FR2895571B1 - Procede de realisation d'une jonction pn electroluminescente en materiau semi-conducteur par collage moleculaire - Google Patents
Procede de realisation d'une jonction pn electroluminescente en materiau semi-conducteur par collage moleculaireInfo
- Publication number
- FR2895571B1 FR2895571B1 FR0554117A FR0554117A FR2895571B1 FR 2895571 B1 FR2895571 B1 FR 2895571B1 FR 0554117 A FR0554117 A FR 0554117A FR 0554117 A FR0554117 A FR 0554117A FR 2895571 B1 FR2895571 B1 FR 2895571B1
- Authority
- FR
- France
- Prior art keywords
- electroluminescent
- junction
- producing
- semiconductor material
- molecular bonding
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 238000004519 manufacturing process Methods 0.000 title 1
- 239000000463 material Substances 0.000 title 1
- 239000004065 semiconductor Substances 0.000 title 1
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/01—Manufacture or treatment
- H10H20/011—Manufacture or treatment of bodies, e.g. forming semiconductor layers
- H10H20/018—Bonding of wafers
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/01—Manufacture or treatment
- H10H20/011—Manufacture or treatment of bodies, e.g. forming semiconductor layers
- H10H20/014—Manufacture or treatment of bodies, e.g. forming semiconductor layers having light-emitting regions comprising only Group IV materials
Priority Applications (5)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| FR0554117A FR2895571B1 (fr) | 2005-12-28 | 2005-12-28 | Procede de realisation d'une jonction pn electroluminescente en materiau semi-conducteur par collage moleculaire |
| PCT/EP2006/070209 WO2007074152A1 (fr) | 2005-12-28 | 2006-12-26 | Procede de realisation d'une jonction pn electroluminescente en materiau semi-conducteur par collage moleculaire |
| US12/158,050 US20080315213A1 (en) | 2005-12-28 | 2006-12-26 | Process for Producing an Electroluminescent P-N Junction Made of a Semiconductor Material by Molecular Bonding |
| EP06841620A EP1966818A1 (fr) | 2005-12-28 | 2006-12-26 | Procede de realisation d'une jonction pn electroluminescente en materiau semi-conducteur par collage moleculaire |
| JP2008547955A JP2009522759A (ja) | 2005-12-28 | 2006-12-26 | 分子結合によって半導体材料でできたエレクトロルミネセントp−n接合を作製する方法 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| FR0554117A FR2895571B1 (fr) | 2005-12-28 | 2005-12-28 | Procede de realisation d'une jonction pn electroluminescente en materiau semi-conducteur par collage moleculaire |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| FR2895571A1 FR2895571A1 (fr) | 2007-06-29 |
| FR2895571B1 true FR2895571B1 (fr) | 2008-04-18 |
Family
ID=37038308
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| FR0554117A Expired - Fee Related FR2895571B1 (fr) | 2005-12-28 | 2005-12-28 | Procede de realisation d'une jonction pn electroluminescente en materiau semi-conducteur par collage moleculaire |
Country Status (5)
| Country | Link |
|---|---|
| US (1) | US20080315213A1 (fr) |
| EP (1) | EP1966818A1 (fr) |
| JP (1) | JP2009522759A (fr) |
| FR (1) | FR2895571B1 (fr) |
| WO (1) | WO2007074152A1 (fr) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7749875B2 (en) * | 2007-02-16 | 2010-07-06 | Infineon Technologies Ag | Method of manufacturing a semiconductor element and semiconductor element |
| FR3040108B1 (fr) * | 2015-08-12 | 2017-08-11 | Commissariat Energie Atomique | Procede de fabrication d'une structure semi-conductrice avec collage direct temporaire exploitant une couche poreuse |
| CN107180756B (zh) | 2016-03-11 | 2020-05-05 | 胜高股份有限公司 | pn接合硅晶片的制造方法 |
Family Cites Families (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH02183510A (ja) * | 1989-01-10 | 1990-07-18 | Sony Corp | 半導体用基板の製法 |
| TW289837B (fr) * | 1994-01-18 | 1996-11-01 | Hwelett Packard Co | |
| JPH07263721A (ja) * | 1994-03-25 | 1995-10-13 | Nippondenso Co Ltd | 半導体装置及びその製造方法 |
| JPH0964476A (ja) * | 1995-08-25 | 1997-03-07 | Fujitsu Ltd | 3次元量子閉じ込めを利用した半導体装置の製造方法 |
| FR2766620B1 (fr) * | 1997-07-22 | 2000-12-01 | Commissariat Energie Atomique | Realisation de microstructures ou de nanostructures sur un support |
| FR2819099B1 (fr) * | 2000-12-28 | 2003-09-26 | Commissariat Energie Atomique | Procede de realisation d'une structure empilee |
| JP3879604B2 (ja) * | 2002-07-02 | 2007-02-14 | 松下電器産業株式会社 | 半導体多層基板および半導体多層膜の製造方法 |
-
2005
- 2005-12-28 FR FR0554117A patent/FR2895571B1/fr not_active Expired - Fee Related
-
2006
- 2006-12-26 WO PCT/EP2006/070209 patent/WO2007074152A1/fr not_active Ceased
- 2006-12-26 EP EP06841620A patent/EP1966818A1/fr not_active Withdrawn
- 2006-12-26 JP JP2008547955A patent/JP2009522759A/ja active Pending
- 2006-12-26 US US12/158,050 patent/US20080315213A1/en not_active Abandoned
Also Published As
| Publication number | Publication date |
|---|---|
| FR2895571A1 (fr) | 2007-06-29 |
| JP2009522759A (ja) | 2009-06-11 |
| US20080315213A1 (en) | 2008-12-25 |
| EP1966818A1 (fr) | 2008-09-10 |
| WO2007074152A1 (fr) | 2007-07-05 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| ST | Notification of lapse |
Effective date: 20120831 |