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FR3079645B1 - Document electronique dont une liaison electrique entre un port de puce et une plage externe de contact electrique est etablie via un inlay - Google Patents

Document electronique dont une liaison electrique entre un port de puce et une plage externe de contact electrique est etablie via un inlay Download PDF

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Publication number
FR3079645B1
FR3079645B1 FR1852867A FR1852867A FR3079645B1 FR 3079645 B1 FR3079645 B1 FR 3079645B1 FR 1852867 A FR1852867 A FR 1852867A FR 1852867 A FR1852867 A FR 1852867A FR 3079645 B1 FR3079645 B1 FR 3079645B1
Authority
FR
France
Prior art keywords
inlay
electronic document
electrical contact
established via
contact range
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
FR1852867A
Other languages
English (en)
Other versions
FR3079645A1 (fr
Inventor
Francois Launay
Mickael Huet
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Idemia France SAS
Original Assignee
Idemia France SAS
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Idemia France SAS filed Critical Idemia France SAS
Priority to FR1852867A priority Critical patent/FR3079645B1/fr
Priority to US16/373,077 priority patent/US10719754B2/en
Publication of FR3079645A1 publication Critical patent/FR3079645A1/fr
Application granted granted Critical
Publication of FR3079645B1 publication Critical patent/FR3079645B1/fr
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • GPHYSICS
    • G06COMPUTING OR CALCULATING; COUNTING
    • G06KGRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07745Mounting details of integrated circuit chips
    • GPHYSICS
    • G06COMPUTING OR CALCULATING; COUNTING
    • G06KGRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07745Mounting details of integrated circuit chips
    • G06K19/07747Mounting details of integrated circuit chips at least one of the integrated circuit chips being mounted as a module
    • GPHYSICS
    • G06COMPUTING OR CALCULATING; COUNTING
    • G06KGRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07749Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
    • G06K19/0775Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card arrangements for connecting the integrated circuit to the antenna
    • G06K19/07754Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card arrangements for connecting the integrated circuit to the antenna the connection being galvanic
    • GPHYSICS
    • G06COMPUTING OR CALCULATING; COUNTING
    • G06KGRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07749Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
    • G06K19/07766Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card comprising at least a second communication arrangement in addition to a first non-contact communication arrangement
    • G06K19/07769Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card comprising at least a second communication arrangement in addition to a first non-contact communication arrangement the further communication means being a galvanic interface, e.g. hybrid or mixed smart cards having a contact and a non-contact interface
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01QANTENNAS, i.e. RADIO AERIALS
    • H01Q1/00Details of, or arrangements associated with, antennas
    • H01Q1/12Supports; Mounting means
    • H01Q1/22Supports; Mounting means by structural association with other equipment or articles
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01QANTENNAS, i.e. RADIO AERIALS
    • H01Q1/00Details of, or arrangements associated with, antennas
    • H01Q1/36Structural form of radiating elements, e.g. cone, spiral, umbrella; Particular materials used therewith
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/02Details
    • H05K1/11Printed elements for providing electric connections to or between printed circuits
    • H05K1/111Pads for surface mounting, e.g. lay-out
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/02Details
    • H05K1/11Printed elements for providing electric connections to or between printed circuits
    • H05K1/115Via connections; Lands around holes or via connections
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/18Printed circuits structurally associated with non-printed electric components
    • H05K1/181Printed circuits structurally associated with non-printed electric components associated with surface mounted components

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Theoretical Computer Science (AREA)
  • Combinations Of Printed Boards (AREA)
  • Coupling Device And Connection With Printed Circuit (AREA)
  • Multi-Conductor Connections (AREA)

Abstract

La présente demande concerne un document électronique dont un corps comporte un inlay (Yc, Yd), dont une partie forme un lamage (Cav1) d'une cavité, et qui comporte une plage de connexion (PFc, PCc, PFc1, PFc2, PCc1, PCc2) réalisée sur la partie formant le lamage (Cav1), et dont un module comporte un circuit électrique qui comporte d'une part un premier sous-circuit configuré pour connecter électriquement un port (IO) d'une puce (MP) à la plage de connexion (PFc, PCc, PFc1, PFc2, PCc1, PCc2) et d'autre part un deuxième sous-circuit configuré pour connecter électriquement la plage de connexion (PFc, PCc, PFc1, PFc2, PCc1, PCc2) à une plage externe de contact électrique (C7) d'un support (S) du module (Modc, Modd).
FR1852867A 2018-04-03 2018-04-03 Document electronique dont une liaison electrique entre un port de puce et une plage externe de contact electrique est etablie via un inlay Active FR3079645B1 (fr)

Priority Applications (2)

Application Number Priority Date Filing Date Title
FR1852867A FR3079645B1 (fr) 2018-04-03 2018-04-03 Document electronique dont une liaison electrique entre un port de puce et une plage externe de contact electrique est etablie via un inlay
US16/373,077 US10719754B2 (en) 2018-04-03 2019-04-02 Electronic document having an electrical connection between a chip port and an external electrical connection land that is established via an inlay

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
FR1852867 2018-04-03
FR1852867A FR3079645B1 (fr) 2018-04-03 2018-04-03 Document electronique dont une liaison electrique entre un port de puce et une plage externe de contact electrique est etablie via un inlay

Publications (2)

Publication Number Publication Date
FR3079645A1 FR3079645A1 (fr) 2019-10-04
FR3079645B1 true FR3079645B1 (fr) 2021-09-24

Family

ID=63407296

Family Applications (1)

Application Number Title Priority Date Filing Date
FR1852867A Active FR3079645B1 (fr) 2018-04-03 2018-04-03 Document electronique dont une liaison electrique entre un port de puce et une plage externe de contact electrique est etablie via un inlay

Country Status (2)

Country Link
US (1) US10719754B2 (fr)
FR (1) FR3079645B1 (fr)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR3073307B1 (fr) * 2017-11-08 2021-05-28 Oberthur Technologies Dispositif de securite tel qu'une carte a puce
FR3099268B1 (fr) 2019-07-22 2023-04-28 Idemia France Module de document électronique comportant une puce et une interface de contact avec une antenne connectée à un port I/O de la puce, document électronique comportant un tel module et procédé de vérification d’une connexion entre le module et une antenne correspondant
US12300893B2 (en) * 2020-03-31 2025-05-13 3M Innovative Properties Company Antenna assemblies
FR3136871B1 (fr) * 2022-06-16 2025-07-11 Idemia France Inlay pour document électronique, procédé de fabrication d’un document électronique comportant un tel inlay, et document électronique obtenu
FR3163754A1 (fr) * 2024-06-20 2025-12-26 Smart Packaging Solutions Procédé de fabrication d’une carte à puce.

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2769390B1 (fr) * 1997-10-08 2003-02-14 Gemplus Card Int Procede de fabrication de cartes a puce aptes a assurer un fonctionnement a contact et sans contact, et de cartes a puce sans contact
FR2857483B1 (fr) 2003-07-11 2005-10-07 Oberthur Card Syst Sa Carte a puce anti-intrusion
FR2872945B1 (fr) * 2004-07-07 2007-01-12 Oberthur Card Syst Sa Entite electronique comportant une antenne, inlay et module pour une telle entite
HK1109708A2 (zh) * 2007-04-24 2008-06-13 On Track Innovations Ltd. 介面卡及仪器以及其形成工艺
FR2937448B1 (fr) * 2008-10-17 2012-11-16 Oberthur Technologies Module, carte a microcircuit et procede de fabrication correspondant.
CN102426659B (zh) * 2011-11-03 2014-12-10 北京德鑫泉物联网科技股份有限公司 同时具有两种读写模式基体的智能卡及其生产方法
DE102012211546B4 (de) * 2012-07-03 2017-02-16 Morpho Cards Gmbh Chipkarte mit bei Raumtemperatur pastenförmiger oder flüssiger Kontaktierung
EP2722795A1 (fr) * 2012-10-19 2014-04-23 Gemalto SA Procédé de fabrication d'un dispositif multi-composants comprenant un module électrique et/ou électronique
US10318852B2 (en) * 2014-11-10 2019-06-11 Golden Spring Internet Of Things Inc. Smart card simultaneously having two read/write modes and method for producing same
EP3151167B1 (fr) 2015-09-30 2020-05-20 Nxp B.V. Module de carte à circuit intégré double interface

Also Published As

Publication number Publication date
FR3079645A1 (fr) 2019-10-04
US20190303738A1 (en) 2019-10-03
US10719754B2 (en) 2020-07-21

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