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FR2963159B1 - METHODS OF FORMING BOUND SEMICONDUCTOR STRUCTURES, AND SEMICONDUCTOR STRUCTURES FORMED THEREFROM - Google Patents

METHODS OF FORMING BOUND SEMICONDUCTOR STRUCTURES, AND SEMICONDUCTOR STRUCTURES FORMED THEREFROM Download PDF

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Publication number
FR2963159B1
FR2963159B1 FR1055965A FR1055965A FR2963159B1 FR 2963159 B1 FR2963159 B1 FR 2963159B1 FR 1055965 A FR1055965 A FR 1055965A FR 1055965 A FR1055965 A FR 1055965A FR 2963159 B1 FR2963159 B1 FR 2963159B1
Authority
FR
France
Prior art keywords
semiconductor structures
methods
formed therefrom
forming bound
structures formed
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
FR1055965A
Other languages
French (fr)
Other versions
FR2963159A1 (en
Inventor
Mariam Sadaka
Ionut Radu
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Soitec SA
Original Assignee
Soitec SA
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Soitec SA filed Critical Soitec SA
Priority to FR1055965A priority Critical patent/FR2963159B1/en
Priority to SG2011042017A priority patent/SG177816A1/en
Priority to TW100121505A priority patent/TWI464810B/en
Priority to KR1020110060306A priority patent/KR101238732B1/en
Priority to CN201110197168.2A priority patent/CN102339768B/en
Publication of FR2963159A1 publication Critical patent/FR2963159A1/en
Application granted granted Critical
Publication of FR2963159B1 publication Critical patent/FR2963159B1/en
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • H10P72/74
    • H10W90/00
    • H10P72/7416
    • H10P72/7434
    • H10W74/15
    • H10W90/297
    • H10W90/722
    • H10W90/732
FR1055965A 2010-07-15 2010-07-21 METHODS OF FORMING BOUND SEMICONDUCTOR STRUCTURES, AND SEMICONDUCTOR STRUCTURES FORMED THEREFROM Active FR2963159B1 (en)

Priority Applications (5)

Application Number Priority Date Filing Date Title
FR1055965A FR2963159B1 (en) 2010-07-21 2010-07-21 METHODS OF FORMING BOUND SEMICONDUCTOR STRUCTURES, AND SEMICONDUCTOR STRUCTURES FORMED THEREFROM
SG2011042017A SG177816A1 (en) 2010-07-15 2011-06-09 Methods of forming bonded semiconductor structures, and semiconductor structures formed by such methods
TW100121505A TWI464810B (en) 2010-07-15 2011-06-20 Method of forming a bonded semiconductor structure and semiconductor structure formed by the method
KR1020110060306A KR101238732B1 (en) 2010-07-15 2011-06-21 Methods of forming bonded semiconductor structures, and semiconductor structures formed by such methods
CN201110197168.2A CN102339768B (en) 2010-07-15 2011-07-14 Methods of forming bonded semiconductor structures, and semiconductor structures formed by such methods

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
FR1055965 2010-07-21
FR1055965A FR2963159B1 (en) 2010-07-21 2010-07-21 METHODS OF FORMING BOUND SEMICONDUCTOR STRUCTURES, AND SEMICONDUCTOR STRUCTURES FORMED THEREFROM

Publications (2)

Publication Number Publication Date
FR2963159A1 FR2963159A1 (en) 2012-01-27
FR2963159B1 true FR2963159B1 (en) 2018-01-19

Family

ID=43735073

Family Applications (1)

Application Number Title Priority Date Filing Date
FR1055965A Active FR2963159B1 (en) 2010-07-15 2010-07-21 METHODS OF FORMING BOUND SEMICONDUCTOR STRUCTURES, AND SEMICONDUCTOR STRUCTURES FORMED THEREFROM

Country Status (1)

Country Link
FR (1) FR2963159B1 (en)

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2781925B1 (en) * 1998-07-30 2001-11-23 Commissariat Energie Atomique SELECTIVE TRANSFER OF ELEMENTS FROM ONE MEDIUM TO ANOTHER MEDIUM
US6902987B1 (en) * 2000-02-16 2005-06-07 Ziptronix, Inc. Method for low temperature bonding and bonded structure
AU2003297542A1 (en) * 2002-12-31 2004-07-29 Massachusetts Institute Of Technology Method of forming a multi-layer semiconductor structure incorporating a processing handle member
FR2880189B1 (en) * 2004-12-24 2007-03-30 Tracit Technologies Sa METHOD FOR DEFERRING A CIRCUIT ON A MASS PLAN
JP5512102B2 (en) * 2007-08-24 2014-06-04 本田技研工業株式会社 Semiconductor device

Also Published As

Publication number Publication date
FR2963159A1 (en) 2012-01-27

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