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FR3010925B1 - Procede de traitement d'une piece - Google Patents

Procede de traitement d'une piece

Info

Publication number
FR3010925B1
FR3010925B1 FR1459022A FR1459022A FR3010925B1 FR 3010925 B1 FR3010925 B1 FR 3010925B1 FR 1459022 A FR1459022 A FR 1459022A FR 1459022 A FR1459022 A FR 1459022A FR 3010925 B1 FR3010925 B1 FR 3010925B1
Authority
FR
France
Prior art keywords
processing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
FR1459022A
Other languages
English (en)
Other versions
FR3010925A1 (fr
Inventor
Yasuyoshi Yubira
Tasuku Koyanagi
Koichi Katayama
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Disco Corp
Original Assignee
Disco Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Disco Corp filed Critical Disco Corp
Publication of FR3010925A1 publication Critical patent/FR3010925A1/fr
Application granted granted Critical
Publication of FR3010925B1 publication Critical patent/FR3010925B1/fr
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • H10P34/42—
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/40—Removing material taking account of the properties of the material involved
    • B23K26/402—Removing material taking account of the properties of the material involved involving non-metallic material, e.g. isolators
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/50—Working by transmitting the laser beam through or within the workpiece
    • B23K26/53—Working by transmitting the laser beam through or within the workpiece for modifying or reforming the material inside the workpiece, e.g. for producing break initiation cracks
    • H10P54/00—
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2103/00—Materials to be soldered, welded or cut
    • B23K2103/50—Inorganic material, e.g. metals, not provided for in B23K2103/02 – B23K2103/26
    • B23K2103/56—Inorganic material, e.g. metals, not provided for in B23K2103/02 – B23K2103/26 semiconducting

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Plasma & Fusion (AREA)
  • Mechanical Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • General Chemical & Material Sciences (AREA)
  • Oil, Petroleum & Natural Gas (AREA)
  • Laser Beam Processing (AREA)
  • Dicing (AREA)
FR1459022A 2013-09-26 2014-09-24 Procede de traitement d'une piece Active FR3010925B1 (fr)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2013199914A JP2015069975A (ja) 2013-09-26 2013-09-26 被加工物の加工方法

Publications (2)

Publication Number Publication Date
FR3010925A1 FR3010925A1 (fr) 2015-03-27
FR3010925B1 true FR3010925B1 (fr) 2018-09-07

Family

ID=52623827

Family Applications (1)

Application Number Title Priority Date Filing Date
FR1459022A Active FR3010925B1 (fr) 2013-09-26 2014-09-24 Procede de traitement d'une piece

Country Status (3)

Country Link
JP (1) JP2015069975A (fr)
DE (1) DE102014218759A1 (fr)
FR (1) FR3010925B1 (fr)

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6572032B2 (ja) * 2015-07-09 2019-09-04 株式会社ディスコ ウェーハの加工方法
CN106312337B (zh) * 2016-09-19 2018-10-02 武汉帝尔激光科技股份有限公司 一种晶硅太阳能电池片激光切半机
JP6925717B2 (ja) * 2017-06-05 2021-08-25 株式会社ディスコ チップの製造方法
JP6925719B2 (ja) * 2017-06-05 2021-08-25 株式会社ディスコ チップの製造方法
JP6925718B2 (ja) * 2017-06-05 2021-08-25 株式会社ディスコ チップの製造方法
JP7031967B2 (ja) * 2017-08-22 2022-03-08 株式会社ディスコ チップの製造方法
JP7031968B2 (ja) * 2017-08-22 2022-03-08 株式会社ディスコ チップの製造方法
DE102018003675A1 (de) * 2018-05-04 2019-11-07 Siltectra Gmbh Verfahren zum Abtrennen von Festkörperschichten von Kompositstrukturen aus SiC und einer metallischen Beschichtung oder elektrischen Bauteilen
JP7370881B2 (ja) * 2020-01-24 2023-10-30 株式会社ディスコ ウエーハ加工方法、及びウエーハ加工装置
JP7558666B2 (ja) * 2020-03-02 2024-10-01 株式会社東京精密 エッチング処理後シリコンウェハの表面改質の方法

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003088975A (ja) * 2001-09-12 2003-03-25 Hamamatsu Photonics Kk レーザ加工方法
JP2005142303A (ja) * 2003-11-05 2005-06-02 Disco Abrasive Syst Ltd シリコンウエーハの分割方法および分割装置
JP4733934B2 (ja) * 2004-06-22 2011-07-27 株式会社ディスコ ウエーハの加工方法
JP2006229021A (ja) 2005-02-18 2006-08-31 Disco Abrasive Syst Ltd ウエーハの分割方法
JP2011156582A (ja) * 2010-02-03 2011-08-18 Disco Abrasive Syst Ltd Ｃｏ２レーザによる分割方法
JP2011165766A (ja) * 2010-02-05 2011-08-25 Disco Abrasive Syst Ltd 光デバイスウエーハの加工方法
JP2011183434A (ja) * 2010-03-09 2011-09-22 Mitsuboshi Diamond Industrial Co Ltd レーザ加工方法
US10239160B2 (en) * 2011-09-21 2019-03-26 Coherent, Inc. Systems and processes that singulate materials

Also Published As

Publication number Publication date
FR3010925A1 (fr) 2015-03-27
JP2015069975A (ja) 2015-04-13
DE102014218759A1 (de) 2015-03-26

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