FR2963159B1 - METHODS OF FORMING BOUND SEMICONDUCTOR STRUCTURES, AND SEMICONDUCTOR STRUCTURES FORMED THEREFROM - Google Patents
METHODS OF FORMING BOUND SEMICONDUCTOR STRUCTURES, AND SEMICONDUCTOR STRUCTURES FORMED THEREFROM Download PDFInfo
- Publication number
- FR2963159B1 FR2963159B1 FR1055965A FR1055965A FR2963159B1 FR 2963159 B1 FR2963159 B1 FR 2963159B1 FR 1055965 A FR1055965 A FR 1055965A FR 1055965 A FR1055965 A FR 1055965A FR 2963159 B1 FR2963159 B1 FR 2963159B1
- Authority
- FR
- France
- Prior art keywords
- semiconductor structures
- methods
- formed therefrom
- forming bound
- structures formed
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Classifications
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- H10P72/74—
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- H10W90/00—
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- H10P72/7416—
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- H10P72/7434—
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- H10W74/15—
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- H10W90/297—
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- H10W90/722—
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- H10W90/732—
Priority Applications (5)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| FR1055965A FR2963159B1 (en) | 2010-07-21 | 2010-07-21 | METHODS OF FORMING BOUND SEMICONDUCTOR STRUCTURES, AND SEMICONDUCTOR STRUCTURES FORMED THEREFROM |
| SG2011042017A SG177816A1 (en) | 2010-07-15 | 2011-06-09 | Methods of forming bonded semiconductor structures, and semiconductor structures formed by such methods |
| TW100121505A TWI464810B (en) | 2010-07-15 | 2011-06-20 | Method of forming a bonded semiconductor structure and semiconductor structure formed by the method |
| KR1020110060306A KR101238732B1 (en) | 2010-07-15 | 2011-06-21 | Methods of forming bonded semiconductor structures, and semiconductor structures formed by such methods |
| CN201110197168.2A CN102339768B (en) | 2010-07-15 | 2011-07-14 | Methods of forming bonded semiconductor structures, and semiconductor structures formed by such methods |
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| FR1055965 | 2010-07-21 | ||
| FR1055965A FR2963159B1 (en) | 2010-07-21 | 2010-07-21 | METHODS OF FORMING BOUND SEMICONDUCTOR STRUCTURES, AND SEMICONDUCTOR STRUCTURES FORMED THEREFROM |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| FR2963159A1 FR2963159A1 (en) | 2012-01-27 |
| FR2963159B1 true FR2963159B1 (en) | 2018-01-19 |
Family
ID=43735073
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| FR1055965A Active FR2963159B1 (en) | 2010-07-15 | 2010-07-21 | METHODS OF FORMING BOUND SEMICONDUCTOR STRUCTURES, AND SEMICONDUCTOR STRUCTURES FORMED THEREFROM |
Country Status (1)
| Country | Link |
|---|---|
| FR (1) | FR2963159B1 (en) |
Family Cites Families (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| FR2781925B1 (en) * | 1998-07-30 | 2001-11-23 | Commissariat Energie Atomique | SELECTIVE TRANSFER OF ELEMENTS FROM ONE MEDIUM TO ANOTHER MEDIUM |
| US6902987B1 (en) * | 2000-02-16 | 2005-06-07 | Ziptronix, Inc. | Method for low temperature bonding and bonded structure |
| AU2003297542A1 (en) * | 2002-12-31 | 2004-07-29 | Massachusetts Institute Of Technology | Method of forming a multi-layer semiconductor structure incorporating a processing handle member |
| FR2880189B1 (en) * | 2004-12-24 | 2007-03-30 | Tracit Technologies Sa | METHOD FOR DEFERRING A CIRCUIT ON A MASS PLAN |
| JP5512102B2 (en) * | 2007-08-24 | 2014-06-04 | 本田技研工業株式会社 | Semiconductor device |
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2010
- 2010-07-21 FR FR1055965A patent/FR2963159B1/en active Active
Also Published As
| Publication number | Publication date |
|---|---|
| FR2963159A1 (en) | 2012-01-27 |
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