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FR2943175B1 - Procede de fabrication d'une unite electronique et l'unite electronique obtenue - Google Patents

Procede de fabrication d'une unite electronique et l'unite electronique obtenue

Info

Publication number
FR2943175B1
FR2943175B1 FR1051674A FR1051674A FR2943175B1 FR 2943175 B1 FR2943175 B1 FR 2943175B1 FR 1051674 A FR1051674 A FR 1051674A FR 1051674 A FR1051674 A FR 1051674A FR 2943175 B1 FR2943175 B1 FR 2943175B1
Authority
FR
France
Prior art keywords
electronic unit
manufacturing
unit obtained
electronic
unit
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
FR1051674A
Other languages
English (en)
Other versions
FR2943175A1 (fr
Inventor
Manuela Schmidt
Axel Franke
Sven Zinober
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Robert Bosch GmbH
Original Assignee
Robert Bosch GmbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Robert Bosch GmbH filed Critical Robert Bosch GmbH
Publication of FR2943175A1 publication Critical patent/FR2943175A1/fr
Application granted granted Critical
Publication of FR2943175B1 publication Critical patent/FR2943175B1/fr
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • H10W90/00—
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
    • B81C1/00—Manufacture or treatment of devices or systems in or on a substrate
    • B81C1/00015—Manufacture or treatment of devices or systems in or on a substrate for manufacturing microsystems
    • B81C1/00222—Integrating an electronic processing unit with a micromechanical structure
    • B81C1/0023—Packaging together an electronic processing unit die and a micromechanical structure die
    • H10W90/297—
    • H10W90/722—
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49204—Contact or terminal manufacturing
    • Y10T29/49208—Contact or terminal manufacturing by assembling plural parts

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
FR1051674A 2009-03-11 2010-03-09 Procede de fabrication d'une unite electronique et l'unite electronique obtenue Expired - Fee Related FR2943175B1 (fr)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE102009001461A DE102009001461A1 (de) 2009-03-11 2009-03-11 Verfahren zur Herstellung einer elektronischen Baugruppe

Publications (2)

Publication Number Publication Date
FR2943175A1 FR2943175A1 (fr) 2010-09-17
FR2943175B1 true FR2943175B1 (fr) 2017-12-22

Family

ID=42557605

Family Applications (1)

Application Number Title Priority Date Filing Date
FR1051674A Expired - Fee Related FR2943175B1 (fr) 2009-03-11 2010-03-09 Procede de fabrication d'une unite electronique et l'unite electronique obtenue

Country Status (4)

Country Link
US (1) US8520396B2 (fr)
CN (1) CN101840867B (fr)
DE (1) DE102009001461A1 (fr)
FR (1) FR2943175B1 (fr)

Families Citing this family (34)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9116160B2 (en) 2009-11-25 2015-08-25 Siemens Aktiengesellschaft Method and arrangement for gas chromatographic analysis of a gas sample
US8482111B2 (en) 2010-07-19 2013-07-09 Tessera, Inc. Stackable molded microelectronic packages
KR101128063B1 (ko) 2011-05-03 2012-04-23 테세라, 인코포레이티드 캡슐화 층의 표면에 와이어 본드를 구비하는 패키지 적층형 어셈블리
US11830845B2 (en) 2011-05-03 2023-11-28 Tessera Llc Package-on-package assembly with wire bonds to encapsulation surface
US8404520B1 (en) 2011-10-17 2013-03-26 Invensas Corporation Package-on-package assembly with wire bond vias
US8803262B2 (en) * 2012-01-17 2014-08-12 Rosemount Aerospace Inc. Die attach stress isolation
US9695036B1 (en) * 2012-02-02 2017-07-04 Sitime Corporation Temperature insensitive resonant elements and oscillators and methods of designing and manufacturing same
US8946757B2 (en) 2012-02-17 2015-02-03 Invensas Corporation Heat spreading substrate with embedded interconnects
DE102012207296A1 (de) 2012-05-02 2013-11-07 Robert Bosch Gmbh Elektrische Durchkontaktierung mit mechanischer Dämpfung
US8835228B2 (en) 2012-05-22 2014-09-16 Invensas Corporation Substrate-less stackable package with wire-bond interconnect
US9502390B2 (en) 2012-08-03 2016-11-22 Invensas Corporation BVA interposer
DE102012213804A1 (de) 2012-08-03 2014-02-06 Robert Bosch Gmbh Belastungsminimierende elektrische Durchkontaktierung
CN104244152B (zh) * 2013-06-13 2018-11-06 无锡芯奥微传感技术有限公司 微机电系统麦克风封装及封装方法
US9167710B2 (en) 2013-08-07 2015-10-20 Invensas Corporation Embedded packaging with preformed vias
US20150076714A1 (en) 2013-09-16 2015-03-19 Invensas Corporation Microelectronic element with bond elements to encapsulation surface
US9379074B2 (en) 2013-11-22 2016-06-28 Invensas Corporation Die stacks with one or more bond via arrays of wire bond wires and with one or more arrays of bump interconnects
US9583456B2 (en) 2013-11-22 2017-02-28 Invensas Corporation Multiple bond via arrays of different wire heights on a same substrate
US9583411B2 (en) 2014-01-17 2017-02-28 Invensas Corporation Fine pitch BVA using reconstituted wafer with area array accessible for testing
US10381326B2 (en) 2014-05-28 2019-08-13 Invensas Corporation Structure and method for integrated circuits packaging with increased density
DE102014211188A1 (de) * 2014-06-12 2015-12-17 Robert Bosch Gmbh Vertikal hybrid integriertes Bauteil mit Interposer zur Stressentkopplung einer MEMS-Struktur und Verfahren zu dessen Herstellung
US9888579B2 (en) 2015-03-05 2018-02-06 Invensas Corporation Pressing of wire bond wire tips to provide bent-over tips
FR3034219B1 (fr) * 2015-03-23 2018-04-06 Safran Electronics & Defense Carte electronique de fond de panier et calculateur electronique associe
US9502372B1 (en) 2015-04-30 2016-11-22 Invensas Corporation Wafer-level packaging using wire bond wires in place of a redistribution layer
DE102015214873A1 (de) 2015-08-04 2017-02-09 Zf Friedrichshafen Ag Stecker mit Medienbarriere und Verfahren zur Herstellung eines Steckers
US10490528B2 (en) 2015-10-12 2019-11-26 Invensas Corporation Embedded wire bond wires
US9490222B1 (en) 2015-10-12 2016-11-08 Invensas Corporation Wire bond wires for interference shielding
US10332854B2 (en) 2015-10-23 2019-06-25 Invensas Corporation Anchoring structure of fine pitch bva
US10181457B2 (en) 2015-10-26 2019-01-15 Invensas Corporation Microelectronic package for wafer-level chip scale packaging with fan-out
US10043779B2 (en) 2015-11-17 2018-08-07 Invensas Corporation Packaged microelectronic device for a package-on-package device
US9984992B2 (en) 2015-12-30 2018-05-29 Invensas Corporation Embedded wire bond wires for vertical integration with separate surface mount and wire bond mounting surfaces
US9935075B2 (en) 2016-07-29 2018-04-03 Invensas Corporation Wire bonding method and apparatus for electromagnetic interference shielding
CN106744646A (zh) * 2016-12-20 2017-05-31 苏州晶方半导体科技股份有限公司 Mems芯片封装结构以及封装方法
US10299368B2 (en) 2016-12-21 2019-05-21 Invensas Corporation Surface integrated waveguides and circuit structures therefor
FR3095284B1 (fr) * 2019-04-19 2022-06-24 Smart Packaging Solutions Module électronique pour carte à puce comprenant un écran d’affichage

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5239448A (en) * 1991-10-28 1993-08-24 International Business Machines Corporation Formulation of multichip modules
US6406939B1 (en) 1998-05-02 2002-06-18 Charles W. C. Lin Flip chip assembly with via interconnection
US7042077B2 (en) * 2004-04-15 2006-05-09 Intel Corporation Integrated circuit package with low modulus layer and capacitor/interposer

Also Published As

Publication number Publication date
FR2943175A1 (fr) 2010-09-17
CN101840867A (zh) 2010-09-22
US20100232119A1 (en) 2010-09-16
DE102009001461A1 (de) 2010-09-16
US8520396B2 (en) 2013-08-27
CN101840867B (zh) 2014-11-05

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