05-07 2014-11-13 Robert Bosch Gmbh Silver composite sintered pastes for low temperature sintered joints

Also Published As

Publication number Publication date
EP3323144A1 (en) 2018-05-23
FR3039025A1 (en) 2017-01-20
WO2017009586A1 (en) 2017-01-19

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