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FR3028665B1 - Assemblage d'un composant plan sur un support plan - Google Patents

Assemblage d'un composant plan sur un support plan Download PDF

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Publication number
FR3028665B1
FR3028665B1 FR1461139A FR1461139A FR3028665B1 FR 3028665 B1 FR3028665 B1 FR 3028665B1 FR 1461139 A FR1461139 A FR 1461139A FR 1461139 A FR1461139 A FR 1461139A FR 3028665 B1 FR3028665 B1 FR 3028665B1
Authority
FR
France
Prior art keywords
support
component
plan
assembly
perimeter
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
FR1461139A
Other languages
English (en)
Other versions
FR3028665A1 (fr
Inventor
Frederic Perratone
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Ulis SAS
Original Assignee
Ulis SAS
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ulis SAS filed Critical Ulis SAS
Priority to FR1461139A priority Critical patent/FR3028665B1/fr
Publication of FR3028665A1 publication Critical patent/FR3028665A1/fr
Application granted granted Critical
Publication of FR3028665B1 publication Critical patent/FR3028665B1/fr
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F39/00—Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
    • H10F39/80—Constructional details of image sensors
    • H10F39/804—Containers or encapsulations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F77/00—Constructional details of devices covered by this subclass
    • H10F77/50—Encapsulations or containers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/01—Manufacture or treatment
    • H10H20/036—Manufacture or treatment of packages
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/01—Manufacture or treatment
    • H10H20/036—Manufacture or treatment of packages
    • H10H20/0363—Manufacture or treatment of packages of optical field-shaping means
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/855—Optical field-shaping means, e.g. lenses
    • H10W72/01308—
    • H10W72/073—
    • H10W72/07327—
    • H10W72/07336—
    • H10W72/07338—
    • H10W72/352—
    • H10W72/354—
    • H10W72/5522—
    • H10W72/5524—

Landscapes

  • Solid State Image Pick-Up Elements (AREA)
  • Die Bonding (AREA)
  • Automatic Assembly (AREA)

Abstract

Ce procédé d'assemblage d'un composant plan sur un support plan (16), comprend : - la définition, sur le support (16), d'un périmètre (52) centré sur une position souhaitée du composant et apte à encadrer le composant lorsque ce dernier est positionné sur le support (16) dans sa position souhaitée ; - la réalisation, sur le périmètre (52), d'au moins une première paire de butées (54) et d'une deuxième paire de butées (54) ; - le report dans le périmètre (52) du composant sur le support (16); et - la fixation du composant sur le support (16) La formation d'au moins une butée (54) sur le support (16) comprend la fixation d'un filsur le périmètre (52) de manière à former au moins une boucle (54) faisant saillie du support (16).
FR1461139A 2014-11-18 2014-11-18 Assemblage d'un composant plan sur un support plan Active FR3028665B1 (fr)

Priority Applications (1)

Application Number Priority Date Filing Date Title
FR1461139A FR3028665B1 (fr) 2014-11-18 2014-11-18 Assemblage d'un composant plan sur un support plan

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
FR1461139A FR3028665B1 (fr) 2014-11-18 2014-11-18 Assemblage d'un composant plan sur un support plan

Publications (2)

Publication Number Publication Date
FR3028665A1 FR3028665A1 (fr) 2016-05-20
FR3028665B1 true FR3028665B1 (fr) 2021-11-26

Family

ID=52737204

Family Applications (1)

Application Number Title Priority Date Filing Date
FR1461139A Active FR3028665B1 (fr) 2014-11-18 2014-11-18 Assemblage d'un composant plan sur un support plan

Country Status (1)

Country Link
FR (1) FR3028665B1 (fr)

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9147665B2 (en) * 2007-11-06 2015-09-29 Fairchild Semiconductor Corporation High bond line thickness for semiconductor devices
JP5217013B2 (ja) * 2008-01-11 2013-06-19 日産自動車株式会社 電力変換装置およびその製造方法
CN102859671A (zh) * 2010-12-03 2013-01-02 富士电机株式会社 半导体器件以及半导体器件的制造方法

Also Published As

Publication number Publication date
FR3028665A1 (fr) 2016-05-20

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