FR2978601B1 - METHOD FOR MANUFACTURING GAN SUBSTRATE OR GAN-BASED DEVICE ON NATIVE GAN-TYPE SUBSTRATE USING SACRIFICIAL STAMP LAYER - Google Patents
METHOD FOR MANUFACTURING GAN SUBSTRATE OR GAN-BASED DEVICE ON NATIVE GAN-TYPE SUBSTRATE USING SACRIFICIAL STAMP LAYERInfo
- Publication number
- FR2978601B1 FR2978601B1 FR1156994A FR1156994A FR2978601B1 FR 2978601 B1 FR2978601 B1 FR 2978601B1 FR 1156994 A FR1156994 A FR 1156994A FR 1156994 A FR1156994 A FR 1156994A FR 2978601 B1 FR2978601 B1 FR 2978601B1
- Authority
- FR
- France
- Prior art keywords
- gan
- substrate
- sacrificial
- native
- based device
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Classifications
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- H10P14/24—
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/01—Manufacture or treatment
- H10H20/011—Manufacture or treatment of bodies, e.g. forming semiconductor layers
- H10H20/018—Bonding of wafers
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- H10P14/22—
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- H10P14/2908—
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- H10P14/3202—
-
- H10P14/3226—
-
- H10P14/3416—
-
- H10P14/38—
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/01—Manufacture or treatment
- H10H20/011—Manufacture or treatment of bodies, e.g. forming semiconductor layers
- H10H20/013—Manufacture or treatment of bodies, e.g. forming semiconductor layers having light-emitting regions comprising only Group III-V materials
- H10H20/0137—Manufacture or treatment of bodies, e.g. forming semiconductor layers having light-emitting regions comprising only Group III-V materials the light-emitting regions comprising nitride materials
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| FR1156994A FR2978601B1 (en) | 2011-07-29 | 2011-07-29 | METHOD FOR MANUFACTURING GAN SUBSTRATE OR GAN-BASED DEVICE ON NATIVE GAN-TYPE SUBSTRATE USING SACRIFICIAL STAMP LAYER |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| FR1156994A FR2978601B1 (en) | 2011-07-29 | 2011-07-29 | METHOD FOR MANUFACTURING GAN SUBSTRATE OR GAN-BASED DEVICE ON NATIVE GAN-TYPE SUBSTRATE USING SACRIFICIAL STAMP LAYER |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| FR2978601A1 FR2978601A1 (en) | 2013-02-01 |
| FR2978601B1 true FR2978601B1 (en) | 2016-05-13 |
Family
ID=44741605
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| FR1156994A Active FR2978601B1 (en) | 2011-07-29 | 2011-07-29 | METHOD FOR MANUFACTURING GAN SUBSTRATE OR GAN-BASED DEVICE ON NATIVE GAN-TYPE SUBSTRATE USING SACRIFICIAL STAMP LAYER |
Country Status (1)
| Country | Link |
|---|---|
| FR (1) | FR2978601B1 (en) |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US9231053B2 (en) | 2013-06-25 | 2016-01-05 | Honeywell International Inc. | Light emitting diodes having zinc oxide fibers over silicon substrates |
| US9419081B2 (en) | 2014-08-21 | 2016-08-16 | Honeywell International Inc. | Reusable substrate bases, semiconductor devices using such reusable substrate bases, and methods for making the reusable substrate bases |
| GB201814192D0 (en) * | 2018-08-31 | 2018-10-17 | Univ Bristol | A semiconductor on diamond substrate, percursor for use in preparing a semiconductor on diamond substrate, and methods of making the same |
| FR3162910A1 (en) * | 2024-06-03 | 2025-12-05 | David.J Rogers | Method for detaching an epitaxial layer from its growth substrate by laser pre-ablation of the sacrificial buffer layer |
Family Cites Families (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2005001928A (en) * | 2003-06-11 | 2005-01-06 | Fujikura Ltd | Self-standing substrate and manufacturing method thereof |
| KR100638869B1 (en) * | 2005-06-21 | 2006-10-27 | 삼성전기주식회사 | A method of forming a nitride compound layer and a method of manufacturing a BAN substrate and a vertical structure nitride semiconductor light emitting device using the same |
| JPWO2007023911A1 (en) * | 2005-08-25 | 2009-03-26 | 株式会社 東北テクノアーチ | Semiconductor substrate manufacturing method |
| TW200912053A (en) * | 2007-09-14 | 2009-03-16 | Sino American Silicon Prod Inc | Method of fabricating semiconductor substrate by use of heterogeneous substrate and recycling heterogeneous substrate during fabrication thereof |
-
2011
- 2011-07-29 FR FR1156994A patent/FR2978601B1/en active Active
Also Published As
| Publication number | Publication date |
|---|---|
| FR2978601A1 (en) | 2013-02-01 |
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